JPH0318330B2 - - Google Patents
Info
- Publication number
- JPH0318330B2 JPH0318330B2 JP56086196A JP8619681A JPH0318330B2 JP H0318330 B2 JPH0318330 B2 JP H0318330B2 JP 56086196 A JP56086196 A JP 56086196A JP 8619681 A JP8619681 A JP 8619681A JP H0318330 B2 JPH0318330 B2 JP H0318330B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon single
- single crystal
- semiconductor device
- defects
- defect density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/90—
Landscapes
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56086196A JPS57201032A (en) | 1981-06-04 | 1981-06-04 | Silicon single crystal semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56086196A JPS57201032A (en) | 1981-06-04 | 1981-06-04 | Silicon single crystal semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57201032A JPS57201032A (en) | 1982-12-09 |
| JPH0318330B2 true JPH0318330B2 (OSRAM) | 1991-03-12 |
Family
ID=13880021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56086196A Granted JPS57201032A (en) | 1981-06-04 | 1981-06-04 | Silicon single crystal semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57201032A (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6031231A (ja) * | 1983-07-29 | 1985-02-18 | Toshiba Corp | 半導体基体の製造方法 |
| US4868133A (en) * | 1988-02-11 | 1989-09-19 | Dns Electronic Materials, Inc. | Semiconductor wafer fabrication with improved control of internal gettering sites using RTA |
| US4851358A (en) * | 1988-02-11 | 1989-07-25 | Dns Electronic Materials, Inc. | Semiconductor wafer fabrication with improved control of internal gettering sites using rapid thermal annealing |
-
1981
- 1981-06-04 JP JP56086196A patent/JPS57201032A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57201032A (en) | 1982-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4314595A (en) | Method of forming nondefective zone in silicon single crystal wafer by two stage-heat treatment | |
| US6958092B2 (en) | Epitaxial silicon wafer with intrinsic gettering and a method for the preparation thereof | |
| JP2003524874A (ja) | 非酸素析出性のチョクラルスキーシリコンウエハ | |
| KR20000057350A (ko) | 반도체 실리콘 에피택셜 웨이퍼 및 반도체 디바이스의 제조 방법 | |
| KR20060040733A (ko) | 웨이퍼의 제조방법 | |
| US4666532A (en) | Denuding silicon substrates with oxygen and halogen | |
| JP3022044B2 (ja) | シリコンウエハの製造方法およびシリコンウエハ | |
| JP2652110B2 (ja) | 中性子照射fzシリコン単結晶の照射欠陥除去方法 | |
| JP2742247B2 (ja) | シリコン単結晶基板の製造方法および品質管理方法 | |
| JPH0318330B2 (OSRAM) | ||
| US5574307A (en) | Semiconductor device and method of producing the same | |
| JPH04295093A (ja) | 中性子照射用原料czシリコン単結晶 | |
| JPH0561240B2 (OSRAM) | ||
| JPS6326541B2 (OSRAM) | ||
| JPH06295913A (ja) | シリコンウエハの製造方法及びシリコンウエハ | |
| JPS6344720B2 (OSRAM) | ||
| JPS63142822A (ja) | 半導体装置の製造方法 | |
| JP2652346B2 (ja) | シリコンウエーハの製造方法 | |
| JPS60176241A (ja) | 半導体基板の製造方法 | |
| JPH0319687B2 (OSRAM) | ||
| JPH0324058B2 (OSRAM) | ||
| WO2001018285A1 (fr) | Plaquette et procede de fabrication de la plaquette | |
| JPH04273128A (ja) | 半導体ウエハの製造方法および半導体集積回路装置 | |
| JP2652344B2 (ja) | シリコンウエーハ | |
| JPH02164040A (ja) | シリコン半導体基板の処理方法 |