JPH03195723A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH03195723A JPH03195723A JP33294489A JP33294489A JPH03195723A JP H03195723 A JPH03195723 A JP H03195723A JP 33294489 A JP33294489 A JP 33294489A JP 33294489 A JP33294489 A JP 33294489A JP H03195723 A JPH03195723 A JP H03195723A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- formula
- resistance
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 40
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 40
- 239000000203 mixture Substances 0.000 title claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000005011 phenolic resin Substances 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 3
- 150000002367 halogens Chemical class 0.000 claims abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 17
- 239000000843 powder Substances 0.000 abstract description 11
- 238000005476 soldering Methods 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 229920003986 novolac Polymers 0.000 abstract description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000005350 fused silica glass Substances 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 abstract 1
- 230000008646 thermal stress Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 17
- 230000035882 stress Effects 0.000 description 11
- 239000012778 molding material Substances 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 6
- 230000008642 heat stress Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面実装化における半田付は時でのパッケージ
に受ける耐熱ストレス性に優れた半導体封止用エポキシ
樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin composition for semiconductor encapsulation that has excellent resistance to heat stress that is applied to packages during soldering in surface mounting.
従来、ダイオード、トランジスタ、集積回路等の電子部
品を熱硬化性樹脂で封止しているが、特に集積回路では
耐熱性、耐湿性に優れた０−タレゾールノボラックエポ
キシ樹脂をノボラック型フェノール樹脂で硬化させたエ
ポキシ樹脂が用いられている。Conventionally, electronic components such as diodes, transistors, and integrated circuits are sealed with thermosetting resins, but especially for integrated circuits, 0-talesol novolac epoxy resin, which has excellent heat resistance and moisture resistance, is used as a novolac type phenolic resin. A hardened epoxy resin is used.
ところが近年、集積回路の高集積化に伴いチップがだん
だん大型化し、かつパッケージは従来のＤＩＰタイプか
ら表面実装化された小型、薄型のフラットパッケージ、
ＳＯＰ、ＳＯＪ、ＰＬＣＣに変わってきている。However, in recent years, as integrated circuits have become more highly integrated, chips have become larger and larger, and packages have changed from the conventional DIP type to surface-mounted small, thin flat packages.
It is changing to SOP, SOJ, and PLCC.
即ち大型チップを小型で薄いパッケージに封入すること
になり、応力によりクラック発生、これらのクシツクに
よる耐湿性の低下等の問題が大きくクローズアップされ
てきている。That is, a large chip is encapsulated in a small and thin package, and problems such as cracks occurring due to stress and a decrease in moisture resistance due to these cracks are attracting attention.
特に半田づけの工程において急激に２００°Ｃ以上の高
温にさらされることによりパッケージの割れや樹脂とチ
ップの剥離により耐湿性が劣化してしまうといった問題
点がでてきている。Particularly in the soldering process, rapid exposure to high temperatures of 200° C. or higher has led to problems such as cracking of the package and deterioration of moisture resistance due to peeling of the resin and chip.
これらの大型チップを封止するのに通した、信鯨性の高
い封止用樹脂組成物の開発が望まれてきている。It has been desired to develop a sealing resin composition with high reliability that can be used to seal these large chips.
これらの問題を解決するために半田付は時の熱衝撃を緩
和する目的で、熱可塑性オリゴマーの添加（特開昭６２
−１１５８４９号公報）や各種シリコーン化合物の添加
（特開昭６２−１１５８５号公報、６２−１１６６５４
号公報、６２−１２８１６２号公報）、更にはシリコー
ン変性（特開昭６２−１３６８６０号公報）などの手法
で対処しているがいずれも半田付は時にパッケージにク
ランクが生じてしまい偉績性の優れた半導体封止用エポ
キシ樹脂組成物を得るまでには至らなかった。In order to solve these problems, soldering requires the addition of thermoplastic oligomers (Japanese Patent Laid-Open No. 62/1999) to alleviate the thermal shock caused by soldering.
-115849) and addition of various silicone compounds (JP-A-62-11585, 62-116654)
No. 62-128162) and silicone modification (Japanese Unexamined Patent Publication No. 62-136860) have been used to deal with this problem, but in both cases, soldering sometimes causes cracks in the package, making it difficult to perform well. However, it has not been possible to obtain an epoxy resin composition for semiconductor encapsulation.
