JPH0456355U - - Google Patents

Info

Publication number
JPH0456355U
JPH0456355U JP1990099123U JP9912390U JPH0456355U JP H0456355 U JPH0456355 U JP H0456355U JP 1990099123 U JP1990099123 U JP 1990099123U JP 9912390 U JP9912390 U JP 9912390U JP H0456355 U JPH0456355 U JP H0456355U
Authority
JP
Japan
Prior art keywords
bare chip
light emitting
light
emitting diode
emitting bare
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990099123U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990099123U priority Critical patent/JPH0456355U/ja
Publication of JPH0456355U publication Critical patent/JPH0456355U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1990099123U 1990-09-21 1990-09-21 Pending JPH0456355U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990099123U JPH0456355U (enExample) 1990-09-21 1990-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990099123U JPH0456355U (enExample) 1990-09-21 1990-09-21

Publications (1)

Publication Number Publication Date
JPH0456355U true JPH0456355U (enExample) 1992-05-14

Family

ID=31840819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990099123U Pending JPH0456355U (enExample) 1990-09-21 1990-09-21

Country Status (1)

Country Link
JP (1) JPH0456355U (enExample)

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