JP2019220938A - Base, vibrator and oscillator - Google Patents

Abstract

To provide a base, vibrator and oscillator, capable of achieving high phase noise characteristic by preventing vibration from the outside.SOLUTION: The base for vibration element, installed with a vibration element 2 and installed on a package 3, includes: a loading part 11 installed with a vibration element 2 and a plurality of skewer-type parts 12 connecting the loading part 11 with the package 3. The skewer-type part 12 serves as a base with an annular parts 123 formed in an annular shape; therefore even if vibration from the outside is applied to the package 3, vibration is absorbed by the annular part 123 of the skewer-type part 12 to prevent vibration from being transmitted to the loading part 11.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a pedestal, a vibrator, and an oscillator, and more particularly, to a pedestal, a vibrator, and an oscillator that can prevent external vibration and improve phase noise characteristics.

2. Description of the Related Art In a conventional crystal unit, a configuration using a pedestal (quartz pedestal) mainly made of crystal is known as a configuration for suppressing an influence on a package and a crystal piece from the outside of the package.
There is also a crystal oscillator in which a package has an H structure in which a concave portion is formed on the front and back sides, a crystal piece and a crystal pedestal are mounted on the front side, and an IC (Integrated Circuit) of an oscillation circuit is mounted on the back side.
There is a temperature compensated crystal oscillator (TCXO: Temperature Compensated Crystal Oscillator) provided with a temperature compensation circuit on the front surface or the back surface of the package.

[Related technology]
As related prior art, Japanese Patent No. 3017750, “Crystal Resonator” (Patent Document 1), Japanese Patent No. 4,715,252, “Piezoelectric Vibrator” (Patent Document 2), and Japanese Patent Application Laid-Open No. 2013-098678 “Quartz Crystal Vibration” (Patent Document 3) and Japanese Patent Application Laid-Open Publication No. 2005-528829, "Support Structure with Low Acceleration Sensitivity for Quartz Crystal Resonator" (Patent Document 4).

  In Patent Document 1, a concave portion is formed at a position where a crystal unit for a resonator is mounted on a holding crystal plate, and the crystal unit for a resonator is reliably excited in a gap formed by the concave portion. 1 shows a quartz oscillator that does not generate stress due to heat in the crystal resonator.

Patent Literature 2 discloses a piezoelectric vibrator including a spring portion having a gap in order to reduce the influence of thermal expansion on a substrate.
Patent Literature 3 discloses a crystal resonator having a configuration in which deformation of a crystal piece due to a temperature change is prevented and good frequency-temperature characteristics are obtained.
Patent Literature 4 discloses that an annular buffer member is provided on a pedestal, and a crystal member is held by a connecting member connected to the buffer member.

Japanese Patent No. 3017750 Japanese Patent No. 4715252 JP 2013-098678 A JP 2005-528829 A

  However, the crystal pedestal used in the above-described conventional crystal unit and crystal oscillator has a problem that external vibration affects the crystal blank and the vibration deteriorates the phase noise characteristic.

  Patent Documents 1 to 4 do not disclose a pedestal having an annular portion around a mounting portion on which a vibration element is mounted and having a plurality of skewer portions connecting the mounting portion and the package. .

  The present invention has been made in view of the above situation, and has as its object to provide a pedestal, a vibrator, and an oscillator capable of preventing external vibration and improving phase noise characteristics.

  The present invention for solving the problems of the above conventional example is a pedestal for a vibration element mounted with a vibration element, mounted on a package, and a mounting portion on which the vibration element is mounted, formed in an annular shape. It is characterized by having an annular portion and a plurality of skewer portions connecting the mounting portion and the package.

  Further, according to the present invention, in the pedestal, the skewer portion includes a connecting portion connected to the package and a first connecting portion connected to the mounting portion, the thickness of the connecting portion is smaller than that of the mounting portion. An annular portion is formed between the connecting portion and the connecting portion.

  Further, the present invention is characterized in that, in the pedestal, the skewer portion is formed so as to be connected to four sides of the mounting portion.

  Further, the invention is characterized in that, in the pedestal, the annular portion is substantially rectangular or substantially elliptical.

  Further, according to the present invention, in the pedestal, the skewer portion includes a second connecting portion provided between the annular portion and the connection portion, and the connection portion is substantially formed on a side of the mounting portion to which the skewer portion is connected. It is characterized by being formed so as to extend in parallel.

