JPH0326536Y2 - - Google Patents
Info
- Publication number
- JPH0326536Y2 JPH0326536Y2 JP1986151651U JP15165186U JPH0326536Y2 JP H0326536 Y2 JPH0326536 Y2 JP H0326536Y2 JP 1986151651 U JP1986151651 U JP 1986151651U JP 15165186 U JP15165186 U JP 15165186U JP H0326536 Y2 JPH0326536 Y2 JP H0326536Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- color
- light emitting
- light
- color light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003086 colorant Substances 0.000 claims abstract description 13
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986151651U JPH0326536Y2 (US08197722-20120612-C00042.png) | 1986-10-01 | 1986-10-01 | |
US07/101,183 US4851824A (en) | 1986-10-01 | 1987-09-24 | Light emitting diode display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986151651U JPH0326536Y2 (US08197722-20120612-C00042.png) | 1986-10-01 | 1986-10-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6358288U JPS6358288U (US08197722-20120612-C00042.png) | 1988-04-18 |
JPH0326536Y2 true JPH0326536Y2 (US08197722-20120612-C00042.png) | 1991-06-07 |
Family
ID=15523229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986151651U Expired JPH0326536Y2 (US08197722-20120612-C00042.png) | 1986-10-01 | 1986-10-01 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4851824A (US08197722-20120612-C00042.png) |
JP (1) | JPH0326536Y2 (US08197722-20120612-C00042.png) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0524948Y2 (US08197722-20120612-C00042.png) * | 1987-08-07 | 1993-06-24 | ||
US5043715A (en) * | 1988-12-07 | 1991-08-27 | Westinghouse Electric Corp. | Thin film electroluminescent edge emitter structure with optical lens and multi-color light emission systems |
US5138347A (en) * | 1988-09-23 | 1992-08-11 | Westinghouse Electric Corp. | Thin film electroluminescent edge emitter structure with optical lens and multi-color light emission systems |
DE3904656A1 (de) * | 1989-02-16 | 1990-08-23 | Vdo Schindling | Zeigerinstrument |
US5036248A (en) * | 1989-03-31 | 1991-07-30 | Ledstar Inc. | Light emitting diode clusters for display signs |
JPH079188Y2 (ja) * | 1989-04-13 | 1995-03-06 | 小糸工業株式会社 | 発光ダイオード表示器 |
JPH02309315A (ja) * | 1989-05-25 | 1990-12-25 | Stanley Electric Co Ltd | カラー表示装置 |
JP2668835B2 (ja) * | 1989-05-30 | 1997-10-27 | ローム 株式会社 | Led表示素子 |
JP2666483B2 (ja) * | 1989-07-19 | 1997-10-22 | 松下電器産業株式会社 | Led表示装置 |
US5083192A (en) * | 1990-04-30 | 1992-01-21 | Kulicke And Soffa Industries, Inc. | Cluster mount for high intensity leds |
CA2078839A1 (en) * | 1991-09-25 | 1993-03-26 | Marc Hoffman | Double refraction and total reflection solid nonimaging lens |
US5613751A (en) | 1995-06-27 | 1997-03-25 | Lumitex, Inc. | Light emitting panel assemblies |
US6712481B2 (en) * | 1995-06-27 | 2004-03-30 | Solid State Opto Limited | Light emitting panel assemblies |
DE19722406B4 (de) * | 1997-05-28 | 2006-01-26 | Elektro Grundler Ges.M.B.H. & Co. Kg | Rettungszeichenleuchte und Sicherheitssystem |
TW408497B (en) * | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
US6570505B1 (en) | 1997-12-30 | 2003-05-27 | Gelcore Llc | LED lamp with a fault-indicating impedance-changing circuit |
US7320632B2 (en) * | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
AUPQ818100A0 (en) | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
US6693514B2 (en) | 2002-03-20 | 2004-02-17 | Rauland-Borg Corporation | Signaling device for annunciating a status of a monitored person or object |
AU2003233248B2 (en) * | 2002-06-14 | 2006-11-09 | Lednium Technology Pty Limited | A lamp and method of producing a lamp |
CA2518625A1 (en) * | 2003-03-12 | 2004-09-23 | Lednium Pty. Ltd. | A lamp and a process for producing a lamp |
DE102005042066A1 (de) * | 2005-09-03 | 2007-03-15 | Osram Opto Semiconductors Gmbh | Hinterleuchtungsanordnung mit in Leuchtgruppen angeordneten Halbleiterlichtquellen |
DE202006014351U1 (de) * | 2006-09-19 | 2007-01-04 | Tridonic Optoelectronics Gmbh | LED-Modul mit RGB LED-Chips |
US20090101922A1 (en) * | 2007-10-22 | 2009-04-23 | Chu-Hsien Lin | Led arrangement for producing pure monochomatic light |
JP4395801B2 (ja) * | 2007-11-13 | 2010-01-13 | ソニー株式会社 | 面状光源装置及び液晶表示装置組立体 |
CN106205403B (zh) * | 2016-08-01 | 2023-03-07 | 深圳雷曼光电科技股份有限公司 | Led显示屏及其可视角调节方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3947840A (en) * | 1974-08-16 | 1976-03-30 | Monsanto Company | Integrated semiconductor light-emitting display array |
US4271408A (en) * | 1978-10-17 | 1981-06-02 | Stanley Electric Co., Ltd. | Colored-light emitting display |
JPS575083A (en) * | 1980-06-13 | 1982-01-11 | Tokyo Shibaura Electric Co | Display unit |
JPS58198087A (ja) * | 1982-05-14 | 1983-11-17 | キヤノン株式会社 | 表示装置 |
US4723119A (en) * | 1984-05-07 | 1988-02-02 | Futaba Denshi Kogyo Kabushiki Kaisha | Large-sized color display device |
-
1986
- 1986-10-01 JP JP1986151651U patent/JPH0326536Y2/ja not_active Expired
-
1987
- 1987-09-24 US US07/101,183 patent/US4851824A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6358288U (US08197722-20120612-C00042.png) | 1988-04-18 |
US4851824A (en) | 1989-07-25 |
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