JPH0577705B2 - - Google Patents
Info
- Publication number
- JPH0577705B2 JPH0577705B2 JP30518989A JP30518989A JPH0577705B2 JP H0577705 B2 JPH0577705 B2 JP H0577705B2 JP 30518989 A JP30518989 A JP 30518989A JP 30518989 A JP30518989 A JP 30518989A JP H0577705 B2 JPH0577705 B2 JP H0577705B2
- Authority
- JP
- Japan
- Prior art keywords
- flame
- flame retardant
- polyphenylene oxide
- resin composition
- retardant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30518989A JPH03166255A (ja) | 1989-11-25 | 1989-11-25 | 難燃化ポリフェニレンオキサイド系樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30518989A JPH03166255A (ja) | 1989-11-25 | 1989-11-25 | 難燃化ポリフェニレンオキサイド系樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03166255A JPH03166255A (ja) | 1991-07-18 |
JPH0577705B2 true JPH0577705B2 (enrdf_load_stackoverflow) | 1993-10-27 |
Family
ID=17942128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30518989A Granted JPH03166255A (ja) | 1989-11-25 | 1989-11-25 | 難燃化ポリフェニレンオキサイド系樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03166255A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11286346B2 (en) | 2015-01-13 | 2022-03-29 | Showa Denko Materials Co., Ltd. | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5104507B2 (ja) * | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
-
1989
- 1989-11-25 JP JP30518989A patent/JPH03166255A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11286346B2 (en) | 2015-01-13 | 2022-03-29 | Showa Denko Materials Co., Ltd. | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
Also Published As
Publication number | Publication date |
---|---|
JPH03166255A (ja) | 1991-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |