JPH03274817A - Oscillator and its manufacture - Google Patents
Oscillator and its manufactureInfo
- Publication number
- JPH03274817A JPH03274817A JP7496290A JP7496290A JPH03274817A JP H03274817 A JPH03274817 A JP H03274817A JP 7496290 A JP7496290 A JP 7496290A JP 7496290 A JP7496290 A JP 7496290A JP H03274817 A JPH03274817 A JP H03274817A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- piezoelectric substrate
- terminal
- dummy
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 11
- 238000000605 extraction Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は圧電共振子を用いた発振子とその製造方法に関
し、特に３次高調波を利用した発振子とその製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an oscillator using a piezoelectric resonator and a method for manufacturing the same, and particularly to an oscillator using third harmonics and a method for manufacturing the same.
（従来の技術）
発振子における圧電共振子素子は、第７図に示されるよ
うに、圧電基板２０の表側と裏側の主表面に圧電基板２
０を挾んで対向する振動電極２２を備えている０表側と
裏側の振動電極２２はそれぞれ引出し電極を経て端子電
極２４につながり。(Prior Art) As shown in FIG. 7, a piezoelectric resonator element in an oscillator has piezoelectric substrates 2 on the front and back main surfaces of a piezoelectric substrate 20.
The vibrating electrodes 22 on the front and back sides of the 0, which are provided with vibrating electrodes 22 facing each other with the 0 in between, are connected to the terminal electrodes 24 via extraction electrodes, respectively.
表側の端子電極２４にはリード端子２６が半田付けされ
、裏側の端子電極２４にはリード端子２８が半田付けさ
れている。このような圧電共振子素子は樹脂３０により
モールドされ、振動部には振動を抑制しないように空８
！３２が形成されている。A lead terminal 26 is soldered to the terminal electrode 24 on the front side, and a lead terminal 28 is soldered to the terminal electrode 24 on the back side. Such a piezoelectric resonator element is molded with resin 30, and the vibrating part is filled with air 8 to prevent vibrations from being suppressed.
! 32 is formed.
（発明が解決しようとする課題） このような構造の３次高調波利用発振子では。(Problem to be solved by the invention) In a 3rd harmonic oscillator with such a structure.
空洞３２の大きさのバラツキや、圧電基板２０自体の特
性のバラツキによって基本波が強く励振される場合があ
り、発振回路の特性によって基本波発振を起こす場合が
ある。The fundamental wave may be strongly excited due to variations in the size of the cavity 32 or variations in the characteristics of the piezoelectric substrate 20 itself, and fundamental wave oscillation may occur depending on the characteristics of the oscillation circuit.
本発明は３次高調波に影響を与えずに基本波を抑制する
ことのできる発振子を提供することを目的とするもので
ある。An object of the present invention is to provide an oscillator that can suppress the fundamental wave without affecting the third harmonic.
本発明はまた、３次高調波に影響を与えずに基本波を抑
制することのできる発振子を簡単な工程で製造する方法
を提供することを目的とするものである。Another object of the present invention is to provide a method for manufacturing, through simple steps, an oscillator that can suppress the fundamental wave without affecting the third harmonic.
（課題を解決するための手段）
本発明は、圧電基板の表側と裏側の主表面に圧電基板を
挾んで対向する振動電極を有する圧電共振子素子を備え
た発振子において、圧電基板の少なくとも一方の主表面
上の３次高調波が励振される領域より外側の領域であっ
て基本波が励振される領域内の領域に半田又は半田とリ
ード端子の一部による質量付加領域を設けた発振子であ
る。(Means for Solving the Problems) The present invention provides an oscillator including a piezoelectric resonator element having vibrating electrodes facing each other with the piezoelectric substrate sandwiched between the front and back main surfaces of the piezoelectric substrate. An oscillator in which a mass added area is provided by solder or a part of solder and a lead terminal in an area outside the area where the third harmonic is excited on the main surface of the oscillator and within the area where the fundamental wave is excited. It is.
