JP2002049144A - Substrate end face cleaning device - Google Patents
Substrate end face cleaning deviceInfo
- Publication number
- JP2002049144A JP2002049144A JP2000238176A JP2000238176A JP2002049144A JP 2002049144 A JP2002049144 A JP 2002049144A JP 2000238176 A JP2000238176 A JP 2000238176A JP 2000238176 A JP2000238176 A JP 2000238176A JP 2002049144 A JP2002049144 A JP 2002049144A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning
- face
- brush
- cleaning apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 114
- 238000004140 cleaning Methods 0.000 title claims abstract description 70
- 238000005201 scrubbing Methods 0.000 claims abstract description 7
- 239000003599 detergent Substances 0.000 abstract 1
- 239000012459 cleaning agent Substances 0.000 description 8
- 239000000356 contaminant Substances 0.000 description 8
- 238000011109 contamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、半導体装置の製造
過程で利用されているフォトリソグラフイーに用いられ
るフォトマスク等の基板端面を洗浄するための洗浄装置
の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a cleaning apparatus for cleaning an end face of a substrate such as a photomask used for photolithography used in a manufacturing process of a semiconductor device.
【0002】[0002]
【従来の技術】従来の半導体装置の製造に用いられるフ
ォトマスクの洗浄装置は、スクラブ洗浄を行なう場合
に、フォトマスクの表面(回路パターンが形成されてい
るメインパターン部が存在する面)および裏面を洗浄す
る方式の装置が使用されている。しかしながら、フォト
マスクにおいて最も多く汚染物質が付着している部分
は、フォトマスクを搬送する際に搬送用ベルト等に直接
接触する端面である、ということが最近知られるように
なってきた。2. Description of the Related Art A conventional photomask cleaning apparatus used in the manufacture of a semiconductor device uses a photomask front surface (a surface on which a main pattern portion on which a circuit pattern is formed) and a rear surface when performing scrub cleaning. Is used. However, it has recently become known that the portion of the photomask to which the most contaminants are attached is the end face that directly contacts a transport belt or the like when transporting the photomask.
【0003】通常、フォトマスクの端面を洗浄する場合
には、フォトマスクの洗浄剤が満たされた洗浄槽にフォ
トマスクを浸漬して洗浄する、いわゆる浸漬洗浄法が用
いられている。しかし、この方法では、端面もメインパ
ターン部も同時に同一の洗浄槽の中に浸漬されるため
に、端面から離れた汚染物質がメインパターン部に移行
して再付着することにより、かえってメインパターン部
を汚染してしまうことがある。In general, when cleaning the end face of a photomask, a so-called immersion cleaning method is used in which the photomask is immersed in a cleaning tank filled with a cleaning agent for the photomask for cleaning. However, in this method, since both the end face and the main pattern portion are immersed in the same cleaning tank at the same time, contaminants separated from the end face migrate to the main pattern portion and adhere again, so that the main pattern portion is rather removed. May be contaminated.
【0004】この問題を解消するために、近年、基板の
端面のみを洗浄する目的で、図4に示すような基板端面
洗浄装置が使用されている。図4において、200は基
板端面洗浄装置、111はスクラブ用ブラシ、121は
基板、112はスクラブ用ブラシの回転方向、122は
基板の移動方向を示す。すなわち、この構造の洗浄装置
では、スクラブ用ブラシ111の軸方向は、基板の端面
(辺)に対して直角に配置されている。In order to solve this problem, a substrate edge cleaning apparatus as shown in FIG. 4 has recently been used for cleaning only the edge of the substrate. In FIG. 4, reference numeral 200 denotes a substrate end surface cleaning apparatus, 111 denotes a scrub brush, 121 denotes a substrate, 112 denotes a rotation direction of the scrub brush, and 122 denotes a moving direction of the substrate. That is, in the cleaning device having this structure, the axial direction of the scrub brush 111 is arranged at right angles to the end surface (side) of the substrate.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、この構
造の洗浄装置は、スクラブ用ブラシ111を回転し、基
板の端面に沿って移動させながら洗浄を行なうために、
洗浄が終了するまでに要する時間が長くかかるという問
題点を有する。本発明は、上記問題点に鑑み考案された
もので、洗浄に要する時間を短縮し、しかも、フォトマ
スク等のメインパターン部及び裏面を汚染することがな
いような基板端面洗浄装置を提供することを目的とす
る。However, in the cleaning apparatus having this structure, the cleaning is performed while rotating the scrub brush 111 and moving it along the end face of the substrate.
