JPH03183144A - ボンデイング用キヤピラリー - Google Patents

ボンデイング用キヤピラリー

Info

Publication number
JPH03183144A
JPH03183144A JP1321884A JP32188489A JPH03183144A JP H03183144 A JPH03183144 A JP H03183144A JP 1321884 A JP1321884 A JP 1321884A JP 32188489 A JP32188489 A JP 32188489A JP H03183144 A JPH03183144 A JP H03183144A
Authority
JP
Japan
Prior art keywords
bonding
capillary
tip
gold wire
shaped groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1321884A
Other languages
English (en)
Inventor
Toshio Usuki
臼木 俊雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1321884A priority Critical patent/JPH03183144A/ja
Publication of JPH03183144A publication Critical patent/JPH03183144A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体の金線の超音波熱圧着に用いるボンデ
ィング用キャピラリーに関するものである。
〔従来の技術〕
第2図Fat (blはボンディング用キャピラリーの
平面図および正面図、第3図は第2図の先端部の拡大W
IT向図を示す。
金線(図示せず)はキャピラ+7−(1)の穴C2)を
通り先端部へ供給され、電気トーチ、水素トーチ等によ
シ金ボールが形成すれ、1st側のボール及び2 nd
側ステッチのボンディングがキャピラリー(1)の先端
部の圧着部(8)で超音波の振動及び熱圧着によう、半
導体チップ及びパッケージリード側にボンディングされ
る。
〔発明が解決しようとする課題〕
従来のボンディング用キャピラリーは以上のように構M
cすれていたので、ボンディング時の超音波振動が金線
に対しキャピラリーの圧着部と金線とが而での接触であ
り1超音波振動が金線上をすべったり、金線に超音波の
振動が吸収されたりしてボンディングに要される超音波
振動が不安定となり1金ワイヤの不着、ボンディング強
度の不足等を引き起こし、半導体としての信頼性上致命
傷となるという問題点があった。
この発明は上記のような問題点を解決するためになとれ
たもので、ボンディングにかける超音波の振動を確実に
接着に生かすことができるセラミックのボンディング用
キャピラリーを得ることを目的とする。
〔課題を解決するための手段〕
この発明に係るボンディング用キャピラリーはキャピラ
リーの先端部の圧着部の全周に凹状の溝を設けたもので
ある。
〔作用〕
この発明にかけるボンディング用キャピラリーは、キャ
ピラリーの先端部の圧着部全周に凹状の溝を設けること
により、金線のくい込みが得られ超音波振動の安定した
供給が行われ、ボンディングが安定する。
〔実施例〕
以下、この発明の一実施例を図について説明する。第1
図において、キャピラリー先端部の圧着部(3)に凹状
の溝(4)が全周に設けられている。なお、他の符号は
前記従来のものと同一につき説明は省略する。
この実施例のボンディング用キャピラリーではボンディ
ング時の超音波振動がキャピラリー圧着部(8)の凹状
の溝(4)に金線とくい込ませて行うため、超音波振動
を確実にボンディング面に到達ぢせることができる。
なお、上記実施例では凹状の溝(4)を1重とした場合
を示しているが、キャピラリーの構造上2重、3重の凹
状溝を設けてもよい。
〔発明の効果〕
以上のようにこの発明によれば、キャピラリー先地部の
圧着部全周に凹状の溝を形成したので、ボンディング時
のキャピラリーの凹状部に金線がくい込まれ、超音波振
動がこれによう確実にボンディング用のエネルギーとし
て供給されるため、よう安定したボンディングが得られ
る効果があるつ
【図面の簡単な説明】
第1図はこの発明の一実施例によるキャピラリー先端部
の拡大断面図、第2図(al(blはキャピラリーの平
向図および正面図、第3図は第2図のキャピラリーの先
端部の拡大断面図である。 図中、(1)はキャピラリー、(2)はキャピラリー(
1)の穴、(81は先端部の圧着部、(4)は圧着部(
8)の凹状の溝を示す。 なお、図中、同一符号は同一、または相当部分を示す。

Claims (1)

    【特許請求の範囲】
  1. 金線用超音波熱圧着用キャピラリーにおいて、先端の圧
    着部全周に凹状の溝を備えたことを特徴とするボンディ
    ング用キャピラリー。
JP1321884A 1989-12-12 1989-12-12 ボンデイング用キヤピラリー Pending JPH03183144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1321884A JPH03183144A (ja) 1989-12-12 1989-12-12 ボンデイング用キヤピラリー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1321884A JPH03183144A (ja) 1989-12-12 1989-12-12 ボンデイング用キヤピラリー

Publications (1)

Publication Number Publication Date
JPH03183144A true JPH03183144A (ja) 1991-08-09

Family

ID=18137479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1321884A Pending JPH03183144A (ja) 1989-12-12 1989-12-12 ボンデイング用キヤピラリー

Country Status (1)

Country Link
JP (1) JPH03183144A (ja)

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