JPH03171748A - リードフレームに電気回路を形成する装置 - Google Patents
リードフレームに電気回路を形成する装置Info
- Publication number
- JPH03171748A JPH03171748A JP2305878A JP30587890A JPH03171748A JP H03171748 A JPH03171748 A JP H03171748A JP 2305878 A JP2305878 A JP 2305878A JP 30587890 A JP30587890 A JP 30587890A JP H03171748 A JPH03171748 A JP H03171748A
- Authority
- JP
- Japan
- Prior art keywords
- support
- support plate
- lead frame
- recess
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10P72/0446—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H10W70/04—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH4090/89A CH680176A5 (enExample) | 1989-11-14 | 1989-11-14 | |
| CH04090/89-5 | 1989-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03171748A true JPH03171748A (ja) | 1991-07-25 |
Family
ID=4269638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2305878A Pending JPH03171748A (ja) | 1989-11-14 | 1990-11-09 | リードフレームに電気回路を形成する装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5108023A (enExample) |
| JP (1) | JPH03171748A (enExample) |
| CH (1) | CH680176A5 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110666288A (zh) * | 2019-11-05 | 2020-01-10 | 贵州鑫彤瑞科技有限公司 | 一种变压器辅助焊锡装置 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2890335B2 (ja) * | 1991-07-15 | 1999-05-10 | 株式会社新川 | テープクランプ機構 |
| US5238174A (en) * | 1991-11-15 | 1993-08-24 | Kulicke And Soffa Investments, Inc. | Smart indexing head for universal lead frame work station |
| JP4298178B2 (ja) * | 2001-02-08 | 2009-07-15 | 株式会社新川 | ボンディング装置用ワーク固定装置 |
| TWI244419B (en) | 2003-09-25 | 2005-12-01 | Unaxis Internat Tranding Ltd | Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate |
| CH706712A1 (de) * | 2012-07-05 | 2014-01-15 | Besi Switzerland Ag | Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. |
| CN203827615U (zh) * | 2013-12-23 | 2014-09-10 | 中兴通讯股份有限公司 | 一种焊接托盘 |
| CN112975169B (zh) * | 2021-03-03 | 2022-11-25 | 赣州市恒邦金属制品有限公司 | 一种薄板钣金件激光打孔设备 |
| US11936153B2 (en) * | 2022-05-03 | 2024-03-19 | James McCommons | Precision soldering fixture |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5988840A (ja) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | キヤリア治具 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2432137A (en) * | 1944-08-16 | 1947-12-09 | United Shoe Machinery Corp | Circular article workholder |
| US3628717A (en) * | 1969-11-12 | 1971-12-21 | Ibm | Apparatus for positioning and bonding |
| US3823863A (en) * | 1973-02-16 | 1974-07-16 | Western Electric Co | Compensating base for lead-frame bonding |
| US3858784A (en) * | 1973-03-16 | 1975-01-07 | John C Diepeveen | Mechanism for incremental movement of vertical frame |
| US3809860A (en) * | 1973-03-16 | 1974-05-07 | J Diepeveen | Die frame support with heater element |
| US3905862A (en) * | 1973-10-17 | 1975-09-16 | Hitachi Ltd | Caulking apparatus |
| US4099660A (en) * | 1975-10-31 | 1978-07-11 | National Semiconductor Corporation | Apparatus for and method of shaping interconnect leads |
| US4550871A (en) * | 1982-08-24 | 1985-11-05 | Asm Assembly Automation Ltd. | Four-motion wire bonder |
| US4527620A (en) * | 1984-05-02 | 1985-07-09 | Varian Associates, Inc. | Apparatus for controlling thermal transfer in a cyclic vacuum processing system |
| IN165317B (enExample) * | 1985-07-23 | 1989-09-16 | Siemens Ag | |
| JPS62128131A (ja) * | 1985-11-29 | 1987-06-10 | Toshiba Corp | 半導体組立装置 |
| US4896811A (en) * | 1989-05-16 | 1990-01-30 | Unisys Corporation | Machine for bonding leads to non-coplanar substrates |
-
1989
- 1989-11-14 CH CH4090/89A patent/CH680176A5/de not_active IP Right Cessation
-
1990
- 1990-10-26 US US07/603,986 patent/US5108023A/en not_active Expired - Fee Related
- 1990-11-09 JP JP2305878A patent/JPH03171748A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5988840A (ja) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | キヤリア治具 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110666288A (zh) * | 2019-11-05 | 2020-01-10 | 贵州鑫彤瑞科技有限公司 | 一种变压器辅助焊锡装置 |
| CN110666288B (zh) * | 2019-11-05 | 2021-10-08 | 芜湖金牛电气股份有限公司 | 一种变压器辅助焊锡装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5108023A (en) | 1992-04-28 |
| CH680176A5 (enExample) | 1992-06-30 |
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