  Further, the present invention is characterized in that, in the pedestal, the mounted vibrating element is a round crystal piece that outputs a frequency of 15 MHz or less.

  Further, the present invention is characterized in that, in the vibrator, a vibrating element is mounted on the pedestal described in any one of the above, and is installed on a step formed inside a concave portion on the surface of the package.

  Further, according to the present invention, in the oscillator, the vibrating element is mounted on the pedestal according to any one of the above, installed on a step formed inside the concave portion on the front surface of the package, and the oscillation circuit is mounted on the concave portion on the back surface of the package. It is characterized by:

  According to the present invention, a vibration element is mounted, a pedestal for a vibration element to be installed in a package, the mounting section on which the vibration element is mounted, having a ring-shaped annular portion, the mounting section The pedestal has a plurality of skewers that connect to the package, so even if external vibration is applied to the package, the contact area with the package is small and vibration is difficult to be transmitted. It is possible to prevent the vibration from being transmitted to the mounting portion by absorbing the vibration, thereby suppressing the influence on the vibration element, stabilizing the output frequency, and improving the phase noise characteristic.

  Further, according to the present invention, the skewer portion has the second connecting portion provided between the annular portion and the connection portion, and the connection portion is substantially parallel to a side of the mounting portion to which the skewer portion is connected. Since the pedestal is formed to extend, a large connection portion with the package can be secured, and even when a large crystal piece is mounted, the pedestal can be stably fixed to the package.

It is a schematic diagram of this oscillator. It is a surface explanatory view of this pedestal. FIG. 4 is an explanatory view of a long side of the pedestal. It is a short side side explanatory view of this pedestal. It is a back surface explanatory view of this pedestal. It is a surface perspective view of this pedestal. It is a back surface perspective view of this pedestal. It is step explanatory drawing which shows the state which mounted this pedestal in the package. It is surface explanatory drawing of another pedestal. FIG. 9 is a side view illustrating a vibrating element mounted on another pedestal. It is a surface perspective view of another pedestal. It is sectional explanatory drawing which shows the state which mounted another pedestal in the package.

An embodiment of the present invention will be described with reference to the drawings.
[Summary of Embodiment]
The pedestal (main pedestal) according to the embodiment of the present invention is a pedestal for a vibration element to be installed in a package, and connects the mounting section and the package around a mounting section on which the vibration element is mounted, It is provided with a plurality of skewer portions having an annular portion, absorbing external vibrations by the skewer portion, suppressing transmission of vibration to the mounting portion, and preventing influence on the vibration element. The phase noise characteristic can be improved.

  Further, in the vibrator according to the embodiment of the present invention (the main vibrator), a vibrating element is mounted on the pedestal and mounted on a step formed on the inner side surface of the concave portion on the surface of the package.

  The oscillator according to the embodiment of the present invention (the present oscillator) has a vibration element mounted on the pedestal, mounted on a step formed on the inner side surface of the concave portion on the front surface of the package, and oscillated on the concave portion on the rear surface of the package. It is equipped with a circuit.

  In the following description, a crystal unit and a crystal oscillator having a crystal piece mounted on a pedestal made of crystal will be described as an example. The mounted vibration element is a surface acoustic wave (SAW). An oscillation element (vibration element) such as a SAW resonator having electrodes, another piezoelectric vibrator, or a micro electro mechanical system (MEMS) vibrator may be used.

[Schematic configuration of this oscillator: Fig. 1]
A schematic configuration of the present oscillator will be described with reference to FIG. FIG. 1 is a schematic diagram of the present oscillator.
As shown in FIG. 1, this oscillator includes a pedestal 1, a crystal blank 2 mounted on the pedestal 1, a package 3 for accommodating the pedestal 1 in a surface concave portion and mounting the pedestal 1 on a bottom surface (substrate) of the concave portion, 3 basically includes an oscillation circuit (IC) 4 mounted in the concave portion on the back surface, a seam ring 5 formed around the surface of the package 3, and a lid 6 serving as a lid.

[Each part of this oscillator]
Each part of the present oscillator will be specifically described.
The pedestal (main pedestal) 1 is formed of, for example, an insulating material such as a resin such as a heat-resistant plastic, glass, or a metal having an insulating film coated on the surface.
The pedestal 1 may be formed of the same crystal as the crystal blank 2 (the same AT cut and Z plate as the crystal blank 2). In this case, the thermal expansion coefficients of the pedestal 1 and the crystal blank 2 are substantially equal, and no stress occurs due to a temperature change. Details of the pedestal 1 will be described later.

