JPH0319702B2 - - Google Patents
Info
- Publication number
- JPH0319702B2 JPH0319702B2 JP13256586A JP13256586A JPH0319702B2 JP H0319702 B2 JPH0319702 B2 JP H0319702B2 JP 13256586 A JP13256586 A JP 13256586A JP 13256586 A JP13256586 A JP 13256586A JP H0319702 B2 JPH0319702 B2 JP H0319702B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- core
- copper
- purity
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000002344 surface layer Substances 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 229910052790 beryllium Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000010949 copper Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 10
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Metal Extraction Processes (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61132565A JPS62287634A (ja) | 1986-06-06 | 1986-06-06 | 半導体素子結線用細線 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61132565A JPS62287634A (ja) | 1986-06-06 | 1986-06-06 | 半導体素子結線用細線 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62287634A JPS62287634A (ja) | 1987-12-14 |
JPH0319702B2 true JPH0319702B2 (ko) | 1991-03-15 |
Family
ID=15084274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61132565A Granted JPS62287634A (ja) | 1986-06-06 | 1986-06-06 | 半導体素子結線用細線 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62287634A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5981087B2 (ja) * | 2010-05-14 | 2016-08-31 | 古河電気工業株式会社 | 平角銅線及びその製造方法、並びに太陽電池用平角銅線及びその製造方法 |
DE102010031993B4 (de) | 2010-07-22 | 2015-03-12 | Heraeus Materials Technology Gmbh & Co. Kg | Verfahren zur Herstellung eines Bonddrahtes, Bonddraht und Baugruppe, die einen solchen Bonddraht aufweist. |
JP6020972B2 (ja) * | 2015-06-11 | 2016-11-02 | 日立金属株式会社 | 銅ボンディングワイヤ |
JP7209157B2 (ja) * | 2018-10-01 | 2023-01-20 | 富山住友電工株式会社 | めっき線材の製造方法およびめっき線材の製造装置 |
-
1986
- 1986-06-06 JP JP61132565A patent/JPS62287634A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62287634A (ja) | 1987-12-14 |
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