JP2020072434A - Pedestal for vibration element, vibrator, and oscillator - Google Patents

Abstract

To provide a pedestal for vibration element, vibrator and oscillator, capable of achieving high vibration resistance and high phase noise characteristics by suppressing an influence of vibration from the outside.SOLUTION: The pedestal for vibration element includes: a landing part 11 with a vibration element such as a crystal piece; a plurality of connection parts 12 connected with a substrate of a package 3; an outer frame part 13 disposed around the landing part 11 with a clearance 14 and joining a plurality of connection parts 12; and a plurality of arm parts 15 connecting one side of the landing part 11 with one side of the outer frame part 13 or the connection part 12. The connection part 12 is formed to have a larger thickness than the outer frame part 13, the landing part 11 is formed to have a smaller thickness than the outer frame part 13 and the arm part 15 is formed to have a smaller thickness than the landing part 11. Each of the vibrator and the oscillator is provided with the pedestal for vibration element.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a pedestal on which a vibrating element is mounted, and more particularly, to a pedestal, a vibrator, and an oscillator for a vibrating element that can improve resistance to external vibration and have good phase noise characteristics.

[Conventional technology]
In a conventional crystal resonator, a structure using a pedestal mainly made of crystal (crystal pedestal) is known as a structure for suppressing the influence on the crystal piece from the package and the outside of the package.
Further, there is a crystal oscillator in which the package has an H structure in which concave portions are formed on the front and back sides, a crystal piece and a crystal pedestal are mounted on the front side, and an IC (Integrated Circuit) of an oscillation circuit is mounted on the back side.
There is also a temperature-compensated crystal oscillator (TCXO: Temperature Compensated Crystal Oscillator) in which a temperature compensation circuit is provided on the front surface or the back surface of the package.

[Related technology]
As related prior arts, Japanese Patent No. 3017750 "Crystal resonator" (Patent Document 1), Japanese Patent No. 4715252 "Piezoelectric vibrator" (Patent Document 2), Japanese Patent Laid-Open No. 2013-098678 "Crystal Vibration" Child ”(Patent Document 3).

  In Patent Document 1, a recess is formed on a holding crystal plate at a position where the resonator crystal piece is mounted, and the resonator crystal piece is surely excited in a gap formed by the recess. A crystal unit that does not generate thermal stress at room temperature is shown.

Patent Document 2 discloses a piezoelectric vibrator including a spring portion having a gap in order to reduce the influence of thermal expansion in the substrate.
Patent Document 3 discloses a crystal resonator configured to prevent deformation of the crystal piece due to temperature change and to obtain good frequency-temperature characteristics.

Japanese Patent No. 3017750 Japanese Patent No. 4715252 JP, 2013-098678, A

  However, in the crystal pedestal in the conventional crystal oscillator or crystal oscillator, there is a problem that external vibration affects the crystal piece, and the vibration deteriorates the phase noise characteristic.

  The present invention has been made in view of the above circumstances, and provides a pedestal for a vibrating element, a vibrator, and an oscillator that can suppress the influence of external vibration, improve the vibration resistance characteristics, and improve the phase noise characteristics. The purpose is to

  The present invention for solving the problems of the above conventional example is a pedestal for a vibrating element on which a vibrating element is mounted, which is connected to a rectangular-shaped mounting portion on which the vibrating element is mounted, and a package substrate. A plurality of connecting portions, an outer frame portion that is arranged around the mounting portion with a gap, and connects the plurality of connecting portions, one side of the mounting portion, and a plurality of connecting the outer frame portion or one side of the connecting portion. The connecting portion is formed to be thicker than the outer frame portion, the mounting portion is formed to be thinner than the outer frame portion, and the arm portion is formed to be thinner than the mounting portion. It is characterized by

  Further, in the present invention, in the pedestal, the arm portion is formed in a substantially S-shape, connects one side of the outer frame portion or the connection portion to an end portion of one side of the mounting portion facing the one side, and the one side It is characterized in that four pieces are provided so as to correspond to the respective end portions of.

  Further, according to the present invention, in the above-mentioned pedestal, the arm portion is formed in a substantially S-shape, and one side of the connecting portion and one side of the mounting portion facing the one side are connected, and two arms are provided. I am trying.

  Further, in the present invention, in the above-mentioned pedestal, the arm portion is formed in a substantially S shape, and two arms connect one side of the connecting portion and one side of the mounting portion facing the one side, and one side of the outer frame portion. It is characterized by including two connecting one side of the mounting portion facing the one side.

