JPH0325016B2 - - Google Patents

Info

Publication number
JPH0325016B2
JPH0325016B2 JP59156633A JP15663384A JPH0325016B2 JP H0325016 B2 JPH0325016 B2 JP H0325016B2 JP 59156633 A JP59156633 A JP 59156633A JP 15663384 A JP15663384 A JP 15663384A JP H0325016 B2 JPH0325016 B2 JP H0325016B2
Authority
JP
Japan
Prior art keywords
chip
pasting
sheet
shielding sheet
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59156633A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156419A (ja
Inventor
Naoki Sugao
Noboru Onozato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59156633A priority Critical patent/JPS6156419A/ja
Publication of JPS6156419A publication Critical patent/JPS6156419A/ja
Publication of JPH0325016B2 publication Critical patent/JPH0325016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/144—
    • H10W42/25—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59156633A 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置 Granted JPS6156419A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59156633A JPS6156419A (ja) 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59156633A JPS6156419A (ja) 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置

Publications (2)

Publication Number Publication Date
JPS6156419A JPS6156419A (ja) 1986-03-22
JPH0325016B2 true JPH0325016B2 (esLanguage) 1991-04-04

Family

ID=15631941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59156633A Granted JPS6156419A (ja) 1984-07-27 1984-07-27 半導体装置用シ−ト貼付装置

Country Status (1)

Country Link
JP (1) JPS6156419A (esLanguage)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3784706T2 (de) * 1986-09-26 1993-10-14 Gen Electric Verfahren und apparat zum packen integrierter schaltungschips mit einer polymerfilm-bedeckungsschicht.
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
TW315491B (en) * 1995-07-31 1997-09-11 Micron Technology Inc Apparatus for applying adhesive tape for semiconductor packages
US6281044B1 (en) 1995-07-31 2001-08-28 Micron Technology, Inc. Method and system for fabricating semiconductor components

Also Published As

Publication number Publication date
JPS6156419A (ja) 1986-03-22

Similar Documents

Publication Publication Date Title
US3724068A (en) Semiconductor chip packaging apparatus and method
JP2004311938A (ja) マルチチップパッケージ用のダイ貼付と硬化インライン装置
US20020072202A1 (en) Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
JP2000315697A (ja) 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
US6332268B1 (en) Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor
TWI833901B (zh) 被加工物之加工方法
US7096914B2 (en) Apparatus for bonding a chip using an insulating adhesive tape
JPH0325016B2 (esLanguage)
KR100819791B1 (ko) 반도체 패키지 제조용 테이프의 접착 장치 및 그 방법
JP2001068487A (ja) チップボンディング方法及びその装置
JP7565209B2 (ja) Ｉｃチップ搭載装置、ｉｃチップ搭載方法
JP2861304B2 (ja) アウターリードボンディング方法
JP3592924B2 (ja) Ｉｃチップの供給方法、供給装置、及びそれに使用する短冊テープ状支持体
JPH0250440A (ja) ダイボンド装置
JPH1012662A (ja) Ｔａｂ部品の圧着装置
JPH1167876A (ja) ダイ認識方法および半導体製造装置
JPS61296734A (ja) ウエハテ−プマウント方法および装置
EP1507284A2 (en) Apparatus and method for indexing and severing film
JPS59186334A (ja) ボンデイング装置
JPS6122636A (ja) マウント方法
JPH0131694B2 (esLanguage)
JPS60189228A (ja) チツプテ−ピング装置
JPH04352442A (ja) アウタリードボンディング装置
JPS61292336A (ja) ウエハ−保持装置
JPH0548618B2 (esLanguage)