JPH02155914A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH02155914A JPH02155914A JP30876988A JP30876988A JPH02155914A JP H02155914 A JPH02155914 A JP H02155914A JP 30876988 A JP30876988 A JP 30876988A JP 30876988 A JP30876988 A JP 30876988A JP H02155914 A JPH02155914 A JP H02155914A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formulas
- curing agent
- tables
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 34
- 239000000203 mixture Substances 0.000 title claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000005011 phenolic resin Substances 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 20
- 239000000377 silicon dioxide Substances 0.000 abstract description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000005350 fused silica glass Substances 0.000 abstract description 3
- 150000002989 phenols Chemical class 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 29
- 238000012360 testing method Methods 0.000 description 18
- 239000012778 molding material Substances 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- -1 aralkyl ether Chemical compound 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐半田ストレス性に優れた半導体封止用エポ
キシ樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin composition for semiconductor encapsulation that has excellent solder stress resistance.
半導体関連技術は近年の軽薄短小傾向より実装密度を向
上させる方向で進んできた。そのためにメモリーの集積
度の向上や、実装方法のスルーホール実装から表面実装
への移行が進んでいる。Semiconductor-related technology has progressed in the direction of increasing packaging density in response to the recent trend toward lighter, thinner, and smaller devices. To this end, memory density is increasing and the mounting method is shifting from through-hole mounting to surface mounting.
従ってパッケージは従来ＤＩＰタイプから表面実装用と
して小型薄型のフラットパッケージ、ｓｏｐ。Therefore, the package has changed from the conventional DIP type to a small and thin flat package for surface mounting, SOP.
ＳＯＪ、ＰＬＣＣに変わってきており、応力によるパッ
ケージタラツクの発生、これらのクシツクによる耐湿性
の低下等の問題がある。SOJ and PLCC have been replaced, and there are problems such as generation of package tack due to stress and reduction in moisture resistance due to these tack.
特に表面実装工程でのリードの半田付は時にパッケージ
は急激な温度変化を受け、このためにパッケージにクラ
ンクが生じる問題が大きくクローズアップされている。In particular, when soldering leads in the surface mounting process, the package is sometimes subject to rapid temperature changes, and the problem of cranking of the package due to this is attracting attention.
これらの問題を解決するために半田付は時の熱衝撃を緩
和する目的で、熱可塑性オリゴマーの添加（特開昭６２
−１１５８４９号公報）や各種シリコーン化合物の添加
（特開昭６２−１１５８５０号公報、６２−１１６６５
４号公報、６２−１２８１６２号公報）、更にはシリコ
ーン変性（特開昭６２−１３６８６０号公報）などの手
法で対処しているがいずれも半田付は時にパッケージに
クラックが生じてしまい信転性の優れた半導体封止用エ
ポキシ樹脂組成物を得るまでには至らなかった。In order to solve these problems, soldering requires the addition of thermoplastic oligomers (Japanese Patent Laid-Open No. 62/1999) to alleviate the thermal shock caused by soldering.
-115849) and addition of various silicone compounds (JP-A-62-115850, 62-11665)
4, 62-128162) and silicone modification (Japanese Patent Application Laid-open No. 62-136860), these methods sometimes cause cracks in the package when soldering, and the reliability is poor. However, it has not been possible to obtain an epoxy resin composition for encapsulating a semiconductor with excellent properties.
一方、耐半田ストレス性に優れた耐熱性エポキシ樹脂組
成物を得る為に樹脂系としては多官能エポキシ樹脂の使
用（特開昭６２−１６８６２０号公報）等が検討されて
きたが、多官能エポキシ樹脂の使用では架橋密度が上が
り耐熱性が向上するが、特に２００℃〜３００℃のよう
な高温にさらされた場合においては耐半田ストレス性が
不充分であった。On the other hand, in order to obtain heat-resistant epoxy resin compositions with excellent solder stress resistance, the use of polyfunctional epoxy resins (Japanese Unexamined Patent Publication No. 168620/1983) has been considered as a resin system. Although the use of resin increases the crosslinking density and improves heat resistance, the solder stress resistance is insufficient especially when exposed to high temperatures such as 200°C to 300°C.
