JPH03159186A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH03159186A JPH03159186A JP29830489A JP29830489A JPH03159186A JP H03159186 A JPH03159186 A JP H03159186A JP 29830489 A JP29830489 A JP 29830489A JP 29830489 A JP29830489 A JP 29830489A JP H03159186 A JPH03159186 A JP H03159186A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- integrated circuit
- hybrid integrated
- circuit device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 64
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000004840 adhesive resin Substances 0.000 claims description 2
- 229920006223 adhesive resin Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 15
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 230000006355 external stress Effects 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010396 two-hybrid screening Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は混成集積回路装置に関し、特に−枚の混成集積
回路基板にコネクターを備えた混成集積回路装置の構造
に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit device, and more particularly to the structure of a hybrid integrated circuit device in which two hybrid integrated circuit boards are provided with a connector.
（ロ）従来の技術 第７図を参照して従来の混成集積回路を説明する。(b) Conventional technology A conventional hybrid integrated circuit will be explained with reference to FIG.
第７図に示す混成集積回路は、セラミックス基板あるい
は絶縁金属基板（５１）の表面に所定形状の導電路（図
示しない）を形成し、その導電路上に複数の回路素子（
５３）を固着すると共に所定の導電路に連続する固着パ
ッド（図示しない）に金属性のリード端子（５６）を固
着して混成集積回路基板を形成し、この混成集積回路基
板を樹脂製のケース（５２）によって回路素子（５３）
が密封されるよう封止し、更に樹脂（５９）を充填して
リード端子（５６）の固着部を補強したものである。The hybrid integrated circuit shown in FIG. 7 has a conductive path (not shown) of a predetermined shape formed on the surface of a ceramic substrate or an insulated metal substrate (51), and a plurality of circuit elements (
53) and a metal lead terminal (56) is fixed to a fixing pad (not shown) that is continuous with a predetermined conductive path to form a hybrid integrated circuit board, and this hybrid integrated circuit board is placed in a resin case. (52) by circuit element (53)
The lead terminals (56) are sealed tightly and filled with resin (59) to reinforce the fixed portions of the lead terminals (56).
斯る混成集積回路は主回路基板に取り付けられるか、あ
るいはリード端子（５６）にソケット（図示しない）が
挿入されて外部回路との接続がなされる。Such a hybrid integrated circuit is attached to the main circuit board, or a socket (not shown) is inserted into the lead terminal (56) to connect it to an external circuit.
（ハ）発明が解決しようとする課題
従来の混成集積回路は、リード端子の固着作業に先立っ
て、リード端子の上下、左右の位置合わせおよび傾きの
調節を同時に行って、リード端子の固着部を導電路に正
しく相対させねばならず、組み立て作業に高度の熟練を
要した。(c) Problems to be Solved by the Invention In conventional hybrid integrated circuits, prior to fixing the lead terminals, the vertical and horizontal positioning and tilt adjustment of the lead terminals are simultaneously performed to fix the fixed portion of the lead terminals. The assembly required a high degree of skill as it had to be aligned correctly with the conductive path.
更にまた、リード端子の固着部は外力により剥離し易く
、特にリード端子固着直後の混成集積回路基板の取り扱
いには注意を要した。Furthermore, the fixed portions of the lead terminals tend to peel off due to external force, and special care must be taken when handling the hybrid integrated circuit board immediately after the lead terminals are fixed.
更にまた、リード端子の固着部をある程度補強したとし
ても振動のある例えば車載用に用いた場合などでは、振
動によるリード端子に挿入した外部コネクターの離脱あ
るいはリード端子の固着部分の剥離が発生し車載用とし
て用いることが困難であった。Furthermore, even if the fixed parts of the lead terminals are reinforced to some extent, if there is vibration, such as when used in a vehicle, the external connector inserted into the lead terminals may come off due to the vibrations, or the fixed part of the lead terminals may peel off. It was difficult to use it for practical purposes.