本発明の製造方法では、ＷＪ主表面に振動電極を有する
圧電基板を用意する工程と、前記圧電基板の少なくとも
一方の主表面上にダミー電極を設ける工程と、少なくと
も一方の面に予め半田が付与されている少なくとも一対
の端子を用意する工程と、前記予め半田が付与された端
子を熱風で加熱して半田を溶融させることにより前記ダ
ミー電極に接続する工程とを備えている。前記ダミー電
極は、前記圧電基板の３次高調波が励振される領域より
外側の領域であって基本波が励振される領域内の領域に
かかるように設けられる。The manufacturing method of the present invention includes a step of preparing a piezoelectric substrate having a vibrating electrode on the main surface of the WJ, a step of providing a dummy electrode on at least one main surface of the piezoelectric substrate, and a step of applying solder to at least one surface in advance. and a step of heating the pre-soldered terminals with hot air to melt the solder and connecting them to the dummy electrodes. The dummy electrode is provided so as to cover a region of the piezoelectric substrate outside the region where the third harmonic is excited and within the region where the fundamental wave is excited.
（作用）
第４図に圧電共振子素子における基本波Ｆ１と３次高真
波Ｆ３の変位を示す６２は圧電基板、４゜８は振動電極
である。記号ｄで示される領域では基本波の変位はある
が、３次高調波の変位がない。(Function) FIG. 4 shows the displacement of the fundamental wave F1 and the third harmonic wave F3 in the piezoelectric resonator element. 62 is a piezoelectric substrate, and 4.8 is a vibrating electrode. In the region indicated by symbol d, there is a displacement of the fundamental wave, but there is no displacement of the third harmonic.
この領域ｄにダミー電極を配置し、そこに半田を付着さ
せたり、リード端子の一部を延在させてそのダミー電極
に半田付けすることにより、領域ｄの質量が付加され、
その質量により基本波Ｆ１の変位が強制的に、かつ、選
択的にダンピングされる。By arranging a dummy electrode in this region d and attaching solder to it, or by extending a part of the lead terminal and soldering it to the dummy electrode, the mass of the region d is added.
The displacement of the fundamental wave F1 is forcibly and selectively damped by the mass.
（実施例）
第１図は一実施例を表わしたものであり、（Ａ）は表側
の平面図、（Ｂ）は裏側の平面図である。(Example) FIG. 1 shows an example, in which (A) is a plan view of the front side, and (B) is a plan view of the back side.
ただし、モールド部材の図示は省略されている。However, illustration of the mold member is omitted.
第２図は同実施例における圧電基板を表わしたものであ
り、（Ａ）は表側の平面図、（Ｂ）は裏側の平面図、第
３１３ｉｊｌは同実施例で用いられるリード端子を表わ
したものである。Figure 2 shows the piezoelectric substrate in the same example, where (A) is a plan view of the front side, (B) is a plan view of the back side, and No. 313ijl shows a lead terminal used in the same example. It is.
第１図で、２は圧電セラミック基板などの圧電基板であ
り、表側の主表面の中央部には振動電極４が形成され、
引出し電極を経て端子電極６につながっている。端子電
極６はリード端子が接続される電極であり、端子電極６
には第４図の領域ｄに相当する圧電基板端部に配置され
たダミー電極６ａがつながっている。圧電基板２の裏面
側においても、中央部に振動電極８が配電され１表側の
振動電極４と裏側の振動電極８とは圧電基板２を挾んで
対向している。振動電極８も引出し電極を経て端子電極
１０につながっており、端子電極１Ｏには第４図の領域
ｄに相当する圧電基板端部に配置されたダミー電極１０
ａがつながっている。In FIG. 1, 2 is a piezoelectric substrate such as a piezoelectric ceramic substrate, and a vibrating electrode 4 is formed in the center of the front main surface.
It is connected to a terminal electrode 6 via an extraction electrode. The terminal electrode 6 is an electrode to which a lead terminal is connected, and the terminal electrode 6 is an electrode to which a lead terminal is connected.
A dummy electrode 6a placed at the end of the piezoelectric substrate corresponding to region d in FIG. 4 is connected to. Also on the back side of the piezoelectric substrate 2, a vibrating electrode 8 is electrically distributed to the center, and the vibrating electrode 4 on the front side and the vibrating electrode 8 on the back side face each other with the piezoelectric substrate 2 in between. The vibrating electrode 8 is also connected to the terminal electrode 10 via an extraction electrode, and the terminal electrode 1O includes a dummy electrode 10 placed at the end of the piezoelectric substrate corresponding to area d in FIG.
a are connected.