  Further, according to the present invention, in the above-mentioned pedestal, the arm portion is formed in a substantially S-shape, and one side of the connecting portion and one side adjacent to the one side of the mounting portion facing the one side are connected to each other, and an outer frame. It is characterized in that it is provided with two lines for connecting one side of the part and one side adjacent to the one side of the mounting part facing the one side.

  Further, in the present invention, in the above pedestal, the arm portion is formed in a linear shape by obliquely connecting one side of the outer frame portion or the connecting portion and one side of the mounting portion facing the one side at a constant angle, and is mounted. The pedestal according to claim 1, wherein four pedestals are provided corresponding to each side of the part.

  Further, the present invention is a vibrator in which a vibrating element is mounted on the pedestal described in any one of the above and is installed in a package.

  Further, the present invention is an oscillator, characterized in that a vibrating element is mounted on the pedestal described in any one of the above, is installed in a recess on the front surface of the package, and an oscillator circuit is mounted in the recess on the back surface of the package.

  According to the present invention, there is provided a pedestal for a vibrating element on which a vibrating element is mounted, which is a pedestal for a vibrating element on which a vibrating element is mounted, the rectangular mounting portion having a vibrating element mounted on a surface thereof, and a package. A plurality of connecting portions to be connected to the substrate, an outer frame portion arranged around the mounting portion with a gap, and connecting the plurality of connecting portions, one side of the mounting portion, and one side of the outer frame portion or the connecting portion. And a plurality of arm portions that connect to each other, the connection portion is formed to be thicker than the outer frame portion, the mounting portion is formed to be thinner than the outer frame portion, and the arm portion is formed to be thicker than the mounting portion. Since the pedestal is formed with a small thickness, even if external vibration is transmitted to the terminal, it is absorbed by the arm that has a large degree of freedom of deformation, and the effect on the mounting part can be reduced, thus reducing phase noise. It has the effect of improving the characteristics.

It is explanatory drawing which shows the structure of a 1st base. It is a cross-sectional block diagram of the crystal oscillator which used the 1st pedestal. It is explanatory drawing which shows another structure (other 1st pedestal) of a 1st pedestal. It is explanatory drawing which shows the structure of a 2nd base. It is explanatory drawing which shows the structure of a 3rd base. It is explanatory drawing which shows the structure of a 4th base. It is explanatory drawing which shows the structure of a 5th base.

Embodiments of the present invention will be described with reference to the drawings.
[Outline of Embodiment]
A pedestal (main pedestal) according to an embodiment of the present invention has a rectangular mounting portion on which a vibrating element such as a crystal element is mounted, a plurality of connecting portions for connecting to a package substrate, and a gap around the mounting portion. An outer frame part that is arranged apart from each other and connects a plurality of connecting parts, one side of the mounting part, and a plurality of arm parts that connect the outer frame part or one side of the connecting part, and the connecting part is an outer frame part. The thickness of the mounting portion is thinner than that of the outer frame portion, and the thickness of the arm portion is thinner than that of the mounting portion. It is assumed that external vibration is transmitted to the connection portion. Also, it is possible to reduce the influence on the mounting portion by absorbing by the outer frame portion and the arm portion, and to improve the phase noise characteristic.

The vibrator according to the embodiment of the present invention (main vibrator) is one in which a vibrating element is mounted on the main pedestal, and the main pedestal is installed in a package having a recess.
Further, the oscillator according to the embodiment of the present invention (the present oscillator) is one in which an oscillation circuit is mounted in a recess or the like on the back surface of the package of the present oscillator.
The main pedestal includes first to fifth pedestals as described later.

[First pedestal: Fig. 1]
Next, a first pedestal (first pedestal) according to the embodiment of the present invention will be described with reference to FIG. 1A and 1B are explanatory views showing a configuration of a first pedestal, FIG. 1A is a plan view in which a vibrating piece is mounted on the first pedestal, and FIG. 1B is a plan view in which the vibrating piece is mounted on the first pedestal. It is the long side side view.
As shown in FIG. 1, the first pedestal 10 has a rectangular mounting portion 11 on which the vibrating piece (crystal piece) 2 is mounted, and two connecting portions 12 a formed along two long sides of the mounting portion 11. , 12b (connecting portion 12) and two connecting portions 12 are connected to each other, and an outer frame portion 13 formed so as to surround the periphery of the mounting portion 11 and four connecting the mounting portion 11 and the outer frame portion 13 are connected. Arm portions 15a, 15b, 15c, and 15d (arm portion 15).