The crystal blank 2 is a vibration element having excitation electrodes formed on both surfaces, and is mounted on the pedestal 1 by being fixed with a conductive adhesive. In FIG. 1, the excitation electrodes and the like are omitted.
Excitation electrodes are formed on the front and back surfaces of the crystal blank 2 and are connected to the electrode pattern of the pedestal 1 with a conductive adhesive.
In this embodiment, the quartz piece 2 is used as the vibration element mounted on the pedestal 1. However, for example, a surface acoustic wave (SAW) resonator, another piezoelectric resonator, or a microelectromechanical system is used. (MEMS: Micro Electro Mechanical Systems) An oscillation element (oscillation element) such as an oscillator may be used.

The package 3 is formed of ceramics or the like, has an H-shaped cross section in which concave portions are formed on both front and rear surfaces, and the bottom surface of each concave portion is a substrate. The pedestal 1 is housed in the recess on the front surface, the pedestal 1 is mounted on the bottom surface (substrate) of the recess, and the oscillation circuit 4 is housed and mounted on the recess on the back surface.
Further, in the present oscillator, a step portion 31 is formed on the inner side surface of the concave portion of the surface of the package 3. As will be described later, the skewer portion of the pedestal 1 is mounted on the step portion 31 and fixed by solder or the like. It is supposed to be.
Further, an electrode is formed on the step portion 31, and the electrode is connected to an electrode of a substrate corresponding to the bottom surface of the package 3 via the inside and side surfaces of the package 3.

  The oscillation circuit (IC) 4 is housed in a concave portion on the back surface of the package 3 and mounted on the bottom surface (substrate) of the concave portion. In addition, a temperature compensation circuit may be provided on the front substrate or the rear substrate of the package 3 in addition to the IC 4. When a temperature compensation circuit is provided, the temperature compensation type crystal oscillator (TCXO) is obtained.

The seam ring 5 is formed of silver (Ag) brazing or the like around the surface of the package 3 to perform seam sealing.
The lid 6 serves as a lid, and is made of, for example, nickel-plated Kovar, and is formed so as to adhere to the seam ring 5.
Note that a configuration in which a crystal blank 2 is mounted on the main base 1 and mounted on a concave portion on the surface of the package 3 is the present crystal resonator.

[Configuration of this pedestal: Figs. 2 to 7]
Next, the configuration of the main pedestal (main pedestal) will be described with reference to FIGS. 2 is an explanatory view of the surface of the pedestal, FIG. 3 is an explanatory view of a long side of the pedestal, FIG. 4 is an explanatory view of a short side of the pedestal, and FIG. FIG. 6 is a front perspective view of the main pedestal, and FIG. 7 is a rear perspective view of the main pedestal.
2 to 4, the electrodes formed on the pedestal and the quartz pieces to be mounted are shown, but the electrodes and the like are omitted in other drawings.

As shown in FIG. 2, the pedestal 1 includes a mounting portion 11 on which the crystal blank 2 is mounted, and four skewer portions 12a, 12b, 12c, and 12d formed around the mounting portion 11. ).
The skewer portion 12 is formed integrally with the mounting portion 11, the skewer portions 12a and 12b are formed in the center of the short side of the mounting portion 11, and the skewer portions 12c and 12d are It is formed at the center of the side.

Here, the skewer portion 12 is a characteristic portion of the pedestal 1, and has a connecting portion 121 connected to the mounting portion 11, a connecting portion 122 connected to the package 3, and a portion between the connecting portion 121 and the connecting portion 122. And an annular portion 123 having a through portion (hole) therein.
The skewer portion 12 absorbs the vibration from the package 3 and suppresses the influence on the mounting portion 11 by dispersing and reducing the vibration transmitted from the package 3 at the annular portion 123 without concentrating it at one point. Thus, the output frequency can be stabilized.
The shape of the annular portion 123 is substantially rectangular or substantially elliptical. The shape of the penetrating portion is also substantially rectangular or substantially elliptical.

  The pedestal 1 is fixed to the step portion 31 formed on the side surface of the concave portion on the surface of the package 3 by the connection portions 122 of the four skewer portions 12. That is, the pedestal 1 is connected to the package 3 only at the tip (the connecting portion 122) of the skewer portion 12 protruding at the center of each side of the mounting portion 11, and floats in the surface recess of the package 3. It is what is kept.