一方、耐半田ストレス性に優れた耐熱性エポキシ樹脂組
成物を得る為に、樹脂系としては多官能エポキシ樹脂の
使用（特開昭６１−１６８６２０号公報）等が検討され
てきたが、多官能エポキシ樹脂の使用により架橋密度が
上がり耐熱性が向上するが、特に２００°Ｃ〜３００℃
のような高温にさらされた場合においては耐半田ストレ
ス性が不充分であった。On the other hand, in order to obtain a heat-resistant epoxy resin composition with excellent solder stress resistance, the use of a polyfunctional epoxy resin as the resin system (Japanese Unexamined Patent Publication No. 168620/1983) has been considered; The use of epoxy resin increases crosslinking density and improves heat resistance, especially at temperatures between 200°C and 300°C.
When exposed to such high temperatures, the solder stress resistance was insufficient.
本発明は、このような問題に対してエポキシ樹脂として
分子構造の骨格中にエーテル結合を有する４官能エポキ
シ樹脂を用いることにより、半田付は時の耐熱ストレス
性が著しく優れた半導体封止用エポキシ樹脂組成物を提
供するところにある。The present invention solves these problems by using a tetrafunctional epoxy resin that has an ether bond in its molecular skeleton as an epoxy resin, thereby creating an epoxy resin for semiconductor encapsulation that has extremely excellent heat stress resistance during soldering. The purpose of the present invention is to provide a resin composition.
本発明のエポキシ樹脂組成物は、エポキシ樹脂として下
記式（Ｉ）で示される構造の４官能エポキシ樹脂
（式中のＲ１とＲ２は水素、アルキル基の中から選択さ
れる同一もしくは異なる原子または基、Ｒ１〜Ｒ＋ａは
水素、ハロゲン、アルキル基の中から選択される同一も
しくは異なる原子または基）を総エポキシ樹脂量に対し
て４０−１００重量％を含むエポキシ樹脂とフェノール
樹脂硬化剤、無機充填材および硬化促進剤からなること
を特徴とし、従来のエポキシ樹脂組成物に比べて非常に
優れた半田付は時の耐熱ストレス性つまり、耐半田スト
レス性を有するものである。The epoxy resin composition of the present invention is a tetrafunctional epoxy resin having a structure represented by the following formula (I) (where R1 and R2 are the same or different atoms or groups selected from hydrogen and alkyl groups). , R1 to R+a are the same or different atoms or groups selected from hydrogen, halogen, and alkyl groups), an epoxy resin containing 40 to 100% by weight based on the total amount of epoxy resin, a phenolic resin curing agent, and an inorganic filler. and a curing accelerator, and has extremely superior soldering resistance to heat stress, that is, resistance to soldering stress, compared to conventional epoxy resin compositions.
式（１）で示される構造の４官能エポキシ樹脂は骨格中
にエーテル結合を有することから、硬化物は低弾性つま
り低応力性に優れる。また、多官能性であることから架
橋密度の向上が図れ、耐熱性にも優れる。従って、式（
りで示される構造の４官能エポキシ樹脂を用いた半導体
封止用エポキシ樹脂組成物は最近のＩＣパッケージの表
面実装化に対する耐半田ストレス性に優れるエポキシ樹
脂組成物といえる。Since the tetrafunctional epoxy resin having the structure represented by formula (1) has an ether bond in its skeleton, the cured product has excellent low elasticity, that is, low stress. Furthermore, since it is polyfunctional, it can improve crosslinking density and has excellent heat resistance. Therefore, the formula (
An epoxy resin composition for semiconductor encapsulation using a tetrafunctional epoxy resin having the structure shown below can be said to be an epoxy resin composition that has excellent solder stress resistance for surface mounting of recent IC packages.
式（１）で示される構造の４官能エポキシの使用量はこ
れを調整することにより、耐半田ストレス性を最大限に
引き出すことができる。耐半田ストレス性の効果を出す
ためには式（１）で示される４官能エポキシ樹脂を総エ
ポキシ樹脂量の４０重量％以上、好ましくは６０重量％
以上の使用が望ましい。４０重量％未満だと耐熱性及び
低応力性が上がらず耐半田ストレス性は不充分である。By adjusting the amount of the tetrafunctional epoxy having the structure represented by formula (1), the solder stress resistance can be maximized. In order to achieve the effect of solder stress resistance, the content of the tetrafunctional epoxy resin represented by formula (1) is 40% by weight or more, preferably 60% by weight of the total amount of epoxy resin.
