JP2020072296A - Pedestal for vibration element, vibrator, and oscillator - Google Patents

Abstract

To provide a pedestal for vibration element, vibrator and oscillator, capable of achieving high vibration resistance and high phase noise characteristics by suppressing an influence of vibration from the outside.SOLUTION: The pedestal for vibration element includes: a loading part 11 with a crystal piece 2; four connection parts 14 provided at the outside of each corner in the loading part 11 and connected with a substrate in a package; and a junction part 13 for joining the loading part 11 to the connection part 14. The junction part 13 is thinner than the loading part 11 and the bottom face of the loading part 11 and the bottom face of the junction part 13 are on the same plane, and the bottom face of the junction part 13 is connected with a surface of the connection part 14. Each of the vibrator and the oscillator is provided with the pedestal for vibration element.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a pedestal on which a vibrating element is mounted, and more particularly, to a pedestal, a vibrator, and an oscillator for a vibrating element that can improve resistance to external vibration and have good phase noise characteristics.

[Conventional technology]
In a conventional crystal resonator, a structure using a pedestal mainly made of crystal (crystal pedestal) is known as a structure for suppressing the influence on the crystal piece from the package and the outside of the package.
Further, there is a crystal oscillator in which the package has an H structure in which concave portions are formed on the front and back sides, a crystal piece and a crystal pedestal are mounted on the front side, and an IC (Integrated Circuit) of an oscillation circuit is mounted on the back side.
There is a temperature-compensated crystal oscillator (TCXO: Temperature Compensated Crystal Oscillator) in which a temperature compensation circuit is provided on the front surface or the back surface of the package.

[Related technology]
As related prior arts, Japanese Patent No. 3017750 "Crystal resonator" (Patent Document 1), Japanese Patent No. 4715252 "Piezoelectric vibrator" (Patent Document 2), Japanese Patent Laid-Open No. 2013-098678 "Crystal Vibration" Child ”(Patent Document 3).

  In Patent Document 1, a recess is formed on a holding crystal plate at a position where the resonator crystal piece is mounted, and the resonator crystal piece is surely excited in a gap formed by the recess. A crystal unit that does not generate thermal stress at room temperature is shown.

Patent Document 2 discloses a piezoelectric vibrator including a spring portion having a gap in order to reduce the influence of thermal expansion in the substrate.
Patent Document 3 discloses a crystal resonator configured to prevent deformation of the crystal piece due to temperature change and to obtain good frequency-temperature characteristics.

Japanese Patent No. 3017750 Japanese Patent No. 4715252 JP, 2013-098678, A

  However, in the crystal pedestal in the conventional crystal oscillator or crystal oscillator, there is a problem that external vibration affects the crystal piece, and the vibration deteriorates the phase noise characteristic.

  In addition, in Patent Documents 1 to 3, the thickness of an electrode portion that comes into contact with a substrate such as a ceramic is increased, the mounting portion on which a crystal piece is mounted is thinned and floated from the substrate, and a portion connecting the electrode portion and the mounting portion is disclosed. There is no description of a structure for further improving the anti-vibration property against external vibration.

  The present invention has been made in view of the above circumstances, and it is possible to improve the anti-vibration characteristics by suppressing the influence of external vibration, improve the phase noise characteristics, and improve the shock resistance. An object is to provide a pedestal for a device, a vibrator, and an oscillator.

  The present invention for solving the above-mentioned problems of the conventional example is a pedestal for a vibrating element on which a vibrating element is mounted, and the mounting portion on which the vibrating element is mounted, and the outside of each corner of the mounting portion are provided. And a connecting part for connecting the mounting part and the connecting part, wherein the connecting part is thinner than the mounting part, and the bottom surface of the mounting part and the bottom surface of the connecting part are It is the same plane, and the bottom surface of the connecting portion is connected to the surface of the connecting portion.

  The present invention is characterized in that, in the pedestal, the connecting portion is curved so as to surround the corner portion apart from the corner portion of the mounting portion.

  The present invention is characterized in that, in the pedestal, the connecting portion is formed in a fan shape from a corner portion of the mounting portion.

  The present invention is characterized in that, in the above-mentioned pedestal, the connecting portion is connected by an extending portion along a long side or a short side of the mounting portion.

  The present invention is characterized in that, in the above-mentioned pedestal, the connecting portions are separated from each other.

