JPH0325925B2 - - Google Patents
Info
- Publication number
- JPH0325925B2 JPH0325925B2 JP19020086A JP19020086A JPH0325925B2 JP H0325925 B2 JPH0325925 B2 JP H0325925B2 JP 19020086 A JP19020086 A JP 19020086A JP 19020086 A JP19020086 A JP 19020086A JP H0325925 B2 JPH0325925 B2 JP H0325925B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- copper
- coating layer
- layer
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000011247 coating layer Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 29
- 238000007747 plating Methods 0.000 description 19
- 239000003990 capacitor Substances 0.000 description 11
- 238000005452 bending Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19020086A JPS6345812A (ja) | 1986-08-13 | 1986-08-13 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19020086A JPS6345812A (ja) | 1986-08-13 | 1986-08-13 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6345812A JPS6345812A (ja) | 1988-02-26 |
| JPH0325925B2 true JPH0325925B2 (US20020051482A1-20020502-M00012.png) | 1991-04-09 |
Family
ID=16254118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19020086A Granted JPS6345812A (ja) | 1986-08-13 | 1986-08-13 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6345812A (US20020051482A1-20020502-M00012.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135226A (ja) * | 1997-10-27 | 1999-05-21 | Harness Syst Tech Res Ltd | 嵌合型接続端子の製造方法 |
| JP3562719B2 (ja) * | 2001-11-13 | 2004-09-08 | 矢崎総業株式会社 | 端子 |
| JP4814552B2 (ja) * | 2005-06-13 | 2011-11-16 | Ｄｏｗａメタルテック株式会社 | 表面処理法 |
| JP4767066B2 (ja) * | 2006-03-31 | 2011-09-07 | 中国電力株式会社 | 埋設物標示装置 |
| JP4880431B2 (ja) * | 2006-11-27 | 2012-02-22 | ニチコン株式会社 | チップ状固体電解コンデンサ |
-
1986
- 1986-08-13 JP JP19020086A patent/JPS6345812A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345812A (ja) | 1988-02-26 |
