JPH0327637B2 - - Google Patents

Info

Publication number
JPH0327637B2
JPH0327637B2 JP58015699A JP1569983A JPH0327637B2 JP H0327637 B2 JPH0327637 B2 JP H0327637B2 JP 58015699 A JP58015699 A JP 58015699A JP 1569983 A JP1569983 A JP 1569983A JP H0327637 B2 JPH0327637 B2 JP H0327637B2
Authority
JP
Japan
Prior art keywords
plating
lead frame
plate
hole
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58015699A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59143085A (ja
Inventor
Takao Tokunaga
Toshinobu Banjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58015699A priority Critical patent/JPS59143085A/ja
Publication of JPS59143085A publication Critical patent/JPS59143085A/ja
Publication of JPH0327637B2 publication Critical patent/JPH0327637B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58015699A 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置 Granted JPS59143085A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58015699A JPS59143085A (ja) 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58015699A JPS59143085A (ja) 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置

Publications (2)

Publication Number Publication Date
JPS59143085A JPS59143085A (ja) 1984-08-16
JPH0327637B2 true JPH0327637B2 (enExample) 1991-04-16

Family

ID=11896013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58015699A Granted JPS59143085A (ja) 1983-02-01 1983-02-01 リ−ドフレ−ムの部分めつき装置

Country Status (1)

Country Link
JP (1) JPS59143085A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107354491B (zh) * 2017-07-03 2019-03-22 富加宜连接器（东莞）有限公司 一种均匀镀膜方法

Also Published As

Publication number Publication date
JPS59143085A (ja) 1984-08-16

Similar Documents

Publication Publication Date Title
US6554976B1 (en) Electroplating apparatus
JPS58182823A (ja) 半導体ウエハ−のメツキ装置
JPH04263090A (ja) 金属を電着させるための装置とその装置に使用される陽極アセンブリおよび陽極
JPH0327637B2 (enExample)
JP3285572B2 (ja) 分割電極部分を有する給電ローラを用いた連続めっき方法並びに装置
JP4644528B2 (ja) 部分めっき装置及び部分めっき方法
JPH07211723A (ja) 半導体装置の製造方法
US4675093A (en) Selectively plating apparatus for forming an annular coated area
JP3440348B2 (ja) 連続めっき方法および連続めっき装置
JP2003003294A (ja) 全面電気メッキ装置及びそれによって製造される全面メッキリードフレーム
KR19980050646U (ko) 반도체의 납도금장비
JPH052603Y2 (enExample)
JPH0582691A (ja) 部分めつき装置および半導体装置用リードフレーム
JPH1046394A (ja) メッキ治具
JP3018216B2 (ja) リ−ドフレ−ムの製造方法
JPS58700Y2 (ja) 電着装置
JPS6274338U (enExample)
JPH01198496A (ja) スポットめっき装置
JPH06179998A (ja) めっき装置
JPS5839794A (ja) 部分めつき装置
JPS6217494Y2 (enExample)
JPH0657497A (ja) ウエハ用メッキ装置
JPH03239351A (ja) リードフレームの製造方法
JPS60147672U (ja) 磁気デイスク基板の陽極酸化処理装置
JPS61177391A (ja) 環状部分メツキ装置