It is desirable to use the above. If it is less than 40% by weight, the heat resistance and low stress properties will not improve and the solder stress resistance will be insufficient.
Ｒ１とＲｔはメチル基、またＲ１からＲ１４は水素原子
が好ましい。R1 and Rt are preferably methyl groups, and R1 to R14 are preferably hydrogen atoms.
式（１）で示される４官能エポキシ樹脂を併用するエポ
キシ樹脂とはエポキシ基を有するもの全般をいう。たと
えば、ビスフェノール型エポキシ樹脂、ノボラック型エ
ポキシ樹脂、ビフェニル型エポキシ樹脂、３官能型エポ
キシ樹脂、トリアジン核含有エポキシ樹脂等のことをい
う。The epoxy resin used in combination with the tetrafunctional epoxy resin represented by formula (1) refers to any resin having an epoxy group. For example, it refers to bisphenol type epoxy resin, novolak type epoxy resin, biphenyl type epoxy resin, trifunctional type epoxy resin, triazine nucleus-containing epoxy resin, etc.
本発明で用いるフェノール樹脂硬化剤としては、フェノ
ール性水酸基を有するもの全般をいい、例えばフェノー
ルノボラック樹脂、タレゾールノボラック樹脂、３官能
型フエノール樹脂、４官能型フエノール樹脂、ジシクロ
ペンタジェン変性フェノール樹脂、ジシクロペンタジェ
ン変性フェノール樹脂とフェノールノボラック及びタレ
ゾールノボラック樹脂との共重合物、バラキシレン変性
フェノール樹脂等のことをいう。The phenolic resin curing agent used in the present invention refers to all those having a phenolic hydroxyl group, such as phenol novolac resin, talesol novolac resin, trifunctional phenolic resin, tetrafunctional phenolic resin, dicyclopentadiene-modified phenolic resin. , a copolymer of dicyclopentadiene-modified phenolic resin with phenol novolak and talesol novolak resin, and varaxylene-modified phenolic resin.
本発明で用いる無機充填材としては、溶融シリカ粉末、
球状シリカ粉末、結晶シリカ粉末、２次凝集シリカ粉末
、多孔質シリカ粉末、２次凝集シリカ粉末または多孔質
シリカ粉末を粉砕したシリカ粉末、アルミナ等が挙げら
れ、特に溶融シリカ粉末が好ましい。Inorganic fillers used in the present invention include fused silica powder,
Examples include spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, porous silica powder, silica powder obtained by pulverizing secondary agglomerated silica powder or porous silica powder, alumina, etc., and fused silica powder is particularly preferred.
本発明で使用される硬化促進剤はエポキシ基とフェノー
ル性水酸基との反応を促進させるものであればよく、一
般に封止用材料に使用されているものを広く使用するこ
とができ、例えばジアザビシクロウンデセン（ＤＢＵ）
、）リフェニルホスフィン（ＴＰＰ）、ジメチルベンジ
ルアミン（ＢＤＭＡ）や２メチルイミダゾール（２ＭＺ
）等が単独もしくは２種類以上混合して用いられる。The curing accelerator used in the present invention may be any one as long as it promotes the reaction between the epoxy group and the phenolic hydroxyl group, and a wide variety of those commonly used in sealing materials can be used, such as diaza. Bicycloundesene (DBU)
) Riphenylphosphine (TPP), dimethylbenzylamine (BDMA) and 2methylimidazole (2MZ
) etc. may be used alone or in combination of two or more.
本発明の封止用エポキシ樹脂組成物はエポキシ樹脂、硬
化剤、無機充填材及び硬化促進剤を必須成分とするが、
これ以外に必要に応じてシランカップリング剤、ブロム
化エポキシ樹脂、三酸化アンチモン、ヘキサブロムベン
ゼン等の難燃剤、カーボンブラック、ベンガラ等の着色
剤、天然ワックス、合成ワックス等の離型剤及びシリコ
ーンオイル、ゴム等の低応力添加剤等の種々の添加剤を
適宜配合しても差し支えがない。The epoxy resin composition for sealing of the present invention contains an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator as essential components,
In addition to this, silane coupling agents, brominated epoxy resins, antimony trioxide, flame retardants such as hexabromobenzene, colorants such as carbon black and red iron, mold release agents such as natural wax and synthetic wax, and silicone There is no problem in appropriately blending various additives such as low stress additives such as oil and rubber.