The connecting portion 12 and the outer frame portion 13 and the mounting portion 11 are separated by the gap portions 14a, 14b, 14c, 14d (the gap portion 14).
The gap portion 14 is formed along the long side of the mounting portion 11 and has substantially U-shaped gap portions 14 a and 14 b and the short side of the mounting portion 11, and is surrounded by two arm portions 15. Cup-shaped gap portions 14c and 14d.
That is, in the first pedestal 10, the mounting portion 11 is arranged in an island shape inside the enclosure formed of the outer frame portion 13 and the connecting portion 12, and the mounting portion 11 is connected to the outer frame portion 13 by the arm portion 15. It is composed.

The crystal piece 2 is fixed to the mounting portion 11 with a conductive adhesive. The conductive adhesive is omitted in FIG. 1 (b).
The first pedestal 10 is formed of, for example, a resin such as heat-resistant plastic, glass, or an insulating material such as metal having an insulating film coated on its surface.
Further, the first pedestal 10 may be formed of the same crystal as the vibrating piece (crystal piece) 2 (the same AT cut or Z plate as the crystal piece 2). In that case, the thermal expansion coefficients of the pedestal 10 and the crystal piece 2 are substantially equal to each other, and stress due to temperature change does not occur.

  The connecting portions 12a and 12b of the first pedestal 10 are provided with electrode patterns 17a and 17b, respectively, and are electrically and physically connected to the metal pattern formed on the substrate of the package. It is provided along the long side.

The connecting portion 12 is formed thicker than the outer frame portion 13. Further, the mounting portion 11 is formed to be thinner than the outer frame portion 13. The arm portion 15 is formed thinner than the mounting portion 11.
That is, the thickness of each part of the first pedestal 10 has four levels, and the connection part 12> outer frame part 13> mounting part 11> arm part 15 in order from the thicker part.

  As a result, the outer frame portion 13 and the mounting portion 11 do not come into contact with the board when the connecting portion 12 is brought into contact with the board of the package and the first pedestal 10 is housed in the package, and the vibration from the board is prevented. It is hard to be affected.

  Further, by making the width of the arm portion 15 narrower than that of the mounting portion 11 and making the thickness thinner than the outer frame portion 13 and the mounting portion 11, the arm portion 15 itself is easily bent and deformed, and vibrations from the outside are absorbed. It makes it easier.

As shown in FIG. 1, the arm portion 15 that is a characteristic portion of the first pedestal 10 connects one short side of the mounting portion 11 and the short side of the outer frame portion 13, and both are substantially It is formed in an S shape (including an inverted S shape).
By forming the arm portion 15 into a substantially S-shape, the length of the arm portion 15 can be made longer than in the case where the arm portion 15 has a linear shape, and it is easy to absorb vibration from the outside.
The pedestal 10 is one in which each component including the arm portion 15 is integrally formed, and is formed by etching.

As described above, in the first pedestal 10, even if external vibration is transmitted to the connection portion 12, the vibration is dispersed to the outer frame portion 13 and the arm portion 15, and the arm portion 15 is deformed to absorb the vibration. Then, it is possible to prevent the vibration from being transmitted to the mounting portion 11, suppress the influence on the crystal piece 2, and improve the phase noise characteristic.
Further, by making the connecting position of the arm portion 15 not near the center of the short side of the mounting portion 11 but near the corner portions at both ends of the short side, the influence on the mounted crystal piece 2 is minimized.

Next, the electrode pattern of the first pedestal 10 will be described.
Electrode patterns 17a and 17b are formed on one short side corner of the mounting portion 11, and the electrode patterns 17a and 17b are connected to the excitation electrodes of the crystal blank 2 by a conductive adhesive.
The electrode pattern 17a is formed on the surface, the side surface, and the bottom surface of the arm portion 15d, is further drawn from the surface of the outer frame portion 13 to the connection portion 12a, and is formed over the surface, the side surface, and the bottom surface of the connection portion 12a. , Connect to the electrodes of the board with solder or the like.
The structural strength of the arm portion 15 is reinforced by forming the metal pattern on the surface, the side surface, and the bottom surface of the arm portion 15.
Similarly, the electrode pattern 17b is formed over the surface, the side surface, and the bottom surface of the connecting portion 12b via the arm portion 15c and the outer frame portion 13, and is connected to the electrode of the substrate by soldering or the like.
Note that, in FIG. 1B, the electrodes formed on the side surfaces of the connecting portion 12 are omitted.

  Further, here, as the vibration element mounted on the first pedestal 10, the crystal resonator formed of the AT-cut crystal piece 2 is used. However, for example, a surface acoustic wave (SAW) resonator, An oscillating element (vibrating element) such as a piezoelectric vibrator or a micro electro mechanical system (MEMS) vibrator may be used.