ダミー電極６ａ、１０ａはリード端子の一部が半田付は
接続されることにより質量が付加されて基本波の振動を
抑制するためのものである。The dummy electrodes 6a and 10a are used to suppress fundamental wave vibrations by adding mass by connecting a part of the lead terminal by soldering.
リード端子１２．１４は第３図に示されるように、外部
接続用の部分と端子電極６，１０にそれぞれ半田付は接
続される部分の他に、ダミー電極６ａｙｌｏａにそれぞ
れ半田付は接続されるダミーリード端子部１２ａ、１４
ａを備えている。As shown in FIG. 3, the lead terminals 12 and 14 are soldered to a dummy electrode 6ayloa in addition to a portion for external connection and a portion that is soldered to the terminal electrodes 6 and 10, respectively. Dummy lead terminal parts 12a, 14
It is equipped with a.
リード端子１２，１２ａを端子電極６及びダミー電極６
ａに半田付は接続し、リード端子１４゜１４ａを端子電
極１０及びダミー電極１０ａに半田付は接続すると、第
４図のｄ領域においてはダミー電極部６ａ、１０ａでの
半田と端子１２ａ。The lead terminals 12, 12a are connected to the terminal electrode 6 and the dummy electrode 6.
When the lead terminal 14° 14a is connected to the terminal electrode 10 and the dummy electrode 10a by soldering, in the area d of FIG.
１４ａにより質量が付加され、基本波Ｆ１が抑制される
。14a adds mass and suppresses the fundamental wave F1.
リード端子１２．１４が接続された状態で振動部に空洞
を形成して樹脂によりこの圧電共振子素子がモールドさ
れる。With the lead terminals 12 and 14 connected, a cavity is formed in the vibrating section and the piezoelectric resonator element is molded with resin.
次に２本実施例の製造方法について説明する。Next, the manufacturing method of the two embodiments will be explained.
圧電基板２には第２図に示されるような表側の電極４，
６，６ａと裏側の電極８，１０，１０ａを形成する。一
方、第３図に示されるような形状のリード端子１２，１
２ａ、１４，１４ａには予め半田を付与しておく。The piezoelectric substrate 2 has an electrode 4 on the front side as shown in FIG.
6, 6a and back side electrodes 8, 10, 10a are formed. On the other hand, lead terminals 12, 1 having a shape as shown in FIG.
Solder is applied to 2a, 14, and 14a in advance.
半田を形成したリード端子１２，１２ａ、１４゜１４ａ
を圧電基板２の対応する電極６，６ａ、１０．１０ａ上
に重ね、熱風を吹き付け、半田を溶融させた後、自然冷
却させる。これによりリード端子１２，１２ａ、１４，
１４ａが圧電基板２の電極６，６ａ、１０，１０ａに半
田付けされ、度の工程で半田付けとダミー電極へのダン
ピング用質量付加を達成することができる。Lead terminals 12, 12a, 14°14a with solder formed
are placed on the corresponding electrodes 6, 6a, and 10.10a of the piezoelectric substrate 2, hot air is blown onto the solder, the solder is melted, and then the solder is allowed to cool naturally. As a result, the lead terminals 12, 12a, 14,
14a is soldered to the electrodes 6, 6a, 10, 10a of the piezoelectric substrate 2, and soldering and addition of damping mass to the dummy electrodes can be accomplished in one step.
第５図及び第６図は他の実施例を表わす。5 and 6 represent other embodiments.
圧電基板２の表側主表面に振動電極４が形成され、引出
し電極を経て端子電極６が形成されている。裏側主表面
にも振動電極とそれに引出し電極を経てつながる端子電
極が形成されている。３次高調波の振動領域より外側で
基本波の変位のある領域には、圧電基板２の表側と裏側
にダミー電極１６（１７）が形成されている。A vibrating electrode 4 is formed on the front main surface of the piezoelectric substrate 2, and a terminal electrode 6 is formed via an extraction electrode. A vibrating electrode and a terminal electrode connected to the vibrating electrode via an extraction electrode are also formed on the back main surface. Dummy electrodes 16 (17) are formed on the front and back sides of the piezoelectric substrate 2 in areas where the fundamental wave is displaced outside the third harmonic vibration area.