There is a problem that it takes a long time to complete the cleaning. The present invention has been devised in view of the above problems, and provides a substrate end surface cleaning apparatus that reduces the time required for cleaning and does not contaminate a main pattern portion and a back surface of a photomask or the like. With the goal.
【0006】[0006]
【課題を解決するための手段】本発明において上記課題
を達成するために、請求項1においては、スクラブ用ブ
ラシと、基板固定用アームと、基板回転用チャックとを
少なくとも備えており、前記スクラブ用ブラシの軸方向
は、基板の端面(辺)に対して平行に配置されているこ
とを特徴とする基板端面洗浄装置としたものである。こ
の基板端面洗浄装置によれば、スクラブ用ブラシを、そ
の軸方向が基板の端面(辺)と平行になるように設置し
てあるので、洗浄に要する時間を大幅に短縮することが
できる。To achieve the above object, the present invention provides at least a scrub brush, a substrate fixing arm, and a substrate rotating chuck, wherein the scrub brush is provided. An axial direction of the brush is arranged in parallel with an end surface (side) of the substrate, and is a substrate end surface cleaning device. According to this substrate end surface cleaning apparatus, the scrub brush is installed so that the axial direction thereof is parallel to the end surface (side) of the substrate, so that the time required for cleaning can be greatly reduced.
【0007】また、請求項2においては、請求項1に記
載の基板端面洗浄装置において、基板の向かい合う両端
面(辺)を同時に洗浄することができるように、2本の
前記スクラブ用ブラシが平行に配置されていることを特
徴とする基板端面洗浄装置としたものである。この基板
端面洗浄装置によれば、スクラブ用ブラシが2本設置さ
れており、2つの端面を同時に洗浄することができるの
で、洗浄に要する時間をさらに短縮することができる。According to a second aspect of the present invention, in the substrate edge cleaning apparatus according to the first aspect, the two scrub brushes are arranged in parallel so that opposite end faces (sides) of the substrate can be simultaneously cleaned. And a substrate end surface cleaning apparatus characterized in that the apparatus is disposed on a substrate edge cleaning apparatus. According to this substrate end face cleaning apparatus, two scrub brushes are provided, and two end faces can be cleaned at the same time, so that the time required for cleaning can be further reduced.
【0008】また、請求項3においては、請求項1また
は請求項2に記載の基板端面洗浄装置において、ブラシ
リンス用シャワーノズルを有することを特徴とする基板
端面洗浄装置としたものである。この基板端面洗浄装置
によれば、ブラシリンス用シャワーノズルより洗浄剤が
スクラブ用ブラシに噴射されながら、基板の端面をスク
ラブするので、基板の端面に付着している汚染物質を、
より確実に端面から除去することができる。According to a third aspect of the present invention, there is provided the substrate edge cleaning apparatus according to the first or second aspect, further comprising a shower nozzle for brush rinsing. According to this substrate end surface cleaning apparatus, the cleaning agent is scrubbed on the scrub brush while the cleaning agent is sprayed from the shower nozzle for brush rinsing, so that the contaminants adhering to the end surface of the substrate are removed.
It can be more reliably removed from the end face.
【0009】さらにまた、請求項4においては、請求項
1または請求項3のいずれか1項に記載の基板端面洗浄
装置において、基板リンス用シャワーノズルを有するこ
とを特徴とする基板端面洗浄装置としたものである。こ
の基板端面洗浄装置によれば、基板リンス用シャワーノ
ズルより洗浄剤をマスク表裏面に噴射しているので、ス
クラブ用ブラシにより端面から除去された汚染物質が即
座に洗い流され、例えばフォトマスク等のメインパター
ン部及び裏面の汚染を防止することができる。According to a fourth aspect of the present invention, there is provided a substrate edge cleaning apparatus according to any one of the first to third aspects, further comprising a substrate rinsing shower nozzle. It was done. According to this substrate edge cleaning device, the cleaning agent is sprayed from the substrate rinsing shower nozzle onto the front and back surfaces of the mask, so that the contaminants removed from the edge by the scrub brush are immediately washed away, and, for example, a photomask or the like is used. Contamination of the main pattern portion and the back surface can be prevented.
【0010】[0010]
【発明の実施の形態】図1は、本発明に係る基板端面洗
浄装置におけるスクラブ用ブラシ11と基板71の位置
関係を示す部分構成概観図である。図1において、10
0aは基板端面洗浄装置100の部分構成概観図、11
はスクラブ用ブラシ、71は基板、12はスクラブ用ブ
ラシの回転方向、72は基板の移動方向を示す。すなわ
ち、この構造の洗浄装置では、スクラブ用ブラシ11の
軸方向は基板72の端面(辺)に対して平行に配置され
ている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view showing a partial configuration of a scrub brush 11 and a substrate 71 in a substrate edge cleaning apparatus according to the present invention. In FIG. 1, 10
0a is a schematic view of a partial configuration of the substrate edge cleaning apparatus 100,
Denotes a scrub brush, 71 denotes a substrate, 12 denotes a rotating direction of the scrub brush, and 72 denotes a moving direction of the substrate. That is, in the cleaning device having this structure, the axial direction of the scrub brush 11 is arranged parallel to the end face (side) of the substrate 72.
【0011】図2〜図3は、本発明の基板端面洗浄装置
100を用いて基板端面の洗浄を行っているときの基板
端面洗浄装置100の概要を示す構成概観図である。図
2は被洗浄物である基板71を載置していない待機中の
基板端面洗浄装置の状態を、図3(b)は被洗浄物であ
る基板71端面の洗浄を実施している実施中の基板端面
洗浄装置の状態をそれぞれ示す。FIGS. 2 and 3 are schematic structural views showing the outline of the substrate edge cleaning apparatus 100 when cleaning the substrate edge using the substrate edge cleaning apparatus 100 of the present invention. FIG. 2 shows a state of the substrate edge cleaning apparatus in a standby state where the substrate 71 to be cleaned is not mounted, and FIG. 3B shows a state in which the edge of the substrate 71 to be cleaned is being cleaned. 2 shows the state of the substrate edge cleaning apparatus.
【0012】図2は待機中の基板端面洗浄装置100を
示しており、スクラブ用ブラシ11は回転方向12で絶
えず回転しており、ブラシ自己洗浄用ノズル81より洗
浄液がシャワー状に絶えず吹き付けれられて待機してい
る。FIG. 2 shows the substrate edge cleaning apparatus 100 in a standby state, in which the scrub brush 11 is constantly rotating in the rotation direction 12, and the cleaning liquid is constantly sprayed from the brush self-cleaning nozzle 81 in a shower. Waiting.
【0013】図3(b)は被洗浄物である基板71端面
の洗浄を実施している基板端面洗浄装置の状態を示して
おり、まず、図3(a)に示すような基板固定用アーム
21に保持された基板71が所定位置に移動し、スクラ
ブ用ブラシ11のほぼ中心軸位置付近でセットされる。
次に、回転方向12に回転しているスクラブ用ブラシ1
1が基板71の端面まで移動すると同時に、洗浄剤がブ
ラシリンス用シャワーノズル41より基板端面とスクラ
ブ用ブラシ11にシャワー状に噴射され、一方の対向し
ている基板端面の洗浄が行われる。一方の対向している
基板端面の洗浄が終了した基板71は基板固定用アーム
21にて基板固定用チャック31に載置され、基板71
の保持が解除される。基板固定用チャック31が90度
回転したところで、再度基板固定用アーム21にて基板
71が保持され、スクラブ用ブラシ11のほぼ中心軸位
置付近まで移動し、他方の対向している基板端面の洗浄
が行われ、基板の端面に付着している汚染物質を、確実
に基板端面から除去することができる。FIG. 3B shows a state of the substrate edge cleaning apparatus for cleaning the edge of the substrate 71 which is the object to be cleaned. First, a substrate fixing arm as shown in FIG. The substrate 71 held by 21 moves to a predetermined position, and is set near the center axis position of the scrub brush 11.
Next, the scrub brush 1 rotating in the rotation direction 12
At the same time as 1 moves to the end face of the substrate 71, the cleaning agent is sprayed from the shower nozzle 41 for brush rinsing to the end face of the substrate and the scrub brush 11 in a shower shape, and one of the opposing end faces of the substrate is cleaned. The substrate 71 whose one end face of the opposing substrate has been cleaned is placed on the substrate fixing chuck 31 by the substrate fixing arm 21 and the substrate 71 is removed.
Is released. When the substrate fixing chuck 31 is rotated by 90 degrees, the substrate 71 is again held by the substrate fixing arm 21, moved to near the center axis position of the scrub brush 11, and the other opposing substrate end face is cleaned. Is performed, and contaminants adhering to the end face of the substrate can be reliably removed from the end face of the substrate.