[This crystal unit: Fig. 3]
Next, a crystal resonator using the first pedestal will be described with reference to FIG. FIG. 2 is a cross-sectional configuration diagram of a crystal unit using the first pedestal.
As shown in FIG. 2, in the present crystal unit, the first pedestal 10 on which the crystal piece 2 is mounted is mounted on the substrate which is the bottom surface of the recess of the package 3.
Specifically, as shown in FIG. 2, in the present crystal resonator, a first pedestal 10 having a crystal piece 2 is mounted inside a concave portion of a package 3 formed of ceramic or the like, and the first pedestal is installed. The connecting portion 12 of 10 is connected to the metal pattern formed on the substrate of the package 3 by solder 6 or the like.

A seam ring 4 is formed around the surface of the package 3.
The seam ring 4 is formed of silver (Ag) wax or the like around the surface of the package for seam sealing.
Then, a lid 5 serving as a lid of the package 3 is formed so as to adhere to the seam ring 4, and the inside is sealed. The lid 5 is made of Kovar plated with nickel or the like.

In FIG. 2, the package 3 has a concave portion formed on the front surface side. However, a package having a concave portion formed on the rear surface side and having a substantially H-shaped cross section may be used. Alternatively, the first pedestal 10 and the crystal piece 2 may be housed and arranged, and the oscillator circuit may be housed and mounted in the recess on the back surface to form the oscillator.
When the first pedestal 10 and the oscillation circuit are mounted on the package 3, they are fixed with solder 6 or the like.

[Another configuration of the first pedestal: Fig. 3]
Next, another configuration of the first pedestal will be described with reference to FIG. FIG. 3 is an explanatory diagram showing another configuration of the first pedestal (another first pedestal), and FIG. 3A is a plan view in which the vibrating piece is mounted on the other first pedestal, FIG. 6B is a side view of the long side in which the vibrating piece is mounted on another first pedestal.
As shown in FIG. 3, another first pedestal 10 'has a configuration in which connecting portions 12c and 12d (connecting portion 12) are provided on each short side of the pedestal body.
The other components are almost the same as those of the first pedestal 10 shown in FIG. 1, but the shapes and positions of the electrode patterns 17c and 17d are different.

In the other first pedestal 10 ', the shape of the arm portion 15 is the same as that of the first pedestal 10, but the arm portion 15 is connected not to the outer frame portion 13 but to the connecting portions 12c and 12d provided on the short side. ing.
Also in the other pedestal 10 ′, the connecting portion 12 is formed thicker than the outer frame portion 13, the mounting portion 11 is formed thinner than the outer frame portion 13, and the arm portion 15 is formed thinner than the mounting portion 11. ..
Accordingly, when another first pedestal 10 'is installed on the substrate, the portions other than the connecting portion 11 are in a state of floating from the substrate to make it difficult for external vibrations to be transmitted to the mounting portion 11, and The thin arm portion 15 facilitates absorption of vibration.

On the other first pedestal 10 ', electrode patterns 17c and 17d are provided diagonally to the mounting portion 11 and are connected to the excitation electrodes of the crystal blank 2 by a conductive adhesive.
The electrode pattern 17c is formed on the front surface, the side surface, and the bottom surface of the arm portion 15a, and is further formed over the front surface, the side surface, and the rear surface of the connecting portion 12c, and is connected to the electrodes on the substrate by soldering or the like.
Similarly, the electrode pattern 17d is formed over the front surface, the side surface, and the back surface of the arm portion 15c and the connection portion 12d, and is connected to the electrode of the substrate by soldering or the like.

[Effects of the first pedestal and another first pedestal]
According to the first pedestal 10 and the effect 10 ′ of the other first pedestal, the mounting portion 11 on which the vibrating element such as the crystal piece 2 is mounted, the two connecting portions 12 connected to the substrate of the package 3, and the mounting An outer frame portion 13 that is formed around the portion 11 with a gap portion 14 therebetween and connects the connection portion 12, one side of the outer frame portion 13 or the connection portion 12, and an end of one side of the mounting portion 11 that faces the one side. The connecting portion 12 is formed to be thicker than the outer frame portion 13, the mounting portion 11 is formed to be thinner than the outer frame portion, and the arm portion 15 is Since the mounting portion 11 is thinner than the mounting portion 11 and is formed into a substantially S-shape, even if the vibration from the outside is transmitted to the connecting portion 12, the outer frame portion 13 and the arm portion 15 absorb the vibration. The effect on the mounting part 11 can be reduced and the phase noise characteristic can be improved. There is.

