JPH0321587B2 - - Google Patents

Info

Publication number
JPH0321587B2
JPH0321587B2 JP57200046A JP20004682A JPH0321587B2 JP H0321587 B2 JPH0321587 B2 JP H0321587B2 JP 57200046 A JP57200046 A JP 57200046A JP 20004682 A JP20004682 A JP 20004682A JP H0321587 B2 JPH0321587 B2 JP H0321587B2
Authority
JP
Japan
Prior art keywords
glycidyl
group
derivatives
printed circuit
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57200046A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5991171A (ja
Inventor
Toshikazu Furuhata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP20004682A priority Critical patent/JPS5991171A/ja
Priority to US06/467,207 priority patent/US4465542A/en
Priority to DE8383300899T priority patent/DE3368434D1/de
Priority to EP19830300899 priority patent/EP0087311B1/en
Publication of JPS5991171A publication Critical patent/JPS5991171A/ja
Publication of JPH0321587B2 publication Critical patent/JPH0321587B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP20004682A 1982-02-19 1982-11-15 接着剤組成物 Granted JPS5991171A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP20004682A JPS5991171A (ja) 1982-11-15 1982-11-15 接着剤組成物
US06/467,207 US4465542A (en) 1982-02-19 1983-02-17 Adhesive composition
DE8383300899T DE3368434D1 (en) 1982-02-19 1983-02-21 Adhesive compositions, method of making laminates using the composition, and laminates made thereby
EP19830300899 EP0087311B1 (en) 1982-02-19 1983-02-21 Adhesive compositions, method of making laminates using the composition, and laminates made thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20004682A JPS5991171A (ja) 1982-11-15 1982-11-15 接着剤組成物

Publications (2)

Publication Number Publication Date
JPS5991171A JPS5991171A (ja) 1984-05-25
JPH0321587B2 true JPH0321587B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-03-25

Family

ID=16417920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20004682A Granted JPS5991171A (ja) 1982-02-19 1982-11-15 接着剤組成物

Country Status (1)

Country Link
JP (1) JPS5991171A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721134B2 (ja) * 1987-08-28 1995-03-08 新興化学工業株式会社 電子部品接着用接着剤組成物
US6602651B1 (en) 1998-07-07 2003-08-05 Kansai Paint Co., Ltd. Water-based solder resist composition
JP4910730B2 (ja) * 2007-01-31 2012-04-04 トヨタ紡織株式会社 シートカバーの端末係止構造

Also Published As

Publication number Publication date
JPS5991171A (ja) 1984-05-25

Similar Documents

Publication Publication Date Title
US4465542A (en) Adhesive composition
JPWO2005100435A1 (ja) エポキシ樹脂組成物
JP5245526B2 (ja) 絶縁樹脂組成物、及び支持体付絶縁フィルム
JPS642639B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP4087468B2 (ja) 接着剤組成物
JPH0321587B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH11343476A (ja) 接着剤組成物およびこれを用いた銅張り積層板
JPS6361351B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS61179224A (ja) エポキシ樹脂組成物
JPH0529667B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3031795B2 (ja) ボンディングシート
JP3718357B2 (ja) フレキシブル印刷配線板、カバーレイフィルム及び接着剤組成物
JP4718666B2 (ja) エポキシ樹脂組成物および接着シート
JP2650158B2 (ja) フレキシブル印刷回路基板用接着剤組成物
JPS58176254A (ja) 耐めつき性ソルダ−レジストインク組成物
JPH0517269B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH1161073A (ja) 接着剤組成物
JP3017562B2 (ja) 配線基板用エポキシ樹脂組成物
JPS6412319B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH069759A (ja) 積層板用エポキシ樹脂組成物
JPH11181380A (ja) 難燃性接着剤組成物
JP3529118B2 (ja) エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JPH0446992B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2001115126A (ja) 可撓性プリント配線回路用エポキシ樹脂接着剤
JPH0359947B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)