JPS6165766U - - Google Patents
Info
- Publication number
- JPS6165766U JPS6165766U JP1984149901U JP14990184U JPS6165766U JP S6165766 U JPS6165766 U JP S6165766U JP 1984149901 U JP1984149901 U JP 1984149901U JP 14990184 U JP14990184 U JP 14990184U JP S6165766 U JPS6165766 U JP S6165766U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode
- junction
- emits
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984149901U JPS6165766U (enExample) | 1984-10-03 | 1984-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984149901U JPS6165766U (enExample) | 1984-10-03 | 1984-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6165766U true JPS6165766U (enExample) | 1986-05-06 |
Family
ID=30708067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984149901U Pending JPS6165766U (enExample) | 1984-10-03 | 1984-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6165766U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101645443A (zh) * | 2008-08-05 | 2010-02-10 | 三星电子株式会社 | 半导体器件、含该半导体器件的半导体封装及其制造方法 |
-
1984
- 1984-10-03 JP JP1984149901U patent/JPS6165766U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101645443A (zh) * | 2008-08-05 | 2010-02-10 | 三星电子株式会社 | 半导体器件、含该半导体器件的半导体封装及其制造方法 |