ダミー電極１６．１７は、第６図に示されるように、圧
電基板２の表側ではダミー電極１６ａ上に半田１６ｂが
形成され、圧電基板２の裏面ではダミー電極１７ａ上に
半田１７ｂが形成されている。As shown in FIG. 6, the dummy electrodes 16 and 17 have solder 16b formed on the dummy electrode 16a on the front side of the piezoelectric substrate 2, and solder 17b formed on the dummy electrode 17a on the back side of the piezoelectric substrate 2. There is.
リード端子１８は表側の端子電極６とのみ半田付は接続
され、リード端子１９は裏側の端子電極１０とのみ半田
付は接続されており、リード端子１８．１９はダミー電
極１６．１７までは延在していない。The lead terminal 18 is soldered only to the terminal electrode 6 on the front side, the lead terminal 19 is soldered only to the terminal electrode 10 on the back side, and the lead terminals 18 and 19 are not extended to the dummy electrodes 16 and 17. Not present.
いずれの実施例においても、振動電極４，８と質量付加
領域６ａ、１０ａ、１６，１７までの距離（第６図では
ｇ）は、圧電基板２の厚みにもよるが、０．１〜１ｍｍ
程度とするのが望ましい。In any embodiment, the distance (g in FIG. 6) between the vibrating electrodes 4, 8 and the mass adding regions 6a, 10a, 16, 17 is 0.1 to 1 mm, although it depends on the thickness of the piezoelectric substrate 2.
It is desirable that the
（発明の効果）
本発明の発振子では、圧電共振子素子の圧電基板の少な
くとも一方の主表面上の３次高調波が励振される領域よ
り外側の領域であって基本波が励振される領域内の領域
に半田又は半田とリード端子の一部による質量付加領域
を設けたので、従来の生産設備を大幅に変更することな
く、効果的に基本波を抑制することができる。(Effects of the Invention) In the oscillator of the present invention, the region on at least one main surface of the piezoelectric substrate of the piezoelectric resonator element is the region outside the region where the third harmonic is excited and where the fundamental wave is excited. Since a mass adding region made of solder or a part of the solder and lead terminal is provided in the inner region, the fundamental wave can be effectively suppressed without significantly changing the conventional production equipment.
本発明の製造方法では両主表面に振動電極を有する圧電
基板を用意し、その圧電基板の少なくとも一方の主表面
上にダミー電極を設け、少なくとも一方の面に予め半田
が付与されている少なくとも一対の端子を用意して、前
記端子を熱風で加熱して半田を溶融させることにより前
記ダミー電極に接続させるようにしたので、−度の工程
で半田付けとダミー電極へのダンピング用質量付加を達
成することができる。In the manufacturing method of the present invention, a piezoelectric substrate having vibrating electrodes on both main surfaces is prepared, a dummy electrode is provided on at least one main surface of the piezoelectric substrate, and at least one pair of dummy electrodes is provided with solder on at least one surface in advance. By preparing a terminal and connecting it to the dummy electrode by heating the terminal with hot air and melting the solder, soldering and adding mass for damping to the dummy electrode were achieved in a -degree process. can do.