本発明はこのような問題に対してエポキシ樹脂として式
（１）で示される多官能エポキシ樹脂を、フェノール樹
脂硬化剤として式（ＩＩ）で示されるバラキシレン変性
フェノール樹脂硬化剤（ｎは整数、ｎ−０〜５）
を用いることにより耐半田ストレス性が著しく優れた半
導体封止用エポキシ＃Ｂ４脂組酸物を提供するところに
ある。In order to solve these problems, the present invention uses a polyfunctional epoxy resin represented by formula (1) as an epoxy resin and a xylene-modified phenolic resin hardener represented by formula (II) as a phenol resin hardener (n is an integer, An object of the present invention is to provide an epoxy #B4 resin composition for semiconductor encapsulation which has extremely excellent solder stress resistance by using the following.
本発明のエポキシ樹脂組成物は従来の封止用樹脂組成物
に比べて非常に優れた耐半田ストレス性を有したもので
ある。The epoxy resin composition of the present invention has extremely superior solder stress resistance compared to conventional sealing resin compositions.
（ｎとｍは、０以上の整数、ｎ＋ｍ＝１〜１０であり、
式中のＸとＺで割合が３：１で存在する混合物、）
上記式（１）で表わされるエポキシ樹脂は１分子中に３
個以上のエポキシ基を有する多官能エポキシ樹脂であり
、この多官能エポキシ樹脂を用いることにより、従来の
方法では得ることの出来なかった耐半田ストレス性に非
常に優れたエポキシ樹脂組成物を得ることができる。(n and m are integers greater than or equal to 0, n+m=1 to 10,
A mixture in which X and Z in the formula are present in a ratio of 3:1) The epoxy resin represented by the above formula (1) has 3 to 1 molecule in one molecule.
This is a polyfunctional epoxy resin having 1 or more epoxy groups, and by using this polyfunctional epoxy resin, an epoxy resin composition with extremely excellent solder stress resistance that could not be obtained by conventional methods can be obtained. Can be done.
このようなエポキシ樹脂の使用量は、これを調節するこ
とにより耐半田ストレス性を最大限に弓き出すことがで
きる。耐半田ストレス性の効果を出す為には好ましくは
、式（Ｉ）で示される多官能エポキシ樹脂をエポキシ樹
脂の５０重量％以上、更に好ましくは７０重四％以上の
使用が望ましい。By adjusting the amount of epoxy resin used, the solder stress resistance can be maximized. In order to obtain the effect of solder stress resistance, it is preferable to use the polyfunctional epoxy resin represented by formula (I) in an amount of 50% by weight or more, more preferably 70% by weight or more of the epoxy resin.
５０重量％未満だと架橋密度が、上がらず耐半田ストレ
ス性が不充分である。If it is less than 50% by weight, the crosslinking density will not increase and the solder stress resistance will be insufficient.
更に式中のＸとＺの割合が３：１で存在する混合物であ
ることが好ましい。Furthermore, it is preferable that the ratio of X and Z in the formula is 3:1.
この場合Ｘを３としたときのＺの比率が、ｌより小さい
と、成形時の硬化性が上がらず、成形性が悪くなる傾向
があり、また比率が、１より大きいと吸水性が上がり、
半田浸漬時の熱衝撃が大きく、耐半田ストレス性が、悪
くなる傾向がある。In this case, if the ratio of Z when X is 3 is smaller than 1, the curability during molding will not increase and the moldability will tend to deteriorate, and if the ratio is larger than 1, water absorption will increase,
Thermal shock during solder immersion is large, and solder stress resistance tends to deteriorate.
又２官能以下のエポキシ樹脂では架橋８度が、上がらず
耐熱性が劣り耐半田ストレス性の効果が、得られない。In addition, with an epoxy resin having less than two functional groups, the crosslinking degree does not increase to 8 degrees, the heat resistance is poor, and the effect of solder stress resistance cannot be obtained.
又ｎ＋ｍの値は１−１０の範囲が好ましい、この場合ｎ
＋ｍの値が１より小さい場合、硬化性が低下し、成形性
が悪くなる傾向があり、またｎ十ｍの値が１０より大き
い場合流動性が低下し、成形性が悪くなる傾向がある。Also, the value of n+m is preferably in the range of 1-10, in this case n
When the value of +m is less than 1, the curability tends to decrease and the moldability tends to deteriorate, and when the value of n0m exceeds 10, the fluidity tends to decrease and the moldability tends to deteriorate.