更に、リード端子が略水平に導出されているために外部
コネクターを挿入する際、挿入するためのスペースが必
要となり取付は基板上に高密度な実装が行えなかった。Furthermore, since the lead terminals are led out approximately horizontally, a space is required for inserting the external connector, making it impossible to perform high-density mounting on the board.
（ニ）課題を解決するための手段
本発明は上述した課題に鑑みて為されたものであり、所
望形状の導電路が形成された絶縁基板と前記導電路上の
所望位置に接続された複数の回路素子と前記基板と連結
され且つその主面に所望形状の導電路が形成されたフレ
キシブル材と前記フレキシブル材上に形成した前記導電
路と接続されたコネクターと前記基板と固着され前記回
路素子を密封するケース材とを具備し、前記基板周端部
分と前記ケース材周端部分で形成される空間部で前記フ
レキシブル材の所定部分を折り曲げ配置啓せ、前記空間
部に前記コネクターを収納し、前記空間部に注入される
接着性樹脂剤で前記コネクターを固定したことを特徴と
する。(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes an insulating substrate on which a conductive path of a desired shape is formed, and a plurality of conductive paths connected to desired positions on the conductive path. A flexible material connected to the circuit element and the substrate and having a conductive path of a desired shape formed on its main surface, a connector formed on the flexible material and connected to the conductive path, and a connector fixed to the substrate and connected to the circuit element. a case material to be sealed, a predetermined portion of the flexible material is bent and arranged in a space formed by the peripheral end portion of the board and the peripheral end portion of the case material, and the connector is housed in the space, The present invention is characterized in that the connector is fixed with an adhesive resin injected into the space.
（＊）作用
この様に本発明に依れば、ケース材の周端部と基板の周
端部分で形成される空間部でコネクターが固着されたフ
レキシブル材を折り曲げ配置きせ且つ空間部に前記コネ
クターを収納して注入樹脂によって前記コネクターをケ
ース材と基板とに固定することにより、従来のリード端
子が不必要になる。その結果、従来の課題が全て解決す
ることができる。(*) Effect As described above, according to the present invention, the flexible material to which the connector is fixed is bent and placed in the space formed by the peripheral end of the case material and the peripheral end of the board, and the connector is placed in the space. By housing the connector and fixing the connector to the case material and the board using injected resin, conventional lead terminals become unnecessary. As a result, all the conventional problems can be solved.
また、空間部分内に注入される樹脂でコネクターを固定
するためにケース材と基板に完全に一体化され、外力あ
るいは振動等によりコネクターが剥離することがない。In addition, since the connector is fixed by the resin injected into the space, it is completely integrated with the case material and the board, and the connector will not peel off due to external force or vibration.
更に、本発明では標準化された一般的なコネクターを用
いた構造でコネクター付の混成集積回路装置が提供でき
る。Further, according to the present invention, a hybrid integrated circuit device with a connector can be provided with a structure using a standardized general connector.
（へ）実施例
以下に第１図乃至第４図に示した図面に基づいて本発明
の一実施例を説明する。(F) Example An example of the present invention will be described below based on the drawings shown in FIGS. 1 to 4.
第１図は本発明の混成集積回路装置を示す断面図であり
、（１）は絶縁基板、（２）は絶縁基板（１）上に形成
された導電路、（３）は基板（１）と連結されたフレキ
シブル材、（４〉はフレキシブル材〈３）上に形成され
た導電路（図示しない）と接続されたコネクター、（５
）は基板（１）を固着するケース材、（６）は基板（１
）によって形成された空間部、（７）は空間部（６）内
に注入された樹脂である。FIG. 1 is a sectional view showing a hybrid integrated circuit device of the present invention, in which (1) is an insulating substrate, (2) is a conductive path formed on the insulating substrate (1), and (3) is a substrate (1). (4) is a connector connected to a conductive path (not shown) formed on the flexible material (3);
) is the case material that fixes the board (1), and (6) is the case material that fixes the board (1).
), and (7) is the resin injected into the space (6).
絶縁基板（１）としてはガラスエポキシ樹脂基板、セラ
ミックス基板、フェノール基板あるいは絶縁処理が施さ
れた金属基板が主として用いられる。本実施例では放熱
性およびシールド性を考慮しアルミニウムの如き、金属
基板を用いろものとする。その金属基板の表面にはアル
マイト膜が形成され絶縁処理が行われている。As the insulating substrate (1), a glass epoxy resin substrate, a ceramic substrate, a phenol substrate, or a metal substrate subjected to insulation treatment is mainly used. In this embodiment, a metal substrate such as aluminum is used in consideration of heat dissipation and shielding properties. An alumite film is formed on the surface of the metal substrate to perform insulation treatment.
基板（１）上にはエポキシ等の絶縁樹脂層（図示しない
）を介して銅箔のエツチングあるいは銅ペースト印刷等
の手段により所望形状の導電路（２）が形成される。基
板（１）上に形成される導電路（２）は略基板（１）の
全域に亘って形成され、その側辺近傍には後述するフレ
キシブル材（３）を固着する固着パッド（図示しない）
が形成される。A conductive path (2) having a desired shape is formed on the substrate (1) by means such as copper foil etching or copper paste printing via an insulating resin layer (not shown) such as epoxy. The conductive path (2) formed on the substrate (1) is formed over almost the entire area of the substrate (1), and near the side thereof there are fixing pads (not shown) for fixing a flexible material (3) to be described later.
is formed.
基板（１）上に形成された導電路（２）の所望位置に複
数の回路素子（８）が搭載される。基板（１）上にはパ
ワートランジスタあるいはメモリーＩＣ等の発熱を有す
る回路素子（８）およびトランジスタ、チップ抵抗、チ
ップコンデンサー等の発熱を有さない回路素子（８）が
搭載され近傍の導電路（２）とワイヤで接続される。A plurality of circuit elements (8) are mounted at desired positions on a conductive path (2) formed on a substrate (1). Circuit elements (8) that generate heat, such as power transistors or memory ICs, and circuit elements (8) that do not generate heat, such as transistors, chip resistors, and chip capacitors, are mounted on the substrate (1), and conductive paths (8) in the vicinity are mounted. 2) is connected with a wire.
基板（１）はケース材（５）を用いて回路素子（８）を
密封する様にケース材（５）と固着される。The substrate (1) is fixed to the case material (5) so as to seal the circuit element (8) using the case material (5).
第２図は本実施例で用いられるケース材（５）を示す斜
視図である。同図の如く、ケース材（５）は箱状に形成
された笛部（５８）と、その笛部（５ａ）の長手方向の
両端部に笛部（５ａ）より延在形成された延在板（５ｂ
）とから構成され、絶縁樹脂材で射出形成される。ケー
ス材（５）の周端部と基板（１）との周端部は実質的に
等しくなる様に設計されている。FIG. 2 is a perspective view showing the case material (5) used in this example. As shown in the figure, the case material (5) includes a box-shaped whistle part (58) and an extension formed from the whistle part (5a) at both longitudinal ends of the whistle part (5a). Board (5b
), and is injection molded from an insulating resin material. The circumferential edge of the case material (5) and the circumferential edge of the substrate (1) are designed to be substantially equal.
ケース材（５）に基板（１）を配置すると基板（１）の
周端部には空間部（６）が形成される。When the substrate (1) is placed in the case material (5), a space (6) is formed at the peripheral end of the substrate (1).
本発明の第１の特徴とするところは、ケース材（５）の
周端部と基板（１）の周端部で形成された空間部（６）
にフレキシブル材（３）と一体止されたコネクター（４
）を配置することにある。The first feature of the present invention is that a space (6) is formed between the peripheral edge of the case material (5) and the peripheral edge of the substrate (1).
Connector (4) integrally fixed with flexible material (3)
).
