JPH0319707B2 - - Google Patents
Info
- Publication number
- JPH0319707B2 JPH0319707B2 JP57000862A JP86282A JPH0319707B2 JP H0319707 B2 JPH0319707 B2 JP H0319707B2 JP 57000862 A JP57000862 A JP 57000862A JP 86282 A JP86282 A JP 86282A JP H0319707 B2 JPH0319707 B2 JP H0319707B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- epoxy
- semiconductor device
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57000862A JPS58119657A (ja) | 1982-01-08 | 1982-01-08 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57000862A JPS58119657A (ja) | 1982-01-08 | 1982-01-08 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58119657A JPS58119657A (ja) | 1983-07-16 |
| JPH0319707B2 true JPH0319707B2 (cs) | 1991-03-15 |
Family
ID=11485472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57000862A Granted JPS58119657A (ja) | 1982-01-08 | 1982-01-08 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58119657A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018521A (ja) * | 1983-07-09 | 1985-01-30 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
-
1982
- 1982-01-08 JP JP57000862A patent/JPS58119657A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58119657A (ja) | 1983-07-16 |
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