JPH0327058U - - Google Patents

Info

Publication number
JPH0327058U
JPH0327058U JP1989087764U JP8776489U JPH0327058U JP H0327058 U JPH0327058 U JP H0327058U JP 1989087764 U JP1989087764 U JP 1989087764U JP 8776489 U JP8776489 U JP 8776489U JP H0327058 U JPH0327058 U JP H0327058U
Authority
JP
Japan
Prior art keywords
voltage
phase
emitting element
full
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989087764U
Other languages
English (en)
Japanese (ja)
Other versions
JPH075645Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989087764U priority Critical patent/JPH075645Y2/ja
Publication of JPH0327058U publication Critical patent/JPH0327058U/ja
Application granted granted Critical
Publication of JPH075645Y2 publication Critical patent/JPH075645Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1989087764U 1989-07-25 1989-07-25 フルカラー発光素子 Expired - Fee Related JPH075645Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989087764U JPH075645Y2 (ja) 1989-07-25 1989-07-25 フルカラー発光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989087764U JPH075645Y2 (ja) 1989-07-25 1989-07-25 フルカラー発光素子

Publications (2)

Publication Number Publication Date
JPH0327058U true JPH0327058U (enExample) 1991-03-19
JPH075645Y2 JPH075645Y2 (ja) 1995-02-08

Family

ID=31637404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989087764U Expired - Fee Related JPH075645Y2 (ja) 1989-07-25 1989-07-25 フルカラー発光素子

Country Status (1)

Country Link
JP (1) JPH075645Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015188B1 (ko) * 2008-07-07 2011-02-17 주식회사 마스테코 휴대용 소화기의 압력공급용 밸브

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015188B1 (ko) * 2008-07-07 2011-02-17 주식회사 마스테코 휴대용 소화기의 압력공급용 밸브

Also Published As

Publication number Publication date
JPH075645Y2 (ja) 1995-02-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees