JPH03159190A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To obtain a hybrid integrated circuit device having very excellent strength against an external stress such as vibration, etc., by bending to dispose a flexible material secured with a connector in a space formed of ends of both boards, incorporating the connector therein, and securing it with pouring resin. CONSTITUTION:The opening 4a of an L-shaped connector 4 is so disposed as to direct toward the face side (upper face side) of other board 1b and that the opening 4a plane and the surface of the other board 1b substantially coincide, both the boards 1a, 1b are integrated with a case material 5, the connector 4 in which a flexible material 3 is bent to be disposed is contained in a space 6 formed of the extension plate 5b of the material 5 and the peripheral ends of the boards 1a, 1b. The height of the space 6 and the thickness of the connector 4 are formed substantially the same, and a protrusion 4c is provided on the connector 4. The connector 4 is secured with epoxy resin 7 filled in the space 6.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a hybrid integrated circuit device, and more particularly to the structure of a hybrid integrated circuit device including two hybrid integrated circuit boards and a connector.

(b) Prior Art A conventional hybrid integrated circuit will be explained with reference to FIGS. 6 and 7.

The hybrid integrated circuit shown in FIG. 6 has a conductive path (not shown) of a predetermined shape formed on the surface of a ceramic substrate or an insulated metal substrate (51), and a plurality of circuit elements (
53) and a metal lead terminal (56) is fixed to a fixing pad (not shown) that is continuous with a predetermined conductive path to form a hybrid integrated circuit board, and this hybrid integrated circuit board is placed in a resin case. (52) by circuit element (53)
The lead terminals (56) are sealed tightly and filled with resin (59) to reinforce the fixed portions of the lead terminals (56).

With the increasing density of hybrid integrated circuits, a hybrid integrated circuit constructed from two hybrid integrated circuit boards (61) and (62) as shown in FIG. 7 has been proposed.

In the same figure, substrates (61) and (62) are insulated metal substrates in which one side of metal such as aluminum is coated with resin, and a conductive path (not shown) of a predetermined shape is formed on each substrate. A plurality of circuit elements (63) (64) are fixed to. Further, a metal lead terminal (65 bar 66) for external connection is not completely fixed to a fixed pad (not shown) that is continuous with a predetermined conductive path. The substrates (61) (62) on which the circuit elements and lead terminals are fixed to form a hybrid integrated circuit are connected to the respective circuit elements (63) (64).
are fixed to the case material (67〉) so that they face each other and can be fixed together.In addition, in order to allow the vertical pitch of the lead terminals to match the standardized pitch between the electrodes of the socket,
The lead terminal is spaced apart from the substrate by r' at a predetermined location, and has an abbreviated shape.

The hybrid integrated circuit may be attached to the main circuit board, or sockets (not shown) may be inserted into the lead terminals (65) and (66) to allow connection to external circuits.

(c) Problems to be Solved by the Invention In conventional hybrid integrated circuits, prior to the work of attaching the lead terminals, the vertical and horizontal positioning and tilt adjustment of the lead terminals are simultaneously carried out, and the fixed portions of the lead terminals are had to be aligned correctly with the conductive path, requiring a high level of skill to assemble.

Furthermore, the pitch between the electrodes in the vertical direction of the lead terminals often did not reach the designed value.

Furthermore, the fixed portions of the lead terminals are easily peeled off by external force, and special care must be taken when handling the hybrid integrated circuit board immediately after the lead terminals are fixed.

Furthermore, even if the fixed part of the lead terminal is reinforced to some extent, it may cause vibrations, such as when used in a car.
It has been difficult to use this device in vehicles because the external connector inserted into the lead terminal may come off due to vibration, or the fixed portion of the lead terminal may peel off.

Furthermore, since the lead terminals are led out almost horizontally, a space is required to insert the external connector, making it impossible to perform high-density mounting on the board.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes two insulating substrates on which a conductive path of a desired shape is formed, and a conductive path connected to a desired position on the conductive path. a flexible material connected to the plurality of circuit elements and at least one of the substrates and having a conductive path of a desired shape formed on its main surface; and an L-shaped connector connected to the conductive path formed on the flexible material. and a case material for arranging the two substrates so that the circuit elements face each other, a predetermined portion of the flexible material is bent and arranged in a space formed by the peripheral end portions of the two substrates, and a case material is provided in the space. A part of the shaped connector is accommodated, the connector opening is arranged on one of the substrate surfaces, and the connector is fixed with an adhesive resin injected into the space. do.

(E) Function As described above, according to the present invention, the flexible material to which the connector is fixed is bent and arranged in the space formed by the peripheral end portions of both substrates, and the connector is housed in the space, and the resin is injected. By fixing the connector to both substrates, conventional lead terminals become unnecessary. As a result, all the conventional problems can be solved.

In addition, since the connector is fixed by the resin injected into the space, it is completely integrated with both boards, and the connector will not peel off due to external force or vibration.

Further, according to the present invention, a hybrid integrated circuit device with a connector can be provided with a structure using a standardized general L-shaped connector.

(F) Example An example of the present invention will be described below based on the drawings shown in FIGS. 1 to 4.

FIG. 1 is a cross-sectional view showing the hybrid integrated circuit device of the present invention, in which (la) and (lb) are formed on insulating substrates, (2a) and (2b) are formed on both edge substrates (la) and (lb). Conductive path, (3
) is a flexible material connected to the negative substrate (1a),
(4) is a conductive path (
The L-shaped connector (5) connected to the board (not shown) is a case material that fixes both the boards (la) and (lb), and (6) is the space formed by the board (la) and (lb).
7) is the resin completely injected into the space (6>).

As the two insulating substrates (la) (lb), glass epoxy resin substrates, ceramic substrates, phenol substrates, or metal substrates subjected to insulation treatment are mainly used.

In this embodiment, a metal substrate such as aluminum is used in consideration of heat dissipation and shielding properties. An alumite film is formed on the surface of the metal substrate to provide insulation.

On both substrates (la) and (lb), a conductive path (2a) (with a desired shape) is formed by etching copper foil or printing copper paste through an insulating resin layer (not shown) such as epoxy.
2b) is formed. The conductive path (2a) formed on one substrate (la) is formed over almost the entire area of the substrate (1a), and the conductive path (2a) formed on the other substrate (1b) is formed on the negative side of the conductive path (2a). A fixing pad (not shown) for connection with the flexible material (3) (to be described later) is formed near the opposing side. A conductive path (
2b) is formed in a region excluding the vicinity of the - side, and a fixation connecting to the conductive path (2g) is formed on the other sides.

Conductive path (2a) formed on both substrates (la) (lb)
A plurality of circuit elements are mounted at desired positions in (2b). On one substrate (1a), heat generating circuit elements (8a) such as power transistors or memory ICs are mainly mounted, and are connected to nearby conductive paths (2b) by wires.

On the other substrate (1b) are transistors, chip resistors,
Circuit elements that do not generate heat such as chip capacitors (8b
) is mainly mounted and connected to the nearby conductive path (2b) by wire.

Both substrates (la) and (lb) are spaced apart and fixed using a case material (5) so that the respective circuit elements (8a) and (8b) face each other.

FIG. 2 is a perspective view showing the case material (5) used in this example. As shown in the figure, the case material (5) is formed into a frame shape, and has a frame part (5a) and a frame part (5a) extending from the frame part (5a) at both ends of the frame part (5a) in the longitudinal direction. Extension plate (
5b) and a protruding rod (5c), which are injection molded from an insulating resin material. The peripheral edge of the case material (5) and both substrates (
The circumferential edges of la) and lb are designed to be substantially equal.

When both substrates (1g>(lb) are placed in the case material (5), a space (6) is formed at the peripheral end portions of both substrates (la) (lb).

The first feature of the present invention is that both substrates (1a) (
A connector (4) integrally fixed to a flexible member (3) is disposed in a space (6) formed at the peripheral end of the flexible member (3).

Figures 3A and 3B are a cross-sectional view and a plan view showing the flexible material (3) used in this example, and (38) is a flexible film L made of polyimide resin, etc. (3b) is a film plate. (3a) Conductive path formed on top, (3C) through hole for terminal connection, (3d
) is a reinforcing film plate.

A plurality of substantially linear conductive paths (3b) are formed on the film plate (3a).
) is formed by etching the copper foil of the film plate (3a) to which the copper foil has been previously attached. At this time, a conductive path (3b) is formed so as to lead out from the negative side peripheral edge of the film plate (3a). The conductive path (3b) led out from the film plate (38) becomes a connection terminal (3e) when connecting to the substrate (1a). Meanwhile, a plurality of through holes (3C) are formed in the film plate (3a) on which the conductive paths (3b) are formed. A terminal of a connector (4), which will be described later, is inserted into this through hole (3C). Further, a reinforcing film plate (3d) is attached to the area near where the through hole (3c) is formed, in order to minimize the strain generated at the terminal fixing portion.

As shown in FIG. 4, the connector (4) is a female L-shaped connector (hereinafter referred to simply as a connector) with a standardized female L-shaped connector on the membrane surface. Although not shown, a large number of external connection terminals are arranged within the opening (4a) of the connector (4). The one terminal (4b) that extends from the external connection terminal is the connector (4b).
) is derived from. This lead terminal (4b) is inserted into the through hole (3C) of the flexible material (3) and is firmly connected to the conductive path (3C) by soldering.

The flexible material (3) to which the connector (4) is fixed is connected to the conductive path (2a) on one board (1a) by solder.More detailed, the connection terminal (3) of the flexible material (3)
3e) and the conductive path (2a) are soldered to the board (1a).
and the flexible material (3) are fixed together.

After fixing one board (1a) and the flexible material (3) together, the case material (5) is placed and the other board (lb
) and one of the substrates (1a) are fixed with a case material (5). At this time, the respective circuit elements (8a) (8b) are completely sealed by both the substrates (la) (lb) and the case material (5).

Furthermore, the opening (4a) of the L-shaped connector (4) is arranged so as to face the surface side (upper surface side) of the other substrate (1b). To explain further, the opening (4a) surface and the other substrate (1
b) arranged so as to be substantially the same as the surface;

When both boards (la) and (lb) are integrally fixed with the case material (5), the extension plate (5b) of the case material (5) and each board (1
a) In a space (6) formed at the peripheral end portion of (1b), a flexible material (3) is bent and placed, and a connector (4) is housed therein. At this time, connect the connector (4)
The position is regulated by a protruding rod (5c) provided on the case material (5).

Since the height of the space 6) and the thickness of the connector (4) are substantially the same, the protrusion (4c) provided on the connector (4) and the periphery of the substrates (la) and (lb) The connector (4) is temporarily fixed within the space (6) by contacting the convex portions (1g') (lb') provided on the end surface.

The second feature of the present invention is that both substrates (1a) (l
b) and the connector (4) are fixed together with the resin (7). That is, the connector (4) is fixed with the epoxy resin (7) filled in the space (6). Space part (6)
The injection port for filling the resin (7) into the inside is connected to the protrusion (4C) of the connector (4) and the protrusion (la) of the board (la) (ib).
It is injected from the gap (arrow) formed between ')(lb') or the gap at both ends of the connector (4) in the longitudinal direction (not shown). When injecting the resin (7), the connector (4) has a protruding part (4C), a convex part (la') ("lb'
) and the protruding rod (5c), so that no misalignment occurs.

On the other hand, between the boards (la) and (lb) of opposite ff1ll where the connector (4) is fully arranged in the space (6), the respective conductive paths (2
a) The connection of (2b) is made.

FIG. 5 is a sectional view showing another embodiment, in which the flexible material (3) is integrally fixed to the substrate (1a) in advance. In such a case, in order to accommodate the connector (4) in the space (6), it is necessary to provide the flexible material (3) with a certain amount of play. The connector (4) can be easily accommodated in the space (6) by bending and arranging the play part in a bellows shape.

According to the present invention, an L-shaped connector (4) connected to a flexible member (3) is arranged in a space formed between the peripheral edges of two substrates (la) and (lb). Filled resin (
By fixing the connector (4) by 7),
Since the inner metal part of the space (6) is filled with the resin (7), the contact area between the flexible material (3) and the conductive path (2a) and the lead terminal (4b) between the flexible material (3) and the connector (4) are formed. This can completely prevent the occurrence of peeling due to vibration at the connection with the external connector (4).Furthermore, as mentioned above, the connector (4) itself is firmly fixed, so the external connector can be inserted and removed in a stable manner.

(G) Effects of the Invention As detailed above, according to the present invention, two substrates (l
a) Arrange the L-shaped connector (4) connected to the flexible material (3) in the space formed between the peripheral ends of (lb) and fix the connector (4) with the filled resin (7). By connecting the connector (4) to the board (la) (l
b) It is possible to provide a connector-integrated hybrid integrated circuit device that can be firmly fixed to the connector and has excellent strength against external stress such as vibration.

Further, since the L-shaped connector (4) used in the present invention can be standardized, the cost will not be high.

Furthermore, in the present invention, the connector (4) is made of flexible material <
3), so that it is not affected by the heat generated by the one substrate (1a) at all.

Furthermore, in the present invention, since copper foil is used for the conductive path that can be formed on the flexible material, it is possible to flow a large current.

Furthermore, in the present invention, in order to use a standardized connector (4), it is possible to change the board size or to use a standardized connector (4).
) has the advantage that the design can be easily changed even if there is a change in itself.

Furthermore, since the present invention uses a standardized L-shaped connector, the opening thereof is disposed on the top side, which has the advantage that external connectors can be easily inserted and removed.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing the present invention, Fig. 2 is a perspective view showing the case material used in this embodiment, and Figs. 3 A and B are sectional views and plan views showing the flexible material used in this embodiment. , FIG. 4 is a perspective view showing an L-shaped connector, FIG. 5 is a sectional view showing another embodiment, and FIGS. 6 and 7 are sectional views showing a conventional example. (la) (lb)...Substrate, (2a) (2b)-conducting path, (3)...Flexible material, (4)...
L-shaped connector (6)...Space, (7)...
resin.

Claims (11)

[Claims] (1) Two insulating substrates on which a conductive path of a desired shape is formed, a plurality of circuit elements connected to desired positions on the conductive path, and at least one of the substrates connected to the substrate and having a conductive path of a desired shape on its main surface. The flexible material includes a flexible material in which a path is formed, an L-shaped connector connected to the conductive path formed on the flexible material, and a case material in which both the substrates are arranged so that the circuit elements face each other. A predetermined portion of the flexible material is bent and arranged in a space formed by the peripheral end portions of both boards, a part of the L-shaped connector is accommodated in the space, and the connector opening is placed on one of the board surfaces. A hybrid integrated circuit device, characterized in that the connector is placed on the side and fixed with an adhesive resin injected into the space. (2) The hybrid integrated circuit device according to claim 1, wherein the opening surface and the substrate surface are substantially the same surface. (3) The hybrid integrated circuit device according to claim 1, wherein a plurality of protrusions are provided on the surface of the connector disposed in the space. (4) The hybrid integrated circuit device according to claim 3, wherein the height of the space and the thickness of the connector are substantially the same. (5) The hybrid integrated circuit device according to claim 1, wherein the case material is a frame having a constant thickness that is substantially coincident with the peripheral edges of both the substrates. (6) The hybrid integrated circuit device according to claim 1, wherein both of the insulating substrates are metal substrates treated with insulation. (7) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path. (8) The hybrid integrated circuit device according to claim 1, wherein a polyimide film is used as the flexible material. (9) The hybrid integrated circuit device according to claim 8, wherein a connecting terminal is led out from one side of the flexible material and connected to a conductive path formed on the one substrate. (10) The hybrid integrated circuit device according to claim 8, wherein a connection area of the flexible material to which the connector is connected is thicker than other areas. (11) The hybrid integrated circuit device according to claim 1, wherein the two substrates are connected to each other by a connecting body at the other peripheral end portion where the connector is not arranged.