[Second pedestal: Fig. 4]
Next, a pedestal (second pedestal) according to the second embodiment of the present invention will be described with reference to FIG. 4A and 4B are explanatory views showing the configuration of the second pedestal, FIG. 4A is a plan view in which the vibrating piece is mounted on the second pedestal, and FIG. 4B is a plan view showing the vibrating piece on the second pedestal. It is a long side side side view mounted.
As shown in FIG. 4, the second pedestal 20 includes a rectangular mounting portion 21 on which the crystal piece 2 is mounted, and two connecting portions 22 a and 22 b (connecting portion 22) formed along the short sides of the mounting portion 21. ), An outer frame portion 23 that is formed so as to connect the two connecting portions 22 and surround the periphery of the mounting portion 21, and two arm portions 25 a and 25 b (arms) that connect the mounting portion 21 and the connecting portion 22. Part 25).

In the second pedestal 20, the arm portion 25 connects the mounting portion 21 and the connecting portion 22 provided so as to face the short side of the mounting portion 21, and the arm portion 25 is formed in a substantially S shape. Has been done.
The arm portion 25 of the second pedestal has an S-shape that is narrower and smoother than the arm portion 15 of the first pedestal 10, and has a longer overall length than the linear shape. , Which makes it easier to absorb vibration.

  Also in the second pedestal 20, the connecting portion 22 is formed thicker than the outer frame portion 23, the mounting portion 21 is formed thinner than the outer frame portion, and the arm portion 25 is formed thinner than the mounting portion 21. There is.

The electrode pattern on the second pedestal 20 will be described.
Electrode patterns 27a and 27b are provided diagonally to the mounting portion 21, and the electrode patterns 27a and 27b are connected to the excitation electrodes of the crystal blank 2 by a conductive adhesive.
The electrode pattern 27a is formed on the front surface, the side surface, and the back surface of the arm portion 25a, and is further formed on the front surface, the side surface, and the back surface of the connection portion 22a, and is connected to the electrodes on the substrate by soldering or the like.
Similarly, the electrode pattern 27b is formed over the front surface, the side surface, and the back surface of the arm portion 25b and the connection portion 22b, and is connected to the electrode of the substrate by soldering or the like.
That is, the arm portion 25 of the second pedestal 20 physically and electrically connects the mounting portion 21 and the connecting portion 22.

Here, the electrodes of the mounting portion 21 are provided diagonally, but like the first pedestal 10 described above, the electrodes may be provided along one of the short sides or the long sides, and the mounted crystal is mounted. It may be determined according to the configuration of the piece 2.
Even in this case, the connecting portions 22 are provided at positions facing each other in the pedestal body.

[Effect of second pedestal]
According to the second pedestal 20, the second pedestal 20 is provided with two arm portions 25 formed in a substantially S shape and connecting the mounting portion 21 and the connection portion 22, and the connection portion 22 is thicker than the outer frame portion 23. Since the mounting portion 21 is formed to be thinner than the outer frame portion 23 and the arm portion 25 is formed to be thinner than the mounting portion 21, vibrations from the outside are transmitted to the connecting portion 22. Even in this case, there is an effect that the outer frame portion 23 and the arm portion 25 absorb the vibration to reduce the influence on the mounting portion 21 and improve the phase noise characteristic.

  Particularly, in the second pedestal 20, since the number of the arm portions 25 is reduced, it is difficult for the vibration from the connection portion 22 to be transmitted to the mounting portion 21, and the phase noise characteristic can be further improved.

[Third base: Fig. 5]
Next, a pedestal (third pedestal) according to the third embodiment of the present invention will be described with reference to FIG. 5A and 5B are explanatory views showing the configuration of the third pedestal, FIG. 5A is a plan view in which the vibrating piece is mounted on the third pedestal, and FIG. 5B is a plan view showing the vibrating piece on the third pedestal. It is a long side side side view mounted.
In addition, each of the third to fifth pedestals described below includes a mounting portion, an outer frame portion, and a connecting portion, and since these configurations are similar to those of the first and second pedestals, The arm portion, which is a characteristic portion, will be described.

As shown in FIG. 5, the third pedestal 30 has a configuration in which the mounting portion 31 is surrounded by a frame composed of the connection portion 32 and the outer frame portion 33, and has four arm portions 35a, 35b, 35c, 35d. It is provided with (arm part 35).
Two of them connect the mounting part 31 and the connecting parts 32a and 32b, and another two connect the mounting part 31 and the outer frame part 33.
Like the arm portion 25 of the second pedestal 20, the arm portion 35 of the third pedestal 30 is substantially S-shaped and is formed thinner than the mounting portion 31.