ここでいうエポキシ樹脂とは、エポキシ基を有するもの
全般をいう、たとえばビスフェノール型エポキシ樹脂、
ノボラック型エポキシ樹脂・トリアジン核含有エポキシ
樹脂等のことをいう。The epoxy resin referred to here refers to all those having an epoxy group, such as bisphenol type epoxy resin,
Refers to novolac type epoxy resin, triazine core-containing epoxy resin, etc.
（ｎは整数、ｎ−０〜５）
上記式（ｒｌ）で表されるフェノール樹脂硬化剤はフェ
ノールとアラルキルエーテル（α、α１−ジメトキシバ
ラキシレン）を用い、フリーゾルタラフッ反応により縮
合させて得たものであり、このバラキシレン変性フェノ
ール樹脂を用いることにより、従来の方法では得ること
の出来なかった耐半田ストレス性に非常に優れたエポキ
シ樹脂組成物を得ることができる。(n is an integer, n-0 to 5) The phenolic resin curing agent represented by the above formula (rl) is produced by condensing phenol and aralkyl ether (α, α1-dimethoxyvaraxylene) through a free-sol Tarafluor reaction. By using this paraxylene-modified phenol resin, it is possible to obtain an epoxy resin composition with extremely excellent solder stress resistance, which could not be obtained by conventional methods.
このようなフェノール樹脂の使用量はこれを調節するこ
とにより耐半田ストレス性を最大限に引き出すことがで
きる。耐半田ストレス性の効果を出す為には、式（Ｅｌ
）で示されるバラキシレン変性フェノール樹脂硬化剤を
フェノール樹脂硬化剤の３０Ｍｍ％以上、更に好ましく
は５０重量％以上の使用が望ましい。By adjusting the amount of such phenol resin used, the solder stress resistance can be maximized. In order to obtain the effect of solder stress resistance, the formula (El
) It is desirable to use the varaxylene-modified phenolic resin curing agent in an amount of 30 Mm% or more, more preferably 50% by weight or more of the phenolic resin curing agent.
この場合５０重量％未満だと、耐水性、可撓性及びリー
ドフレームとの密着性が上がらず、耐半田ストレス性が
不充分である。In this case, if it is less than 50% by weight, water resistance, flexibility, and adhesion to the lead frame will not improve, resulting in insufficient solder stress resistance.
ｎの値はＯ〜５の範囲が好ましい、この場合ｎの値が、
５より大きい場合流動性が低下し、成形性が悪くなる傾
向がある。The value of n is preferably in the range of 0 to 5. In this case, the value of n is
When it is larger than 5, fluidity tends to decrease and moldability tends to deteriorate.
又、主鎖にバラキシレンを含まないフェノールノボラッ
ク樹脂硬化剤等では耐水性及びリードフレームとの密着
性が上がらず、熱時の水蒸気の爆発による衝撃が増加し
、耐半田ストレス性の効果が得られない。In addition, phenol novolak resin curing agents that do not contain paraxylene in the main chain do not improve water resistance or adhesion to the lead frame, and the impact caused by explosions of steam during heating increases, making it difficult to improve solder stress resistance. I can't.
ここで併用する他のフェノール樹脂硬化剤とは、エポキ
シ樹脂と硬化反応するポリマー全般のことを言い、例え
ばフェノールノボラック樹脂、タレゾールノボラック樹
脂、ジシクロペンタジェン変性フェノール樹脂、多官能
フェノール樹脂、酸無水物といった一般名を挙げること
が出来る。Other phenolic resin curing agents used here refer to polymers in general that cure and react with epoxy resins, such as phenol novolac resins, talesol novolac resins, dicyclopentadiene-modified phenolic resins, polyfunctional phenolic resins, and acid Common names such as anhydrides can be mentioned.
