JPH0549696B2 - - Google Patents

Info

Publication number
JPH0549696B2
JPH0549696B2 JP58176995A JP17699583A JPH0549696B2 JP H0549696 B2 JPH0549696 B2 JP H0549696B2 JP 58176995 A JP58176995 A JP 58176995A JP 17699583 A JP17699583 A JP 17699583A JP H0549696 B2 JPH0549696 B2 JP H0549696B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
semiconductor device
compound
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58176995A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6069130A (ja
Inventor
Hirotoshi Iketani
Micha Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP17699583A priority Critical patent/JPS6069130A/ja
Publication of JPS6069130A publication Critical patent/JPS6069130A/ja
Publication of JPH0549696B2 publication Critical patent/JPH0549696B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP17699583A 1983-09-27 1983-09-27 樹脂封止型半導体装置 Granted JPS6069130A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17699583A JPS6069130A (ja) 1983-09-27 1983-09-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17699583A JPS6069130A (ja) 1983-09-27 1983-09-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6069130A JPS6069130A (ja) 1985-04-19
JPH0549696B2 true JPH0549696B2 (cs) 1993-07-27

Family

ID=16023337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17699583A Granted JPS6069130A (ja) 1983-09-27 1983-09-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6069130A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06286815A (ja) * 1993-04-05 1994-10-11 Hitachi Zosen Corp 立体格納設備
JP4586405B2 (ja) * 2004-04-28 2010-11-24 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4412281A (en) * 1980-07-11 1983-10-25 Raytheon Company Distributed signal processing system
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS6011973B2 (ja) * 1981-10-21 1985-03-29 ト−レ・シリコ−ン株式会社 成形用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6069130A (ja) 1985-04-19

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