JPS63201336U - - Google Patents
Info
- Publication number
- JPS63201336U JPS63201336U JP9360187U JP9360187U JPS63201336U JP S63201336 U JPS63201336 U JP S63201336U JP 9360187 U JP9360187 U JP 9360187U JP 9360187 U JP9360187 U JP 9360187U JP S63201336 U JPS63201336 U JP S63201336U
- Authority
- JP
- Japan
- Prior art keywords
- pair
- electrodes
- ring
- semiconductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図は発明の一実施例を示す縦断面図、第２
図は従来装置か縦断面図である。
図において、１は半導体素子、２は電極、３０
は環状絶縁物、４０は波状フランジ、７０はロー
材、６０は弾性樹脂、３０ａ，４０ｃはねじ部で
ある。なお、各図中同一符号は同一、又は相当部
分を示す。
Fig. 1 is a vertical cross-sectional view showing one embodiment of the invention;
The figure is a longitudinal sectional view of a conventional device. In the figure, 1 is a semiconductor element, 2 is an electrode, and 30
40 is an annular insulator, 40 is a wavy flange, 70 is a brazing material, 60 is an elastic resin, and 30a and 40c are threaded portions. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
体素子の両端を一対の電極で挾持し、上記一対の
電極の夫々と上記環状絶縁物の各端とを封止する
一対のフランジを備えた半導体装置において、上
記一対のフランジと上記環状絶縁物の各端とを螺
合させ、その螺合部を弾性樹脂で封止したことを
特徴とする半導体装置。 A semiconductor comprising a semiconductor element disposed within a ring-shaped insulator, both ends of the semiconductor element being held between a pair of electrodes, and a pair of flanges sealing each of the pair of electrodes and each end of the ring-shaped insulator. A semiconductor device, characterized in that the pair of flanges and each end of the annular insulator are screwed together, and the screwed portions are sealed with an elastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9360187U JPS63201336U (en) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9360187U JPS63201336U (en) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201336U true JPS63201336U (en) | 1988-12-26 |
Family
ID=30956315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9360187U Pending JPS63201336U (en) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201336U (en) |
-
1987
- 1987-06-17 JP JP9360187U patent/JPS63201336U/ja active Pending