本発明に使用される無機充填材としては通常のシリカ粉
末として溶融シリカ、結晶シリカ、多孔質シリカ、２次
凝集シリカの他、アルミナ、炭酸カルシウム、炭素繊維
等の充填材全般を指し、特に溶融シリカ、多孔質シリカ
、２次凝集シリカの使用が好ましい。Inorganic fillers used in the present invention include ordinary silica powder such as fused silica, crystalline silica, porous silica, and secondary agglomerated silica, as well as fillers in general such as alumina, calcium carbonate, and carbon fiber. Preference is given to using silica, porous silica, and secondary agglomerated silica.
本発明に使用される硬化促進剤はエポキシ基とフェノー
ル性水酸基との反応を促進するものであればよく、一般
に封止用材料に使用されているものを広く使用すること
ができ、例えばジアザビシクロウンデセン（ＤＢＵ）、
トリフェニルホスフィン（ＴＰＰ）、ジメチルベンジル
アミン（ＢＤＭＡ）や２メチルイミダゾール（２ＭＺ）
等が単独もしくは２種類以上混合して用いられる。The curing accelerator used in the present invention may be one that promotes the reaction between the epoxy group and the phenolic hydroxyl group, and a wide variety of those commonly used in sealing materials can be used, such as diaza. Bicycloundesene (DBU),
Triphenylphosphine (TPP), dimethylbenzylamine (BDMA) and 2methylimidazole (2MZ)
etc. may be used alone or in combination of two or more.
本発明の封止用エポキシ樹脂組成物はエポキシ樹脂、硬
化剤、無機充填材及び硬化促進剤を必須成分とするが、
これ以外に必要に応じてシランカップリング剤、ブロム
化エポキシ樹脂、二酸化アンチモン、ヘキサブロムベン
ゼン等の難燃剤、カーボンブラック、ベンガラ等の着色
剤、天然ワックス、合成ワックス等の離型剤及びシリコ
ーンオイル、ゴム等の低応力添加剤等の種々の添加剤を
適宜配合しても差し支えがない。The epoxy resin composition for sealing of the present invention contains an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator as essential components,
In addition to this, silane coupling agents, brominated epoxy resins, antimony dioxide, flame retardants such as hexabromobenzene, coloring agents such as carbon black and red iron, mold release agents such as natural waxes and synthetic waxes, and silicone oils are added as necessary. There is no problem in appropriately blending various additives such as low stress additives such as rubber and the like.
又、本発明の封止用エポキシ樹脂組成物を成形材料とし
て製造するには、エポキシ樹脂、硬化剤硬化促進剤、充
填材、その他の添加剤をミキサー等によって十分に均一
に混合した後、さらに熱ロールまたはニーダ−等で溶融
混練し、冷却後粉砕して成形材料とすることができる。In addition, in order to produce the epoxy resin composition for sealing of the present invention as a molding material, the epoxy resin, curing agent, curing accelerator, filler, and other additives are thoroughly and uniformly mixed using a mixer or the like, and then further A molding material can be obtained by melt-kneading with a hot roll or kneader, cooling, and then pulverizing.
これらの成形材料は電子部品あるいは電機部品の封止、
被覆、絶縁等に適用することができる。These molding materials are used for sealing electronic or electrical parts,
Can be applied to coating, insulation, etc.
実施例１
下記組成物
式（ＩＩＩ）で示されるトリス（ヒドロキシアルキフェ
ニル）メタントリグリシジルエーテル１５重量部
オルトクレゾールノボラックエポキシ樹脂５重量部
式（ＩＶ）で示されるバラキシレン変性フェノール樹脂
ただしｎ＝０、ｌ、２が２０：５０：３０の混合物６重
量部
フェノールノボラック樹脂 ４重量部溶融シリカ
粉末 ６８．８重量部トリフェニルホス
フィン ０．２重量部カーボンブラック
０．５重量部カルナバワックス
０．５重量部を、ミキサーで常温で混合し、７０〜１
００℃で２軸ロールにより混練し、冷却後粉砕し成形材
料とした。Example 1 Composition below 15 parts by weight of tris(hydroxyalkyphenyl)methane triglycidyl ether represented by formula (III) 5 parts by weight of ortho-cresol novolac epoxy resin Variaxylene-modified phenolic resin represented by formula (IV) where n=0 , l, 2 in a ratio of 20:50:30 6 parts by weight Phenol novolak resin 4 parts by weight Fused silica powder 68.8 parts by weight Triphenylphosphine 0.2 parts by weight Carbon black
0.5 parts by weight carnauba wax
Mix 0.5 parts by weight with a mixer at room temperature to 70-1
The mixture was kneaded using twin-screw rolls at 00°C, cooled, and then ground to obtain a molding material.