又、本発明の対土用エポキシ樹脂組成物を成形材料とし
て製造するには、エポキシ樹脂、硬化剤、硬化促進剤、
充填剤、その他の添加剤をミキサー等によって十分に均
一に混合した後、さらに熱ロールまたはニーダ−等で溶
融混練し、冷却後粉砕して成形材料とすることができる
。これらの成形材料は電子部品あるいは電気部品の封止
、被覆、絶縁等に適用することができる。In addition, in order to produce the epoxy resin composition for soil use of the present invention as a molding material, an epoxy resin, a curing agent, a curing accelerator,
After the filler and other additives are thoroughly and uniformly mixed using a mixer or the like, the mixture can be further melt-kneaded using a heated roll or kneader, cooled, and then ground to obtain a molding material. These molding materials can be applied to sealing, covering, insulating, etc. electronic or electrical components.
実施例１
下記組成物
式（ＩＩ）で示される４官能工ポキシ樹脂１６重量部
オルソクレゾールノボラックエポキシ樹脂４重量部
フェノールノボラック樹脂 １０重量部溶融シリカ
粉末 ６８．８重量部トリフェニルホスフ
ィン ０．２重１部カーボンブラック
０．５重量部カルナバワックス ０．
５重量部を、ミキサーで常温で混合し、７０〜１００℃
で２軸ロールにより混練し、冷却後粉砕した成形材料と
した。Example 1 16 parts by weight of a tetrafunctional poxy resin represented by the following composition formula (II) 4 parts by weight of an orthocresol novolac epoxy resin 10 parts by weight a phenol novolak resin 68.8 parts by weight of fused silica powder 0.2 parts by weight of triphenylphosphine 1 part carbon black
0.5 parts by weight carnauba wax 0.
Mix 5 parts by weight with a mixer at room temperature and heat to 70-100°C.
The mixture was kneaded using a twin-screw roll, cooled, and then ground to obtain a molding material.
得られた成形材料をタブレット化し、低圧トランスファ
ー成形機にて１７５℃、７０ ｋｇ／ｃｄ、 １２０秒
の条件で半田クランク試験用として６Ｘ６１１１のチッ
プを５２ｐパツケージに封止し、又半田耐湿性試験用と
して３×６閣のチップを１６ｐＳＯＰパツケージに封止
した。The obtained molding material was made into tablets, and a 6X6111 chip was sealed in a 52P package for a solder crank test using a low-pressure transfer molding machine at 175°C, 70 kg/cd, and 120 seconds. A 3×6 chip was sealed in a 16 pSOP package.
封止したテスト用素子について下記の半田クランク試験
及び半田耐湿性試験をおこなった。The following solder crank test and solder moisture resistance test were conducted on the sealed test element.
半田クラック試験：封止したテスト用素子を８５℃、８
５％ＲＨの環境下で４８Ｈｒおよび７２Ｈｒ処理し、そ
の後２５０″Ｃの半田槽に１０秒間浸漬後、顕微鏡で外
部クランクを観察した。Solder crack test: sealed test element at 85℃, 8
After processing for 48 hours and 72 hours in a 5% RH environment, the external crank was observed under a microscope after being immersed in a solder bath at 250''C for 10 seconds.
半田耐湿性試験：封止したテスト用素子を８５℃で、８
５％ＲＨの環境下で７２Ｈｒ処理し、その後２５０°Ｃ
の半田槽に１０秒間浸漬後、プレッシャークツカー試験
（１２５℃、１００％ＲＨ）を行い回路のオーブン不良
を測定した。Solder moisture resistance test: The sealed test element was heated to 85℃ for 8
Treated for 72 hours in an environment of 5% RH, then heated at 250°C.
After immersing the circuit in a solder bath for 10 seconds, a pressure cooker test (125° C., 100% RH) was conducted to measure oven failure of the circuit.
