JPS5588245U - - Google Patents
Info
- Publication number
- JPS5588245U JPS5588245U JP1978173438U JP17343878U JPS5588245U JP S5588245 U JPS5588245 U JP S5588245U JP 1978173438 U JP1978173438 U JP 1978173438U JP 17343878 U JP17343878 U JP 17343878U JP S5588245 U JPS5588245 U JP S5588245U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978173438U JPS5588245U (https=) | 1978-12-13 | 1978-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978173438U JPS5588245U (https=) | 1978-12-13 | 1978-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5588245U true JPS5588245U (https=) | 1980-06-18 |
Family
ID=29179109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978173438U Pending JPS5588245U (https=) | 1978-12-13 | 1978-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5588245U (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5865472A (ja) * | 1981-10-15 | 1983-04-19 | 株式会社東芝 | 発光表示装置 |
| WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
| JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
-
1978
- 1978-12-13 JP JP1978173438U patent/JPS5588245U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5865472A (ja) * | 1981-10-15 | 1983-04-19 | 株式会社東芝 | 発光表示装置 |
| WO2011024820A1 (ja) * | 2009-08-24 | 2011-03-03 | 本田技研工業株式会社 | 電子装置、および、電子装置の製造方法 |
| JP2011044628A (ja) * | 2009-08-24 | 2011-03-03 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |
| US8497166B2 (en) | 2009-08-24 | 2013-07-30 | Honda Motor Co., Ltd. | Electronic device and method of manufacturing electronic device |
| JP2011159692A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電子装置、および、電子装置の製造方法 |