得られた成形材料をタブレット化し、低圧トランスファ
ー成形機にて１７５°Ｃ１７０ｋｇ／ｃｄ、１２０秒の
条件で半田クラック試験用として６×６ＩＩＩｍのチッ
プを５２ｐＱＦＰに封止し、又半田耐湿性試験用として
３Ｘ６ｍのチップを１６ｐｓ。The obtained molding material was made into a tablet, and a 6×6IIIm chip was sealed in a 52pQFP for a solder crack test using a low-pressure transfer molding machine at 175°C, 170 kg/cd, and 120 seconds, and also for a solder moisture resistance test. 16ps for 3x6m chip.
Ｐに封止した。It was sealed in P.
封止したテスト用素子について下記の半田クランク試験
及び半田耐湿性試験をおこなった。The following solder crank test and solder moisture resistance test were conducted on the sealed test element.
半田クランク試験；封止したテスト用素子を８５℃、８
５％ＲＨの環境下で４８Ｈｒおよび７２Ｈｒ処理し、そ
の後２６０℃の半田槽に１０秒間浸浸漬後微鏡で外部ク
ランクを観察した。Solder crank test: sealed test element at 85℃, 8
It was processed for 48 hours and 72 hours in an environment of 5% RH, and then immersed in a solder bath at 260° C. for 10 seconds, and then the external crank was observed with a microscope.
半田耐湿性試験：封止したテスト用素子を８５°Ｃで、
８５％ＲＨの環境下で？２Ｈｒ処理し、その後２６０
’Ｃの半田槽にｌＯ秒間浸漬後プレッシャークツカー試
験（１２５°Ｃ１１００％ＲＨ）を行い回路のオープン
不良を測定した。Solder moisture resistance test: The sealed test element was heated to 85°C.
Under an environment of 85% RH? Treated for 2 hours, then 260
After being immersed in a solder bath of 'C for 10 seconds, a pressure couture test (125°C, 1100% RH) was performed to measure open circuit defects.
実施例２〜５
第１表の処方に従って配合し、実施例１と同様にして成
形材料を得た。この成形材料で試験用の封止した成形品
を得、この成形品を用いて実施例１と同様に半田クラン
ク試験及び半田耐湿性試験を行なった。試験結果を第１
表に示す。Examples 2 to 5 Molding materials were obtained in the same manner as in Example 1 by blending according to the formulations in Table 1. A sealed molded product for testing was obtained using this molding material, and a solder crank test and a solder moisture resistance test were conducted in the same manner as in Example 1 using this molded product. Test results first
Shown in the table.
比較例２〜６
第１表の処方に従って配合し、実施例１と同様にして成
形材料を得た。この成形材料で試験用の封止した成形品
を得、この成形品を用いて実施例１と同様に半田クラン
ク試験及び半田耐湿試験を行なった。試験結果を第１表
に示す。Comparative Examples 2 to 6 Molding materials were obtained in the same manner as in Example 1 by blending according to the formulations in Table 1. A sealed molded product for testing was obtained using this molding material, and a solder crank test and a solder moisture resistance test were conducted in the same manner as in Example 1 using this molded product. The test results are shown in Table 1.
本発明に従うと従来技術では得ることのできなかった耐
熱性、耐水性及び、可撓性を有するエポキシ樹脂組成物
を得ることができるので、半田付は工程による急激な温
度変化による熱ストレスを受けたときの耐クラツク性に
非常に優れ、更に耐湿性が良好なことから電子、電機部
品の封止用、被覆用絶縁用等に用いた場合、特に表面実
装パッケージに搭載された高集積大型チップＩＣにおい
て信幀性が非常に必要とする製品について好適である。According to the present invention, it is possible to obtain an epoxy resin composition that has heat resistance, water resistance, and flexibility that could not be obtained using conventional techniques. It has excellent crack resistance when exposed to heat, and has good moisture resistance, so it can be used for sealing electronic and electrical parts, coating insulation, etc., especially for highly integrated large chips mounted on surface mount packages. It is suitable for products that require high reliability in IC.
