JPH0320898B2 - - Google Patents

Info

Publication number
JPH0320898B2
JPH0320898B2 JP57097670A JP9767082A JPH0320898B2 JP H0320898 B2 JPH0320898 B2 JP H0320898B2 JP 57097670 A JP57097670 A JP 57097670A JP 9767082 A JP9767082 A JP 9767082A JP H0320898 B2 JPH0320898 B2 JP H0320898B2
Authority
JP
Japan
Prior art keywords
layer
insulating film
main surface
wiring
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57097670A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58215056A (ja
Inventor
Hideaki Nakagome
Kohei Yamada
Hajime Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57097670A priority Critical patent/JPS58215056A/ja
Publication of JPS58215056A publication Critical patent/JPS58215056A/ja
Publication of JPH0320898B2 publication Critical patent/JPH0320898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP57097670A 1982-06-09 1982-06-09 半導体素子およびその形成方法 Granted JPS58215056A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57097670A JPS58215056A (ja) 1982-06-09 1982-06-09 半導体素子およびその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57097670A JPS58215056A (ja) 1982-06-09 1982-06-09 半導体素子およびその形成方法

Publications (2)

Publication Number Publication Date
JPS58215056A JPS58215056A (ja) 1983-12-14
JPH0320898B2 true JPH0320898B2 (enrdf_load_stackoverflow) 1991-03-20

Family

ID=14198460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57097670A Granted JPS58215056A (ja) 1982-06-09 1982-06-09 半導体素子およびその形成方法

Country Status (1)

Country Link
JP (1) JPS58215056A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248795A (ja) * 2011-05-31 2012-12-13 Toshiba Corp 半導体発光素子およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4740148A (enrdf_load_stackoverflow) * 1968-11-04 1972-10-11

Also Published As

Publication number Publication date
JPS58215056A (ja) 1983-12-14

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