JPH0317914B2 - - Google Patents

Info

Publication number
JPH0317914B2
JPH0317914B2 JP30096389A JP30096389A JPH0317914B2 JP H0317914 B2 JPH0317914 B2 JP H0317914B2 JP 30096389 A JP30096389 A JP 30096389A JP 30096389 A JP30096389 A JP 30096389A JP H0317914 B2 JPH0317914 B2 JP H0317914B2
Authority
JP
Japan
Prior art keywords
mol
copper
plating
bath
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP30096389A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02232391A (ja
Inventor
Setsudo Maamuudo Iisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH02232391A publication Critical patent/JPH02232391A/ja
Publication of JPH0317914B2 publication Critical patent/JPH0317914B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP30096389A 1988-12-21 1989-11-21 アデイテイブ鍍金浴および方法 Granted JPH02232391A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28999588A 1988-12-21 1988-12-21
US289995 1988-12-21

Publications (2)

Publication Number Publication Date
JPH02232391A JPH02232391A (ja) 1990-09-14
JPH0317914B2 true JPH0317914B2 (OSRAM) 1991-03-11

Family

ID=23114079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30096389A Granted JPH02232391A (ja) 1988-12-21 1989-11-21 アデイテイブ鍍金浴および方法

Country Status (2)

Country Link
EP (1) EP0375180A3 (OSRAM)
JP (1) JPH02232391A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6031319B2 (ja) * 2012-10-04 2016-11-24 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL170871B (nl) * 1952-07-05 Nippon Electric Co Werkwijze voor het verwijderen van zware en/of giftige metalen uit afvalgas.
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles

Also Published As

Publication number Publication date
EP0375180A3 (en) 1991-01-30
EP0375180A2 (en) 1990-06-27
JPH02232391A (ja) 1990-09-14

Similar Documents

Publication Publication Date Title
JP2657423B2 (ja) 新規なスルーホールめっき印刷回路基板およびその製造方法
JP2525521B2 (ja) 無電解スズ―鉛合金めっき浴
JP3314966B2 (ja) 置換すずめっき用錯化剤
JP4445960B2 (ja) 銅表面をエッチングするための溶液を製造する方法と銅表面に金属を堆積させる方法
US5788830A (en) Electroplating process
JPH08232072A (ja) 銀めっき
JPH0243370A (ja) 重合体表面をめっき処理に備えて予備処理する改良法及びそれにより形成された改善された金属めっきプラスチック物品
JPH04500235A (ja) 化学めっき用増感活性剤
JPS6190492A (ja) 銅スル−ホ−ルプリント配線板の製造方法
US6555170B2 (en) Pre-plate treating system
US4954226A (en) Additive plating bath and process
US5328561A (en) Microetchant for copper surfaces and processes for using same
US5238550A (en) Electroplating process
JP2001348684A (ja) アルミニウムまたはアルミニウム合金の表面粗化剤およびそれを用いる表面粗化法
EP0187150B1 (en) Composition and process for conditioning the surface of plastic substrates prior to metal plating
JPH0317914B2 (OSRAM)
JPH0317913B2 (OSRAM)
WO2005048663A2 (en) Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards
CA2023846A1 (en) Process for the direct metallization of a non-conducting substrate
US4714646A (en) Electrophoretic insulation of metal circuit board core
JP2944518B2 (ja) 銅及び銅合金の表面処理剤
JPH04231473A (ja) スズ−鉛浸漬メッキ用の予備処理組成物と方法
JPS63129692A (ja) プリント配線板の製法
JPS62226695A (ja) 回路ボ−ドの製造方法
JPH06506727A (ja) 酸化薄層の選択的形成手段