JPH03283536A - Washing apparatus - Google Patents

Abstract

PURPOSE:To perfectly remove contamination by comprising an ultrasonic wave tank for washing objects with ultrasonic wave and a steam tank for washing objects with heated steam, being provided with a shower washing means for washing objects by spraying a new solvent after washing by steam of objects. CONSTITUTION:After a wafer as a washing object is washed by ultrasonic wave in an ultrasonic wave tank 1, the object is moved by a carrier 8 and transferred into an immersing tank 2 for washing by immersing. Thereafter, the object is washed by the steam in a steam tank 3, it is then moved into the spraying range of an organic solvent shower 9 with the carrier 8 and the wafer as washing object is spray-washed by spraying a new solvent. Thereby, contaminants floating on the surface of the organic solvent adhered to both sides of wafer can be removed perfectly. Namely, since the organic solvent shower 9 is provided at the upper part of the steam tank 3 and washing is carried out with a new solvent after contamination at the liquid surface of organic solvent adhered to objects is washed by the steam when the object is taken out, contaminants adhered on the object can be removed perfectly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device, and more particularly to a cleaning device capable of cleaning and removing organic matter on a wafer in the manufacturing process of semiconductor electronic components.

[Prior Art] As a conventional wafer cleaning apparatus of this type, there is one shown in FIG.

In the figure, this cleaning device is comprised of an ultrasonic tank 1, an infiltration tank 2, and a steam tank 3.

At the bottom of the ultrasonic tank l is a vibrator 1a that generates ultrasonic waves.
is provided so that an object to be cleaned, such as a wafer inserted and held in the carrier 8, can be immersed in the solvent 6 and subjected to ultrasonic cleaning. After cleaning the ultrasonic tank 1, the carrier 8 is moved by a moving means (not shown) to immerse the wafer, which is the object to be cleaned, into the solvent in the immersion tank 2 for cleaning. Thereafter, the wafer, which is the object to be cleaned, is steam cleaned in the steam bath 3. A heater 5 is disposed at the bottom of the steam tank 3, and the solvent 6 generates paper 7 by heating the heater 5. A wafer, which is an object to be cleaned, is steam-cleaned using this paper 7. This paper 7 is condensed and recovered by a cooling coil 4 disposed above the steam tank 3.

In a conventional cleaning device consisting of two configurations, first.

After a wafer, which is an object to be cleaned, is ultrasonically cleaned in an ultrasonic bath 1, the invasive material is cleaned in an immersion bath 2. Thereafter, it is steam cleaned in a steam tank 3.

[Problems to be Solved by the Invention] However, in the conventional cleaning apparatus, when the wafer to be cleaned is taken out from the ultrasonic bath 1 and the immersion bath 2, the organic solvent that is filled in each bath floats on the top surface. Since the dirt attached to the wafer adheres to the wafer, there is a drawback that even steam cleaning using the steam bath 3 cannot sufficiently remove the dirt.

[Means for Solving the Problems] The cleaning apparatus of the present invention includes an ultrasonic bath for cleaning objects to be cleaned with ultrasonic waves, and a steam bath for cleaning objects with heated steam, The apparatus is constructed to include a shower cleaning means for spraying fresh solvent onto the object to clean it after steam cleaning the object.

E Example] Next, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a configuration diagram showing an embodiment of the cleaning device of the present invention. In FIG. 1, parts having the same functions and configurations as those in FIG. 2 will be described using the same reference numerals.

In the figure, this cleaning device is comprised of an ultrasonic tank 1, an infiltration tank 2, and a steam tank 3.

At the bottom of the ultrasonic tank 1 is a vibrator 1a that generates ultrasonic waves.
is provided so that an object to be cleaned, such as a wafer inserted and held in the carrier 8, can be immersed in the solvent 6 and subjected to ultrasonic cleaning. After cleaning the ultrasonic tank 1, the carrier 8 moves to immerse the wafer, which is the object to be cleaned, into the solvent in the immersion tank 2 for cleaning. Thereafter, the wafer, which is the object to be cleaned, is steam cleaned in the steam bath 3. A heater 5 is disposed at the bottom of the steam tank 3, and the solvent 6 generates paper 7 by heating the heater 5.

A wafer, which is an object to be cleaned, is steam-cleaned using this paper 7. This pepper 7 is condensed and recovered by a cooling coil 4 disposed above the steam tank 3. An organic solvent shower 9 is disposed above the steam tank 3, and the shower 9 is configured to spray fresh solvent onto the object held in the carrier 8 for spray cleaning.

The operation of the cleaning device having the above configuration will be explained.

First, a wafer, which is an object to be cleaned, is ultrasonically cleaned in an ultrasonic tank 1, and then the object to be cleaned is moved by a carrier 8, and the invasion is cleaned in an invasion tank 2. Thereafter, after steam cleaning in the steam tank 3, the wafer is moved by the carrier 8 into the spout range of the organic solvent shower 9, and a new solvent is spouted onto the wafer to be cleaned, thereby spray cleaning the wafer. By doing so, it is possible to completely remove dirt floating on the surface of the organic solvent adhering to both surfaces of the wafer.

[Effects of the Invention] As explained above, in the present invention, since an organic solvent shower is provided at the top of the steam tank, dirt on the organic solvent liquid surface adhering to the object to be cleaned can be checked after steam cleaning when the object to be cleaned is taken out. Since cleaning is performed with a fresh solvent after the cleaning process, dirt adhering to the object to be cleaned can be completely removed.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the configuration of a cleaning device according to an embodiment of the present invention, and FIG. 2 is a diagram showing the configuration of a conventional cleaning device. l... Ultrasonic bath, la... Vibrator, 2... Immersion tank, 3... Steam tank, 4... Cooling coil, 5... Heater, 6... Solvent, 7・・・Paper, 8...Carrier, 9...Organic solvent shower

Claims (1)

[Claims] A cleaning device that cleans an object to be cleaned using an organic solvent, the cleaning device includes at least an ultrasonic bath that cleans the object to be cleaned with ultrasonic waves, and a steam bath that cleans the object with heated steam, A cleaning device characterized in that the tank includes a shower cleaning means for spraying fresh solvent onto the object to be cleaned after steam cleaning the object.