【0014】さらに、基板端面洗浄中は基板リンス用シ
ャワーノズル51及び61より洗浄剤が基板表裏面にシ
ャワー状に噴射されており、スクラブ用ブラシ11によ
り基板端面から除去された汚染物質が即座に洗い流され
て、例えばフォトマスク等のメインパターン及び裏面の
汚染を防止することができる。Further, during the cleaning of the substrate end surface, the cleaning agent is sprayed onto the front and back surfaces of the substrate from the substrate rinsing shower nozzles 51 and 61 in a shower shape, so that the contaminants removed from the substrate end surface by the scrub brush 11 are immediately. By being washed away, contamination of the main pattern such as a photomask and the back surface can be prevented.
【0015】4方向の基板端面洗浄が終了した基板71
は基板固定用アーム21にて所定の場所に移動され、さ
らに、別の基板71が供給されて基板端面洗浄装置10
0にて基板端面の洗浄が順次繰り返される。Substrate 71 for which substrate edge cleaning in four directions has been completed
Is moved to a predetermined place by the substrate fixing arm 21, and another substrate 71 is supplied to the substrate edge cleaning device 10.
At 0, the cleaning of the substrate end face is sequentially repeated.
【0016】[0016]
【発明の効果】本発明の基板端面洗浄装置は以上の構成
であるから、下記に示す如き効果がある。スクラブ用ブ
ラシの軸方向が基板の端面(辺)と平行になるように2
本設置されており、2つの端面を同時に洗浄することが
できるので、洗浄に要する時間を大幅に短縮することが
できる。また、ブラシリンス用シャワーノズルより洗浄
剤がスクラブ用ブラシに噴射されながら、基板の端面を
スクラブするので、基板の端面に付着している汚染物質
を、より確実に端面から除去することができる。さらに
また、基板リンス用シャワーノズルより洗浄剤をマスク
表裏面に噴射しているので、スクラブ用ブラシにより端
面から除去された汚染物質が即座に洗い流され、例えば
フォトマスク等のメインパターン部及び裏面の汚染を防
止することができる。Since the substrate edge cleaning apparatus of the present invention has the above-described structure, it has the following effects. 2 so that the axial direction of the scrub brush is parallel to the end face (side) of the substrate.
Since this is installed and two end faces can be cleaned at the same time, the time required for cleaning can be greatly reduced. In addition, since the end face of the substrate is scrubbed while the cleaning agent is sprayed from the shower nozzle for brush rinse onto the scrub brush, contaminants attached to the end face of the substrate can be more reliably removed from the end face. Furthermore, since the cleaning agent is sprayed onto the front and back surfaces of the mask from the substrate rinsing shower nozzle, the contaminants removed from the end surfaces by the scrub brush are immediately washed away, for example, the main pattern portion such as a photomask and the back surface. Pollution can be prevented.
【図1】本発明の基板端面洗浄装置におけるスクラブ用
ブラシと基板の位置関係を示す部分構成概観図である。FIG. 1 is an outline view of a partial configuration showing a positional relationship between a scrub brush and a substrate in a substrate edge cleaning apparatus of the present invention.
【図2】基板を載置していない待機状態を示す本発明の
基板端面洗浄装置の構成概観図である。FIG. 2 is a schematic structural view of the substrate edge cleaning apparatus of the present invention, showing a standby state in which no substrate is mounted.
【図3】(a)は、基板が基板固定用アームに保持され
てスクラブ用ブラシの間にセットされている状態を示す
本発明の基板端面洗浄装置の部分構成概観図である。
(b)は、基板端面の洗浄状態を示す本発明の基板端面
洗浄装置の構成概観図である。FIG. 3A is a schematic view of a partial configuration of a substrate edge cleaning apparatus of the present invention, showing a state in which a substrate is held by a substrate fixing arm and set between scrub brushes.
(B) is a schematic view of the configuration of the substrate edge cleaning apparatus of the present invention, showing a cleaning state of the substrate edge.
【図4】従来の基板端面洗浄装置におけるスクラブ用ブ
ラシと基板の位置関係を示す部分構成概観図である。FIG. 4 is a partial schematic view showing a positional relationship between a scrub brush and a substrate in a conventional substrate end surface cleaning apparatus.