In the third pedestal 30, four arm portions 35 are provided and the four sides of the mounting portion 31 are connected to the connecting portion 32 or the outer frame portion 33.
Specifically, the arm portions 35a and 35b have one ends connected to the ends of the connection portions 32a and 32b, respectively, and the other ends connected to the middle of one side of the mounting portion 31 facing the connection portions.
In addition, each of the arm portions 35c and 35d has one end connected to the middle of the side of the outer frame portion 33 where the connecting portion 32 is not provided, and the other end of the mounting portion 21 that faces the side. (The side where the arm portions 35a and 35b are not connected) is connected.

Thereby, the strength of the third pedestal 30 can be improved as compared with the second pedestal 20.
Although the mounting portion 31 and the main body of the third pedestal 30 are formed in a substantially square shape in FIG. 5, they may be rectangular.

Regarding the thickness of each part of the third pedestal 30, the connecting part 32 is the thickest, and the outer frame part 33, the mounting part 31, and the arm part 35 are thinner in this order.
Therefore, in the third pedestal 30, like the first and second pedestals, the portions other than the connecting portion 32 do not come into contact with the substrate of the package 3.

On the third pedestal 30, electrode patterns 37a and 37b are provided diagonally to the mounting portion 31, and are connected to the excitation electrodes of the crystal blank 2 by a conductive adhesive, respectively.
The electrode pattern 37a is formed on the front surface, the side surface, and the back surface of the arm portion 35a, and further formed over the front surface, the side surface, and the back surface of the connection portion 32a, and is connected to the electrode of the substrate by soldering or the like.
Similarly, the electrode pattern 37b is formed over the front surface, the side surface, and the back surface of the arm portion 35b and the connection portion 32b, and is connected to the electrode of the substrate by soldering or the like.

  That is, the arm portions 35a and 35b of the third pedestal 30 physically and electrically connect the mounting portion 21 and the connecting portion 22, and the arm portions 35c and 35d include the mounting portion 21 and the outer frame portion 33. And are physically connected.

[Effect of the third pedestal]
According to the third pedestal 30, the two arm portions 35a and 35b, which are formed in a substantially S shape and connect the mounting portion 31 and the connecting portion 32 at opposite sides, the mounting portion 31, and the outer frame portion 33. And two arm portions 35c and 35d for connecting with each other at opposite sides, the connection portion 32 is formed to be thicker than the outer frame portion 33, and the mounting portion 31 is formed to be thinner than the outer frame portion 33. Since the arm portion 35 is formed to be thinner than the mounting portion 31, even if external vibration is transmitted to the connection portion 32, the outer frame portion 33 and the arm portion 35 absorb the vibration. As a result, the effect on the mounting portion 31 can be reduced and the phase noise characteristic can be improved.

  Particularly, in the third pedestal 30, since all four sides of the mounting portion 31 are fixed to the connecting portion 32 or the outer frame portion 33, the strength can be improved.

[Fourth pedestal: Fig. 6]
Next, a pedestal (fourth pedestal) according to a fourth embodiment of the invention will be described with reference to FIG. 6A and 6B are explanatory views showing the configuration of the fourth pedestal, FIG. 6A is a plan view in which the vibrating piece is mounted on the fourth pedestal, and FIG. 6B is a plan view showing the vibrating piece on the fourth pedestal. It is a long side side side view mounted.
As shown in FIG. 6, the fourth pedestal 40 is configured to include S-shaped arm portions 45a, 45b, 45c, 45d (arm portion 45), like the third pedestal 30 described above. The mounting position of the mounting portion 41 and the outer frame portion 43 or the connecting portion 42 is different from that of the third pedestal 30.

Specifically, in the fourth pedestal 40, the arm portion 45 is connected to one side of the mounting portion 41 and one side of the outer frame portion 43 or the connecting portion 42 adjacent to the side facing the one side.
The connection of the individual arm portions 45 will be described.
As shown in FIG. 6A, the arm portion 45a includes a connecting portion 42a formed on the left side of the pedestal body and a mounting portion 41 that is adjacent to a side of the mounting portion 41 facing the connecting portion 42a. Is connected to the upper side of.

The arm portion 45b connects the connecting portion 42b formed on the right side of the pedestal body and the lower side of the mounting portion 41, which is a side adjacent to the side of the mounting portion 41 facing the connecting portion 42b. There is.
The arm portion 45c connects the lower side of the outer frame portion 43 and the left side of the mounting portion 41, which is a side adjacent to the side of the mounting portion 41 facing the side.
The arm part 45d connects the upper side of the outer frame part 43 and the right side of the mounting part 41, which is a side adjacent to the side of the mounting part 41 facing the side.

