JPH0321848U - - Google Patents

Info

Publication number
JPH0321848U
JPH0321848U JP8193089U JP8193089U JPH0321848U JP H0321848 U JPH0321848 U JP H0321848U JP 8193089 U JP8193089 U JP 8193089U JP 8193089 U JP8193089 U JP 8193089U JP H0321848 U JPH0321848 U JP H0321848U
Authority
JP
Japan
Prior art keywords
pad
semiconductor device
bump electrode
hidden
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8193089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8193089U priority Critical patent/JPH0321848U/ja
Publication of JPH0321848U publication Critical patent/JPH0321848U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案を説明する為の平面図、第2図
は従来例を説明する為の平面図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体基板上にパツドを設け、その上に前
    記パツドの外周部分を覆い隠すようなバンプ電極
    を設けた半導体装置において、 前記パツドの一部に前記バンプ電極では隠され
    ない突出部を設けたことを特徴とする半導体装置
    。 (2) 前記パツドは円形であることを特徴とする
    請求項第1項に記載の半導体装置。
JP8193089U 1989-07-11 1989-07-11 Pending JPH0321848U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8193089U JPH0321848U (ja) 1989-07-11 1989-07-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8193089U JPH0321848U (ja) 1989-07-11 1989-07-11

Publications (1)

Publication Number Publication Date
JPH0321848U true JPH0321848U (ja) 1991-03-05

Family

ID=31628298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8193089U Pending JPH0321848U (ja) 1989-07-11 1989-07-11

Country Status (1)

Country Link
JP (1) JPH0321848U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136339A (ja) * 1983-12-26 1985-07-19 Hitachi Ltd 突起電極
JPS63250157A (ja) * 1987-04-07 1988-10-18 Seiko Epson Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136339A (ja) * 1983-12-26 1985-07-19 Hitachi Ltd 突起電極
JPS63250157A (ja) * 1987-04-07 1988-10-18 Seiko Epson Corp 半導体装置

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