JPS6247154U - - Google Patents
Info
- Publication number
- JPS6247154U JPS6247154U JP1985138289U JP13828985U JPS6247154U JP S6247154 U JPS6247154 U JP S6247154U JP 1985138289 U JP1985138289 U JP 1985138289U JP 13828985 U JP13828985 U JP 13828985U JP S6247154 U JPS6247154 U JP S6247154U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- type
- light emitting
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985138289U JPS6247154U (enExample) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985138289U JPS6247154U (enExample) | 1985-09-10 | 1985-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247154U true JPS6247154U (enExample) | 1987-03-23 |
Family
ID=31043130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985138289U Pending JPS6247154U (enExample) | 1985-09-10 | 1985-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247154U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS646054U (enExample) * | 1987-06-30 | 1989-01-13 |
-
1985
- 1985-09-10 JP JP1985138289U patent/JPS6247154U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS646054U (enExample) * | 1987-06-30 | 1989-01-13 |