As described above, the pedestal 1 is provided with the skewer portions 12 on the four sides of the mounting portion 11 so that the contact area with the package 3 is reduced, and even when the package 3 is externally vibrated, , The influence on the mounting portion 11 can be suppressed, and the phase noise characteristic can be improved.
Further, as shown in FIGS. 3 and 4, the skewer portion 12 is formed thinner than the thickness of the mounting portion 11, and is configured to be easily deformed. This makes it easier to absorb vibration from the outside, and improves vibration resistance.

  Further, since the mounting portion 11 is formed thicker than the thickness of the skewer portion 12, even if external vibration reaches the mounting portion 11, the mounting portion 11 does not bend (bend). The effect on the crystal blank 2 can be suppressed.

Then, on the surface of the mounting portion 11, metal patterns 13, 14 connected to the excitation electrodes of the crystal blank 2 (indicated by dotted lines in FIG. 2) to be mounted are formed by a thin film of gold or the like.
The metal pattern 13 is provided with a rectangular pattern connected to one of the excitation electrodes of the crystal blank 2 by a conductive adhesive. From the pattern, the surface of the skewer portion 12 c provided on the long side of the main base 1, It is formed over the back surface of the skewer portion 12c via the side surface.
Similarly, the metal pattern 14 is connected to the other excitation electrode of the crystal blank 2 and is formed over the front, side, and back surfaces of the skewer portion 12d formed on the long side of the pedestal 1.

When the pedestal 1 is mounted on the step portion 31 of the package 3 to form a vibrator or an oscillator, the metal patterns 13 and 14 formed on the back surfaces of the connection portions 122 of the skewer portions 12c and 12d include The electrodes formed on the step portion 31 are connected by solder or the like.
Here, the metal patterns 13 and 14 are formed by being drawn to the long side of the main pedestal 1, but may be drawn to the short side.

As shown in FIGS. 3, 4, 6, and 7, the pedestal 1 has a thickness difference between the mounting portion 11 and the skewer portion 12, but the front side is formed flat and the mounting portion 11 is mounted on the back side. 11 is projected.
With this configuration, when the pedestal 1 is mounted on the step portion 31 of the package 3, the mounting portion 11 projects downward and is accommodated in the space of the surface concave portion, and the upper surface becomes flat. Of the present crystal resonator and the overall height of the present oscillator can be reduced.

[Package storage: Fig. 8]
Next, a state where the pedestal 1 is stored in the package 3 will be described with reference to FIG. FIG. 8 is an explanatory diagram showing a state where the base is mounted on a package. In FIG. 8, the crystal blank is omitted, and only the concave portion on the front side of the package 3 is shown.
As shown in FIG. 8, in the present crystal resonator or the present oscillator, the main pedestal 1 is mounted on a step portion 31 formed inside the package 3.
Specifically, an electrode (not shown) formed on the step portion 31 and a metal pattern (not shown) formed on the connection portion 122 of the skewer portion 12 of the pedestal 1 are connected by the solder 32. Is done. Also, the skewer portions 12a and 12b where no metal pattern is formed are fixed to the step portion 31 by soldering.

That is, the annular portion 123, the connecting portion 122, and the mounting portion 11 of the pedestal 1 are supported by only the four points of the connecting portion 121 in the surface concave portion of the package 3, and are floated from the bottom surface of the concave portion as shown in FIG. Is held.
Thus, when vibration is applied to the package 3 from the outside, the skewers 12 reliably absorb the vibration, suppress the transmission of the vibration to the mounting portion 11, and reduce the influence on the crystal blank 2. Can be done.

[Effects of Embodiment]
According to the pedestal according to the present embodiment, it is a pedestal for a vibrating element to be installed in a package, and mounting part 11 and package 3 are mounted on four sides of mounting part 11 on which crystal blank (vibrating element) 2 is mounted. And a pedestal having a skewer portion 12 having an annular portion 123 formed in an annular shape, so that vibrations applied to the package from the outside are dispersed and absorbed by the skewer portion 12, thereby mounting the package. This has the effect of preventing vibration from being transmitted to the section 11 and suppressing the influence on the vibrating element to improve the phase noise characteristic.

  Further, according to the pedestal 1, since the thickness of the skewer portion 12 is formed to be thinner than the thickness of the mounting portion 11, the skewer portion 12 is easily deformed, vibration is easily absorbed, and resistance to vibration is improved. There is an effect that the vibration property can be improved.