試験結果を第１表に示す。The test results are shown in Table 1.
実施例２〜４
第１表の処方に従って配合し、実施例１と同様にして成
形材料を得た。この成形材料で試験用の封止した成形品
を得、この成形品を用いて実施例１と同様に半田クラン
ク試験及び半田耐湿性試験を行なった。試験結果を第１
表に示す。Examples 2 to 4 Molding materials were obtained in the same manner as in Example 1 by blending according to the prescriptions in Table 1. A sealed molded product for testing was obtained using this molding material, and a solder crank test and a solder moisture resistance test were conducted in the same manner as in Example 1 using this molded product. Test results first
Shown in the table.
比較例１〜３
第１表の処方に従って配合し、実施例１と同様にして成
形材料を得た。この成形材料で試験用の封止した成形品
を得、この成形品を用いて実施例Ｉと同様に半田クラッ
ク試験及び半田耐湿性試験を行った。試験結果を第１表
に示す。Comparative Examples 1 to 3 Molding materials were obtained in the same manner as in Example 1 by blending according to the formulations in Table 1. A sealed molded article for testing was obtained using this molding material, and a solder crack test and a solder moisture resistance test were conducted in the same manner as in Example I using this molded article. The test results are shown in Table 1.
脂組成物を得ることができるので、半田付は工程による
急激な温度変化による熱ストレスを受けたときの耐クラ
ツク性に非常に優れ、更に耐湿性が良好なことから電子
、電気部品の封止用、被覆用、絶縁用等に用いた場合、
特に表面実装パッケージに搭載された高集積大型チップ
ＩＣにおいて信頼性が非常に必要とする製品について好
適である。Since a fat composition can be obtained, soldering has excellent crack resistance when subjected to heat stress due to rapid temperature changes during the process, and also has good moisture resistance, making it suitable for sealing electronic and electrical components. When used for purposes such as coating, insulation, etc.
It is particularly suitable for highly integrated large-chip ICs mounted on surface mount packages that require high reliability.
Claims (1)
ポキシ樹脂 ▲数式、化学式、表等があります▼（ I ） （式中のＲ＿１とＲ＿２は水素、アルキル基の中から選
択される同一もしくは異なる原子又は基、Ｒ＿３〜Ｒ＿
１＿４は水素、ハロゲン、アルキル基の中から選択され
る同一もしくは異なる原子または基） を総エポキシ樹脂量に対して４０〜１００重量％含むエ
ポキシ樹脂。 （Ｂ）フェノール樹脂硬化剤。 （Ｃ）無機充填材、および （Ｄ）硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物。(1) (A) Tetrafunctional epoxy resin with the structure shown by the following formula (I) ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ (I) (R_1 and R_2 in the formula are selected from hydrogen and alkyl groups. the same or different atoms or groups, R_3 to R_
1_4 is the same or different atom or group selected from hydrogen, halogen, and alkyl group) An epoxy resin containing 40 to 100% by weight of the total amount of epoxy resin. (B) Phenolic resin curing agent. An epoxy resin composition for semiconductor encapsulation which contains (C) an inorganic filler and (D) a curing accelerator as essential components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33294489A JP2744499B2 (en) | 1989-12-25 | 1989-12-25 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33294489A JP2744499B2 (en) | 1989-12-25 | 1989-12-25 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03195723A true JPH03195723A (en) | 1991-08-27 |
| JP2744499B2 JP2744499B2 (en) | 1998-04-28 |
Family
ID=18260553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33294489A Expired - Fee Related JP2744499B2 (en) | 1989-12-25 | 1989-12-25 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2744499B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113788803A (en) * | 2021-09-13 | 2021-12-14 | 北京化工大学 | Glycidyl ether type four-functionality epoxy resin, cured product thereof and preparation method thereof |
-
1989
- 1989-12-25 JP JP33294489A patent/JP2744499B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113788803A (en) * | 2021-09-13 | 2021-12-14 | 北京化工大学 | Glycidyl ether type four-functionality epoxy resin, cured product thereof and preparation method thereof |
| CN113788803B (en) * | 2021-09-13 | 2023-12-15 | 北京化工大学 | Glycidyl ether type tetrafunctional epoxy resin, and condensate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2744499B2 (en) | 1998-04-28 |
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