  The present invention is characterized in that, in a vibrator, a vibrating element is mounted on the pedestal and is installed in a package.

  The present invention is characterized in that, in the oscillator, the oscillating element is mounted on the pedestal, the oscillating element is installed in the recess on the front surface of the package, and the oscillating circuit is mounted on the recess on the back surface of the package.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting part in which a vibration element is mounted, four connection parts provided outside the corners of the mounting part and connected to the board in the package, and the mounting part and the connection part are connected. For a vibrating element in which the connecting portion is thinner than the mounting portion, the bottom surface of the mounting portion and the bottom surface of the connecting portion are on the same plane, and the bottom surface of the connecting portion is connected to the surface of the connecting portion. Since the pedestal is used, even if external vibration is transmitted to the connecting portion, the connecting portion absorbs the vibration and the effect on the mounting portion can be reduced.

It is a plane explanatory view of a 1st pedestal and a vibrating piece. It is a side surface explanatory view of a 1st pedestal and a resonator element. It is a schematic diagram of a 1st pedestal and a vibrating piece. It is a bottom schematic diagram of the 1st pedestal. It is a plane explanatory view of a 2nd base and a vibrating piece. It is a side surface explanatory view of a 2nd base and a vibrating piece.

Embodiments of the present invention will be described with reference to the drawings.
[Outline of Embodiment]
A pedestal (main pedestal) according to the embodiment of the present invention is provided with a mounting portion on which a vibrating element such as a crystal element is mounted, and four mounting portions provided outside the respective corners of the mounting portion and connected to a substrate in a package. A connecting portion and a connecting portion connecting the mounting portion and the connecting portion are provided, the connecting portion is thinner than the mounting portion, the bottom surface of the mounting portion and the bottom surface of the connecting portion are on the same plane, and the bottom surface of the connecting portion is connected. Even if external vibration is transmitted to the connection part, it is absorbed by the connection part to reduce the influence on the mounting part and improve the phase noise characteristic. It is possible.

The vibrator according to the embodiment of the present invention (main vibrator) is one in which a vibrating element is mounted on the main pedestal, and the main pedestal is installed in a package having a recess.
Further, the oscillator according to the embodiment of the present invention (the present oscillator) is one in which an oscillation circuit is mounted in the recess on the back surface of the package of the present oscillator.
The main pedestal includes a first pedestal and a second pedestal as described later.

[First pedestal: Figures 1 to 4]
Next, a first pedestal (first pedestal) according to the embodiment of the present invention will be described with reference to FIGS. 1 is a plan view of a first pedestal and a vibrating piece, FIG. 2 is a side view of a first pedestal and a vibrating piece, and FIG. 3 is a schematic view of the first pedestal and a vibrating piece. 4 is a schematic bottom view of the first pedestal.
As shown in FIG. 1, the first pedestal 1 has a rectangular mounting portion 11, a connecting portion 13 that expands in a fan shape outward at a corner of the mounting portion 11, and a connection that is connected to the mounting portion 11 by the connecting portion 13. And a section 14.
The first pedestal and the second pedestal described later are integrally formed by etching or the like.

The connection portion 14 is curved so as to surround the corner portion (which is rounded in FIG. 1) of the mounting portion 11, and the bottom surface of the curved portion is provided on the substrate. It is connected with solder etc.
That is, the connecting portions 14 form the four corners of the main body of the first pedestal, and have a rounded and curved shape in FIG. 1, but may have an L-shape with corners, or the mounting portion 11 of the mounting portion 11. It may have a linear shape that is oblique to the corner.

  The connecting portion 14 is connected by the extending portions 14a and 14b along the long side or the short side of the mounting portion 11, and therefore, the extending portion 14a is provided outside the long side of the mounting portion 11. Thus, the gaps 12a and 12b are formed, and the extending portion 14b is provided outside the short side of the mounting portion 11, so that the gaps 12c and 12d are formed. The gaps 12a, 12b, 12c, 12d penetrate the main body of the first pedestal.

  Further, as shown in FIGS. 2 to 4, the connecting portion 13 is formed thinner than the mounting portion 11, and the bottom surface of the mounting portion 11 and the bottom surface of the connecting portion 13 are flush with each other. Therefore, the surface of the connecting portion 13 is one step lower than the surface of the mounting portion 11.