11、111……スクラブ用ブラシ 12、112……ブラシの回転方向 21……基板固定用アーム 31……基板固定用チャック 41……ブラシリンス用シャワーノズル 42、82……洗浄シャワー 51、61……基板リンス用シャワーノズル 52、62……リンスシャワー 71、121……基板 72、122……基板の移動方向 81……ブラシ自己洗浄ノズル 100……本発明の基板端面洗浄装置 100a……スクラブ用ブラシと基板の位置関係を示す
基板端面洗浄装置 100b……基板と基板固定用アームとスクラブ用ブラ
シの位置関係を示す基板端面洗浄装置 200……従来の基板端面洗浄装置11, a brush for scrubbing 12, a rotating direction of a brush 21, an arm for fixing a substrate 31, a chuck for fixing a substrate 41, a shower nozzle for brush rinsing 42, 82, a cleaning shower 51, 61 ... shower nozzles for substrate rinsing 52, 62 ... rinsing showers 71, 121 ... substrate 72, 122 ... moving direction of substrate 81 ... brush self-cleaning nozzle 100 ... substrate edge cleaning device 100a of the present invention 100 for scrub Substrate edge cleaning device 100b showing positional relationship between brush and substrate 100b ... Substrate edge cleaning device 200 showing positional relationship between substrate, substrate fixing arm and scrub brush 200 ... Conventional substrate edge cleaning device
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 21/304 644 H01L 21/30 502P ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 644 H01L 21/30 502P
Claims (4)
と、基板回転用チャックとを少なくとも備えており、前
記スクラブ用ブラシの軸方向は、基板の端面(辺)に対
して平行に配置されていることを特徴とする基板端面洗
浄装置。1. A scrub brush, a substrate fixing arm, and a substrate rotating chuck, wherein the scrub brush has an axial direction parallel to an end surface (side) of the substrate. An apparatus for cleaning a substrate end face.
て、前記基板の向かい合う両端面(辺)を同時に洗浄す
ることができるように、2本の前記スクラブ用ブラシが
平行に配置されていることを特徴とする基板端面洗浄装
置。2. The scrubbing device according to claim 1, wherein two scrub brushes are arranged in parallel so that opposite end faces (sides) of the substrate can be washed at the same time. A substrate edge cleaning apparatus characterized by the above-mentioned.
洗浄装置において、ブラシリンス用シャワーノズルを有
することを特徴とする基板端面洗浄装置。3. The substrate edge cleaning apparatus according to claim 1, further comprising a shower nozzle for brush rinsing.
記載の基板端面洗浄装置において、基板リンス用シャワ
ーノズルを有することを特徴とする基板端面洗浄装置。4. A substrate edge cleaning apparatus according to claim 1, further comprising a shower nozzle for rinsing the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000238176A JP4507365B2 (en) | 2000-08-07 | 2000-08-07 | Substrate edge cleaning equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000238176A JP4507365B2 (en) | 2000-08-07 | 2000-08-07 | Substrate edge cleaning equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002049144A true JP2002049144A (en) | 2002-02-15 |
JP4507365B2 JP4507365B2 (en) | 2010-07-21 |
Family
ID=18729919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000238176A Expired - Fee Related JP4507365B2 (en) | 2000-08-07 | 2000-08-07 | Substrate edge cleaning equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4507365B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007053154A (en) * | 2005-08-16 | 2007-03-01 | Pre-Tech Co Ltd | Cleaning device for mask substrate, and cleaning method for mask substrate using the device |
JP2007294738A (en) * | 2006-04-26 | 2007-11-08 | Shin Etsu Chem Co Ltd | Device and method for cleaning substrate |
JP2008087135A (en) * | 2006-10-04 | 2008-04-17 | Nippon Electric Glass Co Ltd | End surface grinding device of glass substrate and end surface grinding method |
JP2009172514A (en) * | 2008-01-24 | 2009-08-06 | Toppan Forms Co Ltd | Cleaning apparatus |
JP2012216709A (en) * | 2011-04-01 | 2012-11-08 | Ulvac Japan Ltd | Processing apparatus and processing method |
JP2014042873A (en) * | 2012-08-27 | 2014-03-13 | Hoya Corp | Substrate manufacturing method, and substrate cleaning device |
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Cited By (6)
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JP2007053154A (en) * | 2005-08-16 | 2007-03-01 | Pre-Tech Co Ltd | Cleaning device for mask substrate, and cleaning method for mask substrate using the device |
JP2007294738A (en) * | 2006-04-26 | 2007-11-08 | Shin Etsu Chem Co Ltd | Device and method for cleaning substrate |
JP2008087135A (en) * | 2006-10-04 | 2008-04-17 | Nippon Electric Glass Co Ltd | End surface grinding device of glass substrate and end surface grinding method |
JP2009172514A (en) * | 2008-01-24 | 2009-08-06 | Toppan Forms Co Ltd | Cleaning apparatus |
JP2012216709A (en) * | 2011-04-01 | 2012-11-08 | Ulvac Japan Ltd | Processing apparatus and processing method |
JP2014042873A (en) * | 2012-08-27 | 2014-03-13 | Hoya Corp | Substrate manufacturing method, and substrate cleaning device |
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