JPH03275761A - ポリフェニレンオキサイド系樹脂組成物 - Google Patents

ポリフェニレンオキサイド系樹脂組成物

Info

Publication number
JPH03275761A
JPH03275761A JP7598690A JP7598690A JPH03275761A JP H03275761 A JPH03275761 A JP H03275761A JP 7598690 A JP7598690 A JP 7598690A JP 7598690 A JP7598690 A JP 7598690A JP H03275761 A JPH03275761 A JP H03275761A
Authority
JP
Japan
Prior art keywords
polyphenylene oxide
resin composition
flame retardant
laminate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7598690A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0577706B2 (enrdf_load_stackoverflow
Inventor
Hideto Misawa
英人 三澤
Takayoshi Koseki
高好 小関
Tokio Yoshimitsu
吉光 時夫
Toshiharu Takada
高田 俊治
Yoshihide Sawa
澤 佳秀
Takaaki Sakamoto
坂本 高明
Takahiro Heiuchi
隆博 塀内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7598690A priority Critical patent/JPH03275761A/ja
Publication of JPH03275761A publication Critical patent/JPH03275761A/ja
Publication of JPH0577706B2 publication Critical patent/JPH0577706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
JP7598690A 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物 Granted JPH03275761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7598690A JPH03275761A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7598690A JPH03275761A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Publications (2)

Publication Number Publication Date
JPH03275761A true JPH03275761A (ja) 1991-12-06
JPH0577706B2 JPH0577706B2 (enrdf_load_stackoverflow) 1993-10-27

Family

ID=13592098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7598690A Granted JPH03275761A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Country Status (1)

Country Link
JP (1) JPH03275761A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002018493A1 (fr) * 2000-08-30 2002-03-07 Asahi Kasei Kabushiki Kaisha Composition de resine durcissable
JP2005171075A (ja) * 2003-12-11 2005-06-30 Hitachi Chem Co Ltd プリント配線板樹脂組成物、およびこれを用いた樹脂ワニス、プリプレグおよび積層板
JP2007056170A (ja) * 2005-08-25 2007-03-08 Matsushita Electric Works Ltd ポリフェニレンエーテル樹脂組成物、プリプレグ及び積層体
US8420210B2 (en) 2003-09-19 2013-04-16 Hitachi Chemical Company, Ltd. Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002018493A1 (fr) * 2000-08-30 2002-03-07 Asahi Kasei Kabushiki Kaisha Composition de resine durcissable
US8420210B2 (en) 2003-09-19 2013-04-16 Hitachi Chemical Company, Ltd. Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
JP2005171075A (ja) * 2003-12-11 2005-06-30 Hitachi Chem Co Ltd プリント配線板樹脂組成物、およびこれを用いた樹脂ワニス、プリプレグおよび積層板
JP2007056170A (ja) * 2005-08-25 2007-03-08 Matsushita Electric Works Ltd ポリフェニレンエーテル樹脂組成物、プリプレグ及び積層体

Also Published As

Publication number Publication date
JPH0577706B2 (enrdf_load_stackoverflow) 1993-10-27

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