Claims (1)
エポキシ樹脂 ▲数式、化学式、表等があります▼・・・（ I ） Ｘ；▲数式、化学式、表等があります▼、▲数式、化学
式、表等があります▼ Ｙ；▲数式、化学式、表等があります▼、Ｚ；▲数式、
化学式、表等があります▼ （ｎとｍは、０以上の整数、ｎ＋ｍ＝１〜１０であり、
式中のＸとＺの割合が３：１で存在する混合物。）を総
エポキシ樹脂量に対して５０〜１００重量％を含むエポ
キシ樹脂 （Ｂ）式（II）の化学構造式で示されるパラキシレン変
性フェノール樹脂硬化剤 ▲数式、化学式、表等があります▼・・・（II） （ｎは整数、ｎ＝０〜５） を総フェノール樹脂硬化剤量に対して３０〜１００重量
％を含むフェノール樹脂硬化剤 （Ｃ）無機充填材 （Ｄ）硬化促進剤 を必須成分とすることを特徴とするエポキシ樹脂組成物
。(1) (A) Multifunctional epoxy resin represented by the chemical structural formula (I)▲There are mathematical formulas, chemical formulas, tables, etc.▼・・・(I)X;▲There are mathematical formulas, chemical formulas, tables, etc.▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ Y; ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, Z; ▲ Mathematical formulas,
There are chemical formulas, tables, etc. ▼ (n and m are integers greater than or equal to 0, n + m = 1 to 10,
A mixture in which the ratio of X and Z in the formula is 3:1. ) containing 50 to 100% by weight based on the total amount of epoxy resin (B) A paraxylene-modified phenolic resin curing agent represented by the chemical structural formula (II) ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼・... (II) (n is an integer, n = 0 to 5) A phenolic resin curing agent containing 30 to 100% by weight based on the total amount of phenolic resin curing agent (C) Inorganic filler (D) Curing accelerator An epoxy resin composition characterized in that it is an essential component.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30876988A JP2675108B2 (en) | 1988-12-08 | 1988-12-08 | Epoxy resin composition |
| MYPI89001694A MY104894A (en) | 1988-12-08 | 1989-12-04 | Epoxy resin composition for semiconductor sealing. |
| US07/444,919 US5001174A (en) | 1988-12-08 | 1989-12-04 | Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin |
| SG1996000866A SG43788A1 (en) | 1988-12-08 | 1989-12-08 | Epoxy resin composition for semiconductor sealing |
| DE68928583T DE68928583T2 (en) | 1988-12-08 | 1989-12-08 | Epoxy resin composition for the sealing of semiconductors |
| EP89312807A EP0372983B1 (en) | 1988-12-08 | 1989-12-08 | Epoxy resin composition for semiconductor sealing |
| KR1019890018189A KR0144007B1 (en) | 1988-12-08 | 1989-12-08 | Epoxy resin composition for simiconductor sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30876988A JP2675108B2 (en) | 1988-12-08 | 1988-12-08 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02155914A true JPH02155914A (en) | 1990-06-15 |
| JP2675108B2 JP2675108B2 (en) | 1997-11-12 |
Family
ID=17985079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30876988A Expired - Fee Related JP2675108B2 (en) | 1988-12-08 | 1988-12-08 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2675108B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0451548A (en) * | 1990-06-19 | 1992-02-20 | Nitto Denko Corp | Semiconductor device |
| US5319005A (en) * | 1992-01-27 | 1994-06-07 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing of electronic component |
-
1988
- 1988-12-08 JP JP30876988A patent/JP2675108B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0451548A (en) * | 1990-06-19 | 1992-02-20 | Nitto Denko Corp | Semiconductor device |
| US5319005A (en) * | 1992-01-27 | 1994-06-07 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing of electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2675108B2 (en) | 1997-11-12 |
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| LAPS | Cancellation because of no payment of annual fees |