第１図は一実施例を表わしたものであり、（Ａ〉は表側
の平面図、（Ｂ）は裏側の平面図、第２図は同実施例に
おける圧電基板を表わしたものであり、（Ａ）は表側の
平面図、（Ｂ）は裏側の平面図、第３図は同実施例で用
いられるリード端子を示す平面図、第４図は基本波と３
次高調波の変位を示す図、第５図は他の実施例を示す平
面図、第６図は第５図のＸ−Ｘ線位置での断面図、第７
図は従来の発振子を示す図であり、（Ａ）は正面断面図
、（Ｂ）は側面断面図である。
２・・・・・・圧電基板、４，８・・・・・・振動電極
、６，１０・・・・・・端子電極、６ａ、１０ａ、１６
ａ、１７ａ・・・・・・ダミー電極、１２，１４，１８
，１９・・・・・・リード端子、１２ａ、１４ａ・・・
・・・リード端子の一部、１６ｂ、１７ｂ・・・・・・
半田。FIG. 1 shows one embodiment, (A> is a plan view of the front side, (B) is a plan view of the back side, and FIG. 2 shows a piezoelectric substrate in the same embodiment. A) is a plan view of the front side, (B) is a plan view of the back side, Fig. 3 is a plan view showing the lead terminal used in the same example, and Fig. 4 is a plan view of the fundamental wave and the
FIG. 5 is a plan view showing another embodiment; FIG. 6 is a cross-sectional view taken along line X-X in FIG. 5; FIG.
The figures show a conventional oscillator, in which (A) is a front sectional view and (B) is a side sectional view. 2... Piezoelectric substrate, 4, 8... Vibration electrode, 6, 10... Terminal electrode, 6a, 10a, 16
a, 17a...Dummy electrode, 12, 14, 18
, 19...Lead terminals, 12a, 14a...
...Part of the lead terminal, 16b, 17b...
solder.
Claims (3)
で対向する振動電極を有し、かつ、前記圧電基板の少な
くとも一方の主表面上の３次高調波が励振される領域よ
り外側の領域であって基本波が励振される領域内の領域
に半田又は半田とリード端子の一部による質量付加領域
を設けた発振子。(1) Vibration electrodes are provided on the front and back main surfaces of the piezoelectric substrate, and the piezoelectric substrate is sandwiched between the vibrating electrodes, and the piezoelectric substrate is located outside a region where the third harmonic is excited on at least one of the main surfaces of the piezoelectric substrate. An oscillator in which a mass adding region is provided by solder or a part of the solder and a lead terminal in the region in which the fundamental wave is excited.
工程と、前記圧電基板の少なくとも一方の主表面上にダ
ミー電極を設ける工程と、少なくとも一方の面に予め半
田が付与されている少なくとも一対の端子を用意する工
程と、前記予め半田が付与された端子を熱風で加熱して
半田を溶融させることにより前記ダミー電極に接続する
工程と、を備えた発振子の製造方法。(2) a step of preparing a piezoelectric substrate having vibrating electrodes on both main surfaces; a step of providing a dummy electrode on at least one main surface of the piezoelectric substrate; A method for manufacturing an oscillator, comprising the steps of: preparing a pair of terminals; and connecting the terminals to which solder has been applied in advance to the dummy electrodes by heating the terminals with hot air to melt the solder.
励振される領域より外側の領域であって基本波が励振さ
れる領域内の領域にかかるように設けられる請求項２に
記載の発振子の製造方法。(3) The dummy electrode is provided so as to cover a region of the piezoelectric substrate that is outside the region where the third harmonic is excited and is within the region where the fundamental wave is excited. How to manufacture a resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074962A JP2669099B2 (en) | 1990-03-23 | 1990-03-23 | Resonator using third harmonic and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074962A JP2669099B2 (en) | 1990-03-23 | 1990-03-23 | Resonator using third harmonic and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03274817A true JPH03274817A (en) | 1991-12-05 |
| JP2669099B2 JP2669099B2 (en) | 1997-10-27 |
Family
ID=13562447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2074962A Expired - Lifetime JP2669099B2 (en) | 1990-03-23 | 1990-03-23 | Resonator using third harmonic and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2669099B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0711029U (en) * | 1993-07-22 | 1995-02-14 | 株式会社大真空 | Fundamental wave suppression crystal unit |
| DE10055635B4 (en) * | 1999-11-12 | 2010-03-11 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Piezoelectric resonator |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5525278A (en) * | 1978-08-12 | 1980-02-22 | Noto Denshi Kogyo Kk | 3-terminal type piezoelectric filter |
| JPS58150316A (en) * | 1982-03-02 | 1983-09-07 | Miyota Seimitsu Kk | Assembling method of oscillator |