  Further, according to the present oscillator and the present oscillator, the crystal piece (oscillation element) 2 is mounted on the main pedestal 1, and the step portion 31 formed on the inner side surface of the concave portion of the surface of the package 3 and the skewer of the main pedestal 1 are formed. Since the connecting portion of the portion 12 is connected, the pedestal 1 and the package 3 can be fixed with a small contact area and the pedestal 1 can be held in a state of being floated in the concave portion, and the influence of vibration from the outside is mounted. This has the effect of preventing transmission to the section 11 and improving the phase noise characteristics.

[Another embodiment: FIGS. 9 to 11]
Next, a pedestal (another pedestal) according to another embodiment of the present invention will be described with reference to FIGS. 9 is a surface explanatory view of another pedestal, FIG. 10 is a side explanatory view in which a vibrating element is mounted on another pedestal, and FIG. 11 is a surface perspective view of another pedestal. The metal patterns are omitted in FIGS.
Note that another pedestal is assumed to mount a round quartz crystal blank having a relatively low output frequency of 15 MHz or less and a size larger than that of a high frequency.
Further, another pedestal can be stably mounted on the package and ensures connection with the electrodes of the package.

As shown in FIG. 9, another pedestal 7 includes a mounting portion 71 and skewer portions 72 a, 72 b, 72 c, and 72 d (skewer portion 72) formed to be connected to each side of the mounting portion 71. Have.
Since the other pedestal 7 mounts a round crystal blank (crystal piece) 20, the mounting portion 71 has a substantially square shape.
The crystal blank 20 is a crystal blank such as an AT cut and is a round crystal blank (a round plate) that outputs a relatively low frequency as described above, and is connected to the mounting portion 71 by the conductive adhesive 21.

The skewer portion 72 which is a characteristic portion of another pedestal 7 will be described.
The skewer portion 72 includes a first connecting portion 73 connected to the mounting portion 71, an annular portion 74 formed in an annular shape, and an annular portion 74 connected to the first connecting portion 73, and a connecting portion 76 connected to an electrode of the package. And a second connecting portion 75 that connects the annular portion 74 and the connecting portion 76.
The annular portion 74 is formed in a substantially rectangular or substantially elliptical shape, and has a through hole (hole) penetrating the front and back.

The connecting portion 122 of the skewer portion 12 of the pedestal 1 described above has a structure in which only the tip is connected to the package, and the portion other than the tip is for connecting the annular portion 123 and the tip. , The skewer 72 of the pedestal 7 includes a connecting portion 76, a connecting portion 76, and a connecting portion 76 and an annular portion. The portion connecting the second member 74 and the second member 74 is a second connecting portion 75.
Another pedestal 7 is also integrally formed by etching.

  The connecting portion 76 of another pedestal 7 is provided substantially parallel to one side of the mounting portion 71 to which the skewer portion 72 is connected and substantially perpendicular to the second connecting portion 75. It is formed substantially equal to the length of the long side. Further, the width of the connection portion 76 is formed so as to be mountable on a step portion of a package described later. The length and width of the connection portion 76 can be set as appropriate.

  In other words, the other pedestal 7 can be stably held even when a large crystal blank 20 is mounted by sufficiently increasing the length of the connecting portion 76 and connecting to the step portion of the package, thereby ensuring electrical connection. It is something that can be.

Also, as shown in FIG. 10, in another pedestal 7, the skewer portion 72 is formed to be thinner than the mounting portion 71.
Therefore, even if the vibration is transmitted from the connecting portion 76 to the skewer portion 72, the vibration is easily absorbed by the annular portion 74, and the influence on the mounting portion 71 can be suppressed.

In another pedestal 7, rectangular metal patterns 81a and 81b connected to the excitation electrodes of the crystal blank 20 are formed of a thin film of gold or the like at the center of the opposite side on the surface of the mounting portion 11.
The metal pattern 81a is formed over the front surface, the side surface, and the back surface of the skewer portion 72a, and is connected from the back surface of the connection portion 76 to an electrode provided at a step portion of the package.
Similarly, the metal pattern 81b is formed over the front surface, the side surface, and the back surface of the skewer portion 72b, and is connected to the electrode of the step portion of the package.