  By forming the arm portion 45 in this manner, in the fourth pedestal 40, the space of the corner portion of the space (gap portion 44) between the mounting portion 41 and the outer frame portion 43 is effectively used. , S-shaped curved portions can be arranged, the length of the arm portion 45 can be secured to sufficiently absorb vibration, and there is an effect that wasteful space can be reduced and the size can be reduced.

Further, in addition to absorbing the vibration from the outside by the arm portion 45, the arm portion 45 can be connected to the corner portion of the mounting portion 41 that is far from the crystal piece 2, so that the influence on the vibration piece 2 can be suppressed. It is possible.
Also in the fourth pedestal 40, as shown in FIG. 6B, the connecting portions 42a and 42b have the largest thickness, and the outer frame portion 43, the mounting portion 41, and the arm portion 45 are formed in this order to be thin. There is.

On the fourth pedestal 40, electrode patterns 47a and 47b are provided diagonally to the mounting portion 41, and are respectively connected to the excitation electrodes of the crystal blank 2 by a conductive adhesive.
The electrode pattern 47a is formed on the front surface, the side surface, and the back surface of the arm portion 45a, and is further formed on the front surface, the side surface, and the back surface of the connection portion 42a, and is connected to the electrodes on the substrate by soldering or the like.
Similarly, the electrode pattern 47b is formed over the front surface, the side surface, and the back surface of the arm portion 45b and the connecting portion 42b, and is connected to the electrode of the substrate by soldering or the like.

  That is, the arm portions 45a and 45b of the fourth pedestal 40 physically and electrically connect the mounting portion 41 and the connecting portion 42, and the arm portions 45c and 45d include the mounting portion 41 and the outer frame portion 43. And are physically connected.

[Effect of fourth pedestal]
According to the fourth pedestal 40, the two arm portions 45a, 45b which are formed in a substantially S shape and which connect one side of the connecting portion 42 and a side adjacent to the side of the mounting portion 41 facing the one side. And two arm portions 45c and 45d that connect one side of the outer frame portion 43 and a side adjacent to the side of the mounting portion 41 that faces the one side, and the connecting portion 42 is more than the outer frame portion 43. Since the mounting portion 41 is formed to be thicker than the outer frame portion 43 and the arm portion 45 is formed to be thinner than the mounting portion 41, vibration from the outside causes the connecting portion 42 to be thick. Even if it is transmitted to the outer frame portion 43 and the arm portion 45, the vibration can be absorbed by the outer frame portion 43 and the arm portion 45 to reduce the influence on the mounting portion 41, and the phase noise characteristic can be improved.

  In particular, according to the fourth pedestal 40, the S-shaped arm portion 45 is disposed by effectively utilizing the corner portion of the gap portion 44, so that a wasteful space is eliminated and the pedestal overall size is reduced. There is an effect that can be.

[Fifth pedestal: Fig. 7]
Next, a pedestal (fifth pedestal) according to a fifth embodiment of the invention will be described with reference to FIG. 7. 7A and 7B are explanatory views showing the configuration of the fifth pedestal, FIG. 7A is a plan view in which a vibrator is mounted on the fifth pedestal, and FIG. 7B is AA ′ of FIG. It is a section explanatory view.
As shown in FIG. 7, the fifth pedestal 50 has a configuration including linear arm portions 55a, 55b, 55c, 55d (arm portions 55), and the arm portion 55 includes each side of the pedestal body, The sides of the mounting portion 51 facing each side are obliquely connected.

Specifically, the arm portion 55a connects the connecting portion 52a and the side of the mounting portion 51 facing it, and the arm portion 55b connects the connecting portion 52b and the side of the mounting portion 51 facing it. ..
The arm portion 55c connects the lower side of the outer frame portion 53 and the lower side of the mounting portion 51 facing it, and the arm portion 55d faces the upper side of the outer frame portion 53 and it. It connects to the upper side of the mounting portion 51.

Further, as a feature of the fifth pedestal 50, the arm portion 55 obliquely connects the mounting portion 51 and the connecting portion 52 or the outer frame portion 53 at the same angle.
By connecting diagonally, the length of the arm portion 55 can be made longer than in the case of connecting at a right angle, and even when vibration is transmitted from the substrate of the package 3 to the connecting portion 52, it is absorbed by the arm portion 5. Thus, the influence on the mounting portion 51 can be prevented.