The bottom surface of the connecting portion 13 is connected to the surface of the connecting portion 14. That is, the surface of the connecting portion 14 is two steps lower than the mounting portion 11 and one step lower than the connecting portion 13.
As a result, even if the bottom surface of the connecting portion 14 is connected to the substrate in the package, a space is formed below the mounting portion 11 and the vibration from the substrate is not directly transmitted to the mounting portion 11. ..

Since the thickness of the connecting portion 13 is smaller than the thickness of the connecting portion 14 and the mounting portion 11, even if vibration is applied to the connecting portion 14 from the outside, the connecting portion 13 absorbs the vibration and reduces the vibration. Therefore, the influence of the vibration generated outside on the crystal piece 2 mounted on the mounting portion 11 is reduced.
In FIG. 2, the connecting portion 13 is the thinnest, and the connecting portion 14 and the mounting portion 11 are thicker in this order.

  Further, by making the thickness of the connecting portion 13 thin, the connecting portion 13 is configured to have flexibility with respect to stress, and it is easy to absorb the influence of vibration. Further, by making the mounting portion 11 thicker than the connecting portion 13 and increasing the rigidity, it is possible to prevent the mounting portion 11 itself from being deformed due to the stress from the plurality of connecting portions 13. Thereby, generation of stress between the mounting portion 11 and the crystal piece 2 can be suppressed, and vibration resistance and impact resistance can be improved.

The first pedestal 1 is formed of, for example, a resin such as heat-resistant plastic, glass, or an insulating material such as metal having an insulating film coated on its surface.
Further, the first pedestal 1 may be formed of a crystal similar to the vibrating piece (crystal piece) 2 (the same AT cut or Z plate as the crystal piece 2). In that case, the thermal expansion coefficients of the pedestal 1 and the crystal piece 2 are substantially equal to each other, and stress due to temperature change does not occur.

Further, on the first pedestal 1, electrode patterns 10a and 10b connected to the excitation electrodes of the crystal piece 2 are formed. The electrode patterns 10a and 10b are formed of a thin film of a conductive metal such as gold.
The electrode pattern 10a has a substantially fan-shaped pattern in which the conductive adhesive 4 is applied to the upper left portion of the mounting portion 11 that overlaps with the crystal blank 2, and the upper left side connection is made through the upper left connecting portion 13 connected to the electrode pattern 10a. The part 14 is formed.

The electrode pattern 10b has a substantially fan-shaped pattern in which the conductive adhesive 4 is applied to the lower right portion of the mounting portion 11 that overlaps with the crystal piece 2, and the lower right portion is connected via the lower right connecting portion 13 connected thereto. The side connection portion 14 is formed.
The metal patterns 10a and 10b may be formed diagonally on the first pedestal 1, and the metal pattern 10a may be formed on the lower left side and the metal pattern 10b may be formed on the upper right side.
Furthermore, the metal patterns 10a and 10b may be formed so as to be biased to one short side or one long side.

The metal patterns 10a and 10b are also formed on a part of the side surface of the mounting portion 11, the side surface and the bottom surface of the connecting portion 13 and the connecting portion 14.
The metal patterns 10a and 10b on the bottom surface of the connection portion 14 are configured to be connected to the electrodes formed on the substrate in the package with a conductive adhesive.

As the vibration element mounted on the first pedestal 1, a crystal resonator made of an AT-cut crystal piece 2 is used. For example, a surface acoustic wave (SAW: Surface Acoustic Wave) resonator, other piezoelectric vibrators, An oscillation element (vibration element) such as a micro electro mechanical system (MEMS) oscillator may be used.
Excitation electrodes are formed on the front surface and the back surface of the crystal piece 2 and are connected to the electrode patterns 10a and 10b of the first pedestal 1 with a conductive adhesive 4.

Further, the first pedestal 1 on which the crystal piece 2 is mounted is housed and installed in a package.
The package is made of ceramic or the like.
The package has a concave portion formed on the front surface side, but has a substantially H-shaped cross section with a concave portion formed on the rear surface side, and the pedestal 1 and the crystal piece 2 are housed and arranged in the front surface concave portion. An oscillator may be formed by accommodating and mounting an oscillator circuit in the.
The mounting of the first pedestal 1 and the oscillation circuit on the package is fixed by soldering or the like.

