JPH0317380B2 - - Google Patents

Info

Publication number
JPH0317380B2
JPH0317380B2 JP60060310A JP6031085A JPH0317380B2 JP H0317380 B2 JPH0317380 B2 JP H0317380B2 JP 60060310 A JP60060310 A JP 60060310A JP 6031085 A JP6031085 A JP 6031085A JP H0317380 B2 JPH0317380 B2 JP H0317380B2
Authority
JP
Japan
Prior art keywords
wiring
mis transistor
basic element
conductivity type
basic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60060310A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60242641A (ja
Inventor
Nobutake Matsumura
Ryusuke Hoshikawa
Yoshihide Sugiura
Hiroaki Ichikawa
Shoji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60060310A priority Critical patent/JPS60242641A/ja
Publication of JPS60242641A publication Critical patent/JPS60242641A/ja
Publication of JPH0317380B2 publication Critical patent/JPH0317380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP60060310A 1985-03-25 1985-03-25 半導体集積回路装置 Granted JPS60242641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60060310A JPS60242641A (ja) 1985-03-25 1985-03-25 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60060310A JPS60242641A (ja) 1985-03-25 1985-03-25 半導体集積回路装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP52158445A Division JPS5925381B2 (ja) 1977-12-30 1977-12-30 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60242641A JPS60242641A (ja) 1985-12-02
JPH0317380B2 true JPH0317380B2 (enrdf_load_stackoverflow) 1991-03-07

Family

ID=13138462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60060310A Granted JPS60242641A (ja) 1985-03-25 1985-03-25 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60242641A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
JPS51146195A (en) * 1975-06-11 1976-12-15 Fujitsu Ltd Diode device

Also Published As

Publication number Publication date
JPS60242641A (ja) 1985-12-02

Similar Documents

Publication Publication Date Title
JPS5925381B2 (ja) 半導体集積回路装置
US12080804B2 (en) Semiconductor integrated circuit device
US6271548B1 (en) Master slice LSI and layout method for the same
KR910000155B1 (ko) 반도체 집적회로장치 및 그 제조방법
US8410526B2 (en) Semiconductor integrated circuit device with reduced cell size
JPH077143A (ja) 二重バッファベースゲートアレイセル
CN101339947A (zh) 半导体器件
JPWO2017191799A1 (ja) 半導体集積回路装置
EP0023818A2 (en) Semiconductor integrated circuit device including a master slice and method of making the same
JPH02152254A (ja) 半導体集積回路装置
CN111033720A (zh) 半导体集成电路装置
JPH06204438A (ja) 半導体装置
JPS5844592Y2 (ja) 半導体集積回路装置
JPH0317380B2 (enrdf_load_stackoverflow)
JPS6343890B2 (enrdf_load_stackoverflow)
JPH0317383B2 (enrdf_load_stackoverflow)
JPH0317379B2 (enrdf_load_stackoverflow)
JPH0258871A (ja) ボーダーレスマスタスライス半導体装置
JPS6074647A (ja) 半導体集積回路装置
JPH0475664B2 (enrdf_load_stackoverflow)
US6198137B1 (en) Semiconductor device
JP2679034B2 (ja) 半導体集積装置
JPH0122736B2 (enrdf_load_stackoverflow)
JPH0613589A (ja) マスタースライス半導体装置
JPS62183140A (ja) 半導体集積回路装置