| JPS5911520U (en) * | 1982-07-13 | 1984-01-24 | 株式会社村田製作所 | Piezoelectric resonant components |
| JPS60249410A (en) * | 1984-05-24 | 1985-12-10 | Sanken Electric Co Ltd | Attaching method of resonator |
| JPS63234707A (en) * | 1987-03-24 | 1988-09-30 | Ngk Spark Plug Co Ltd | Piezoelectric ceramic resonator |
| JPS643228U (en) * | 1987-06-19 | 1989-01-10 | ||
| JPS6428020U (en) * | 1987-08-07 | 1989-02-17 | ||
| JPH01113172A (en) * | 1987-10-23 | 1989-05-01 | Toshiba Corp | Soldering device |
| JPH01231511A (en) * | 1988-03-11 | 1989-09-14 | Murata Mfg Co Ltd | Piezoelectric resonator |
-
1990
- 1990-03-23 JP JP2074962A patent/JP2669099B2/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5525278A (en) * | 1978-08-12 | 1980-02-22 | Noto Denshi Kogyo Kk | 3-terminal type piezoelectric filter |
| JPS58150316A (en) * | 1982-03-02 | 1983-09-07 | Miyota Seimitsu Kk | Assembling method of oscillator |
| JPS5911520U (en) * | 1982-07-13 | 1984-01-24 | 株式会社村田製作所 | Piezoelectric resonant components |
| JPS60249410A (en) * | 1984-05-24 | 1985-12-10 | Sanken Electric Co Ltd | Attaching method of resonator |
| JPS63234707A (en) * | 1987-03-24 | 1988-09-30 | Ngk Spark Plug Co Ltd | Piezoelectric ceramic resonator |
| JPS643228U (en) * | 1987-06-19 | 1989-01-10 | ||
| JPS6428020U (en) * | 1987-08-07 | 1989-02-17 | ||
| JPH01113172A (en) * | 1987-10-23 | 1989-05-01 | Toshiba Corp | Soldering device |
| JPH01231511A (en) * | 1988-03-11 | 1989-09-14 | Murata Mfg Co Ltd | Piezoelectric resonator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0711029U (en) * | 1993-07-22 | 1995-02-14 | 株式会社大真空 | Fundamental wave suppression crystal unit |
| DE10055635B4 (en) * | 1999-11-12 | 2010-03-11 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Piezoelectric resonator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2669099B2 (en) | 1997-10-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2017111020A1 (en) | Pieozoelectric oscillation device and method for manufacturing same | |
| JP2006345518A (en) | Piezoelectric resonator and assembly comprising the piezoelectric resonator enclosed in case | |
| JPS63104512A (en) | Sealing structure for piezoelectric resonator | |
| JP3017746B2 (en) | Crystal oscillator | |
| JPH03274817A (en) | Oscillator and its manufacture | |
| KR100537263B1 (en) | Surface mounting package | |
| JPS6070810A (en) | Longitudinal vibration type piezoelectric vibrator | |
| JPH09326657A (en) | Production of piezoelectric vibrator | |
| JP2005051513A (en) | Crystal resonator | |
| JP2003163567A (en) | Crystal oscillator | |
| JP7196726B2 (en) | crystal wafer | |
| JP2001119263A (en) | Crystal oscillator | |
| JPS6150413A (en) | Manufacture of piezoelectric vibrator | |
| JPS5994911A (en) | Manufacture of composite type ceramic resonator | |
| JP2000013170A (en) | Crystal oscillator for surface mounting | |
| JP2003133886A (en) | Crystal oscillator | |
| JPH0543539Y2 (en) | ||
| JP2000286661A (en) | Surface mount electronic parts | |
| JPH10117120A (en) | Gt-cut crystal oscillator | |
| JP2015091100A (en) | Surface acoustic wave device | |
| JPH1131939A (en) | Surface mounting type crystal vibrator and its production | |
| JP3556111B2 (en) | Package for electronic component, electronic component assembly using the same, and method of manufacturing electronic component assembly | |
| JPH11284483A (en) | Crystal resonator | |
| JPS6216573B2 (en) | ||
| JP2020072434A (en) | Pedestal for vibration element, vibrator, and oscillator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080704 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090704 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090704 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100704 Year of fee payment: 13 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100704 Year of fee payment: 13 |