  The oscillator circuit (IC) is housed in the recess on the back surface of the package and mounted on the bottom surface of the recess. A temperature compensation circuit other than the IC may be provided on the front surface substrate or the back surface substrate of the package. When the temperature compensating circuit is provided, it becomes a temperature compensating type crystal oscillator (TCXO).

Also, a seam ring is formed around the surface of the package.
The seam ring is formed of silver (Ag) wax or the like around the surface of the package in order to perform the seam sealing.
Then, a lid serving as a lid of the package is formed so as to adhere to the seam ring. As the lid, Kovar plated with nickel is used.

[Second pedestal: Figures 5 and 6]
Next, a second pedestal (second pedestal) according to the embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a plan view of the second pedestal and the vibrating piece, and FIG. 6 is a side view of the second pedestal and the vibrating piece.
As shown in FIGS. 5 and 6, the second pedestal is almost the same as the first pedestal, except that the adjacent connecting portions 14 are not connected by the extending portions 14a and 14b, and are not individually connected. It is a point that is separated into.
Therefore, the through holes of the gaps 12a, 12b, 12c, 12d in the first pedestal are eliminated, and the open portions 12a ', 12b', 12c ', 12d' are opened.

  In the second pedestal, the extending portions 14a and 14b of the first pedestal are removed, and the individually separated connecting portions 14 are connected to only the corners of the mounting portion 11 via the connecting portions 13. Since the connecting portion 14 is more likely to disperse external vibration than the first pedestal in which the connecting portion 14 is connected by the extending portions 14a and 14b, the extending portions 14a and 14b are in contact with the package substrate. Therefore, there is an effect that the phase noise characteristic can be improved because it is hardly affected by the vibration from the outside.

  In the first pedestal and the second pedestal, the connecting portion 13 is composed of a fan-shaped flat plate, but the flat plates may be stacked and shifted to form a multi-stage structure.

[Effect of Embodiment]
According to the first pedestal and the second pedestal, the mounting portion 11 on which the crystal piece 2 is mounted, and the four connecting portions 14 provided outside the respective corners of the mounting portion 11 and connected to the substrate in the package And a connecting portion 13 that connects the mounting portion 11 and the connecting portion 14, the connecting portion 13 is thinner than the mounting portion 11, and the bottom surface of the mounting portion 11 and the bottom surface of the connecting portion 13 are the same plane, Since it is assumed that the bottom surface of the portion 13 is connected to the surface of the connection portion 14, even if external vibration is transmitted to the connection portion 14, it is absorbed by the connection portion 13 to reduce the influence on the mounting portion 11, This has the effect of improving the phase noise characteristic.

  INDUSTRIAL APPLICABILITY The present invention is suitable for a pedestal for a vibrating element, a vibrator, and an oscillator that can suppress the influence of external vibration to improve vibration resistance and improve phase noise characteristics.

  DESCRIPTION OF SYMBOLS 1 ... Pedestal, 2 ... Vibrating piece (quartz piece), 4 ... Conductive adhesive, 10a, 10b ... Electrode pattern, 11 ... Mounting part, 12a, 12b, 12c, 12d ... Gap part, 12a ', 12b', 12c ', 12d' ... open part, 13 ... connecting part, 14 ... connecting part, 14a, 14b ... extended part

Claims (7)

A pedestal for a vibrating element equipped with a vibrating element,
A mounting part on which a vibration element is mounted,
Four connecting portions provided outside each corner of the mounting portion and connected to the substrate in the package;
A connecting portion that connects the mounting portion and the connecting portion,
The connecting portion is thinner than the mounting portion, the bottom surface of the mounting portion and the bottom surface of the connecting portion are on the same plane, and the bottom surface of the connecting portion is connected to the surface of the connecting portion. pedestal.   The pedestal according to claim 1, wherein the connecting portion is curved so as to surround the corner portion apart from the corner portion of the mounting portion.   The pedestal according to claim 1 or 2, wherein the connecting portion is formed in a fan shape from a corner portion of the mounting portion.   The pedestal according to any one of claims 1 to 3, wherein the connecting portion is connected by an extending portion along a long side or a short side of the mounting portion.   The pedestal according to any one of claims 1 to 3, wherein the connecting portions are separated from each other.   A vibrator comprising a pedestal according to any one of claims 1 to 5 and a oscillating element mounted in the package.   An oscillator, comprising: the pedestal according to any one of claims 1 to 5; and a vibration element mounted on the pedestal of the package;