Further, since the arm portion 55 has a linear shape, the arm portion 55 can be arranged without making the space of the clearance 54 too wide, and the size can be reduced.
Further, as shown in FIG. 7B, also in the fifth pedestal 50, the connecting portion 52 has the largest thickness, and then the outer frame portion 53, the mounting portion 51, and the arm portion 55 are formed in this order.

In the fifth pedestal 50, electrode patterns 57a and 57b are provided diagonally to the mounting portion 51, and are connected to the excitation electrodes of the crystal blank 2 by a conductive adhesive, respectively.
The electrode pattern 57a is formed on the front surface, the side surface, and the back surface of the arm portion 55a, and is further formed on the front surface, the side surface, and the back surface of the connection portion 52a, and is connected to the electrodes on the substrate by soldering or the like.
Similarly, the electrode pattern 57b is formed over the front surface, the side surface, and the back surface of the arm portion 55b and the connection portion 52b, and is connected to the electrode of the substrate by soldering or the like.

[Effect of the fifth pedestal]
The fifth pedestal 50 includes the four arm portions 55 that obliquely connect one side of the connecting portion 52 or the outer frame portion 53 and one side of the mounting portion 51 facing the one side at a constant angle. The connecting portion 52 is formed to be thicker than the outer frame portion 53, the mounting portion 51 is formed to be thinner than the outer frame portion 53, and the arm portion 55 is a pedestal formed to be thinner than the mounting portion 51. Therefore, even if the vibration from the outside is transmitted to the connection portion 52, the outer frame portion 53 and the arm portion 55 absorb the vibration to reduce the influence on the mounting portion 51 and improve the phase noise characteristic. There is.

  INDUSTRIAL APPLICABILITY The present invention is suitable for a pedestal for a vibrating element, a vibrator, and an oscillator that can suppress the influence of external vibrations, improve vibration resistance, and improve phase noise characteristics.

  2 ... Vibration piece (crystal piece) 3 ... Package, 4 ... Seam ring, 5 ... Lid, 6 ... Solder, 10 ... First pedestal, 11, 21, 31, 41, 51 ... Mounting part, 12, 22, 32 , 42, 52 ... Connection part, 13, 23, 33, 43, 53 ... Outer frame part, 14, 24, 34, 54 ... Gap part, 15, 25, 35, 45, 55 ... Arm part, 17, 27, 37, 47, 57 ... Metal pattern, 20 ... Second pedestal, 30 ... Third pedestal, 40 ... Fourth pedestal, 50 ... Fifth pedestal

Claims (8)

A pedestal for a vibrating element equipped with a vibrating element,
A rectangular mounting part on which the vibration element is mounted,
A plurality of connecting parts for connecting to the substrate of the package,
An outer frame portion arranged around the mounting portion with a gap, connecting the plurality of connection portions,
A plurality of arm portions connecting one side of the mounting portion and one side of the outer frame portion or the connection portion,
The connection portion is formed thicker than the outer frame portion,
The mounting portion is formed to be thinner than the outer frame portion,
A pedestal characterized in that the arm portion is formed to be thinner than the mounting portion.   The arm portion is formed in a substantially S-shape, connects one side of the outer frame portion or the connection portion to an end portion of one side of the mounting portion facing the one side, and has four arms corresponding to each end portion of the one side. The pedestal according to claim 1, wherein the pedestal is provided.   The pedestal according to claim 1, wherein the arm portion is formed in a substantially S-shape, and one side of the connecting portion is connected to one side of the mounting portion facing the one side, and two arm portions are provided.   The arm portion is formed in a substantially S-shape and connects two sides of the connection portion and one side of the mounting portion facing the one side, one side of the outer frame portion and one side of the mounting portion facing the one side. The pedestal according to claim 1, further comprising:   The arm portion is formed in a substantially S shape, and connects two sides of the connection portion and one side adjacent to the one side of the mounting portion facing the one side, and one side of the outer frame portion facing the one side. The pedestal according to claim 1, further comprising: two pieces that connect one side adjacent to one side of the portion.   The arm part is formed in a linear shape by obliquely connecting one side of the outer frame part or the connecting part and one side of the mounting part facing the one side at a certain angle, and is formed in a linear shape. The pedestal according to claim 1, which is provided with a book.   A vibrator comprising the pedestal according to any one of claims 1 to 6 mounted with a vibrating element and installed in a package.   An oscillator, comprising: the pedestal according to any one of claims 1 to 6; and a vibration element mounted on the pedestal of the package. The oscillating circuit is mounted on the recess of the back surface of the package.