JPH0325953B2 - - Google Patents

Info

Publication number
JPH0325953B2
JPH0325953B2 JP56164711A JP16471181A JPH0325953B2 JP H0325953 B2 JPH0325953 B2 JP H0325953B2 JP 56164711 A JP56164711 A JP 56164711A JP 16471181 A JP16471181 A JP 16471181A JP H0325953 B2 JPH0325953 B2 JP H0325953B2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
display device
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56164711A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5865472A (ja
Inventor
Takeshi Biwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56164711A priority Critical patent/JPS5865472A/ja
Publication of JPS5865472A publication Critical patent/JPS5865472A/ja
Publication of JPH0325953B2 publication Critical patent/JPH0325953B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP56164711A 1981-10-15 1981-10-15 発光表示装置 Granted JPS5865472A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56164711A JPS5865472A (ja) 1981-10-15 1981-10-15 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56164711A JPS5865472A (ja) 1981-10-15 1981-10-15 発光表示装置

Publications (2)

Publication Number Publication Date
JPS5865472A JPS5865472A (ja) 1983-04-19
JPH0325953B2 true JPH0325953B2 (https=) 1991-04-09

Family

ID=15798427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56164711A Granted JPS5865472A (ja) 1981-10-15 1981-10-15 発光表示装置

Country Status (1)

Country Link
JP (1) JPS5865472A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131173A (ja) * 1986-11-20 1988-06-03 松下電器産業株式会社 Led表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329105U (https=) * 1976-08-19 1978-03-13
JPS5588245U (https=) * 1978-12-13 1980-06-18
JPS5696481U (https=) * 1979-12-24 1981-07-30

Also Published As

Publication number Publication date
JPS5865472A (ja) 1983-04-19

Similar Documents

Publication Publication Date Title
JP3472450B2 (ja) 発光装置
US7833811B2 (en) Side-emitting LED package and method of manufacturing the same
US7111964B2 (en) LED package
US6984539B2 (en) Method of manufacturing light-emitting diode device
US7893453B2 (en) LED device and method for manufacturing the same
JP2001185763A (ja) 光半導体パッケージ
US5909037A (en) Bi-level injection molded leadframe
JP2001085748A (ja) 発光装置
US20030001166A1 (en) Light-emitting diode with plastic reflector cup
JP2914097B2 (ja) 射出成形プリント基板
JP3792268B2 (ja) チップタイプ発光装置の製造方法
JP3187482B2 (ja) パッケージ型半導体レーザ装置
JP2002270901A (ja) 発光ダイオードとその製造方法
JP2000277808A (ja) 光源装置およびその製造方法
JPH0325953B2 (https=)
JPS60261181A (ja) 光半導体装置
KR100650463B1 (ko) 반도체 장치 및 그 제조 방법
JP2004214478A (ja) 半導体発光装置
KR102364313B1 (ko) 수발광 일체용 반도체 패키지 및 수발광 일체용 반도체 패키지의 제조방법
KR100839122B1 (ko) 측면 발광형 led 램프 및 그 제조방법과, 그 led램프를 포함하는 발광장치
JPH03171782A (ja) 発光ダイオード
JPS617672A (ja) 板状照明光源装置
JP2003282953A (ja) 半導体チップ
KR20050087465A (ko) 반사기를 이용한 칩 발광다이오드
KR200335192Y1 (ko) 표면 실장형 발광 다이오드의 패키지 구조