[Package storage: Fig. 12]
Next, a state in which another pedestal 7 is stored in a package will be described with reference to FIG. FIG. 12 is an explanatory cross-sectional view showing a state where another pedestal is mounted on a package.
As shown in FIG. 12, a step portion 31 'is formed on the side surface of the concave portion on the surface of the package 3', and the connection portion 76 of another pedestal 7 is mounted on the step portion 31 ', and the connection portion 76 is formed. And the electrodes (not shown) formed on the step portions 31 ′ are connected by the solder 32.
The skewer portions 72c and 72d on which no metal pattern is formed are also fixed to the step portion 31 'by the solder 32.

  Here, as shown in FIGS. 9 and 11, the connecting portion 76 of the other pedestal 7 is formed to be long along the step portion 31 ', so that the contact area between the package 3' and the connecting portion 76 is sufficient. Even when the crystal piece 20 that outputs a frequency of 15 MHz or less, which is large and heavy compared to the high-frequency use, can be secured widely, the connection between the package 3 ′ and the connection portion 76 is ensured and is stably held. You can do it.

  Incidentally, in the package 3 ′ that accommodates another pedestal 7, the step portion 31 ′ is formed to have a width (width, length) enough to mount the connection portion 76. The step portion 31 'may be formed so as to make a round around the inner side surface of the package 3'.

  In another pedestal 7, even if the area of the connection portion 76 is increased, the skewer portion 72 is formed to be thinner than the mounting portion 71, so that the annular portion 74 that is easily deformed absorbs external vibration. Thus, the influence on the mounting portion 71 and the crystal blank 20 can be reduced, and the phase noise characteristics can be improved.

[Another pedestal effect]
According to another pedestal 7, the mounting portion 71 and the package 3 'are connected to the four sides of the mounting portion 71 on which the crystal element (vibrating element) 20 is mounted, and a skewer having an annular portion 74 formed in an annular shape. Since the mold portion 72 is provided, and the connecting portion 76 of the skewer portion 72 is formed to extend substantially parallel to one side of the mounting portion 71 to which the skewer portion 72 is connected, vibration from the outside is annularly formed. It is dispersed and absorbed by the portion 74, preventing the transmission of vibration to the mounting portion 71, improving the phase noise characteristic, and reducing the contact area between the connecting portion 76 and the step portion 31 'of the package 3'. The base body can be stably fixed to the package 3 'even if the large crystal piece 20 is mounted on the mounting portion 71 even if the size is widened.

  INDUSTRIAL APPLICABILITY The present invention is suitable for a pedestal, a vibrator, and an oscillator that can prevent external vibration and improve phase noise characteristics.

  1, 7: pedestal, 2, 20: crystal piece (vibrating element), 3: package, 4: oscillation circuit, 5: seam ring, 6: lid, 11, 71: mounting part, 12, 72: skewer type part, 13, 14, 81a, 81b: metal pattern, 31: step portion, 73: first connecting portion, 74, 123: annular portion, 75: second connecting portion, 76, 122: connecting portion, 121: connecting portion

Claims (8)

A pedestal for the vibration element on which the vibration element is mounted and installed in the package,
A mounting unit on which the vibration element is mounted,
A pedestal comprising: an annular portion formed in an annular shape; and a plurality of skewer portions connecting the mounting portion and a package.   The skewer portion includes a connecting portion connected to the package and a first connecting portion connected to the mounting portion, and has a thickness smaller than that of the mounting portion, and is annular between the connecting portion and the first connecting portion. The pedestal according to claim 1, wherein a portion is formed.   The pedestal according to claim 1, wherein the skewer portion is formed so as to be connected to four sides of the mounting portion.   The pedestal according to any one of claims 1 to 3, wherein the annular portion is substantially rectangular or substantially elliptical. The skewer portion has a second connecting portion between the annular portion and the connecting portion,
The pedestal according to any one of claims 1 to 4, wherein the connection portion is formed to extend substantially parallel to a side of the mounting portion to which the skewer portion is connected.   The pedestal according to claim 5, wherein the mounted vibration element is a round crystal piece that outputs a frequency of 15 MHz or less.   A vibrator, comprising: a vibrating element mounted on the pedestal according to claim 1; and a vibrating element mounted on a step formed inside a concave portion on the surface of the package.   A vibration element is mounted on the pedestal according to any one of claims 1 to 6, installed on a step formed inside a concave portion on the front surface of the package, and an oscillation circuit is mounted on the concave portion on the back surface of the package. Oscillator.