第３図ＡおよびＢは本実施例で用いられるフレキシブル
材（３）を示す断面図および平面図であり、（３ａ）は
ポリイミド樹脂等よりなりフレキシブル性を有したフィ
ルム板、（３ｂ）はフィルム板（３ａ）上に形成された
導電路、（３ｃ）は端子接続用のスルーホール、（３ｄ
）は補強用フィルム板である。Figures 3A and 3B are a cross-sectional view and a plan view showing the flexible material (3) used in this example, in which (3a) is a flexible film plate made of polyimide resin, etc., and (3b) is a film plate. Conductive paths formed on the plate (3a), (3c) through holes for terminal connection, (3d)
) is a reinforcing film plate.
フィルム板（３ａ）上には略直線状に形成された複数本
の導電路（３ｂ）が形成されている。その導電路（３ｂ
）はあらかじめ銅箔が貼着されたフィルム板（３ａ）の
銅箔をエツチングして形成される。このとき、フィルム
板（３ａ）の−側辺周端辺より導電路（３ｂ）を導出す
る様に形成する。フィルム板（３ａ）より導出された導
電路（３ｂ）は基板（１）上に接続する際の接続端子（
３ｅ）となる。一方、導電路（３ｂ）が形成されたフィ
ルム板（３ａ）には複数のスルーホール（３Ｃ）が形成
される。このスルーホール（３ｃ）には後述するコネク
ター（４）の端子が挿入される。また、スルーホール（
３ｃ）を形成した近傍の領域には補強用のフィルム板（
３ｄ）が貼着され端子固着部分で発生する歪を最小限に
抑制する様に考慮されている。A plurality of substantially linear conductive paths (3b) are formed on the film plate (3a). The conductive path (3b
) is formed by etching the copper foil of the film plate (3a) to which the copper foil has been previously attached. At this time, a conductive path (3b) is formed so as to lead out from the negative side peripheral edge of the film plate (3a). The conductive path (3b) led out from the film plate (3a) serves as a connection terminal (
3e). Meanwhile, a plurality of through holes (3C) are formed in the film plate (3a) on which the conductive paths (3b) are formed. A terminal of a connector (4), which will be described later, is inserted into this through hole (3c). Also, through holes (
A reinforcing film plate (
3d) is attached to minimize distortion occurring at the terminal fixing portion.
コネクター（４）は第４図に示す如く、−船釣に標準化
された雌型コネクターが用いられる。コネクター（４）
の開口部（４ａ）内には図示されないが多数本の外部接
続用の端子が配置されている。その外部接続用端子から
延在されたリード端子（４ｂ）がコネクター（４）から
導出されている。このリード端子（４ｂ）はフレキシブ
ル材（３）のスルーホール（３Ｃ）に挿入され導電路（
３ｂ）と半田で固着接続される。As shown in FIG. 4, the connector (4) is a female connector standardized for boat fishing. Connector (4)
Although not shown, a large number of external connection terminals are arranged within the opening (4a). A lead terminal (4b) extending from the external connection terminal is led out from the connector (4). This lead terminal (4b) is inserted into the through hole (3C) of the flexible material (3) and the conductive path (
3b) and is firmly connected with solder.
コネクター（４〉を固着したフレキシブル材（３〉は基
板（１）上の導電路（２）と半田で接続される。更に詳
述するとフレキシブル材（３）の接続端子（３ｅ）と導
電路（２）とが半田付されて基板（１）とフレキシブル
材（３）とが一体止詐れる。The flexible material (3) to which the connector (4> is fixed) is connected to the conductive path (2) on the board (1) by soldering.More detailed, the connecting terminal (3e) of the flexible material (3) and the conductive path ( 2) are soldered, and the board (1) and the flexible material (3) are fixed together.
基板（１）とフレキシブル材（３）とを一体止させた後
、ケース材（５）を配置して基板（１〉とケース材（５
）とを固着する。このとき、回路素子（８）は基板（１
〉とケース材（５）とで完全に密封される。After the board (1) and the flexible material (3) are fixed together, the case material (5) is placed and the board (1> and the case material (5)
) and fix it. At this time, the circuit element (8) is connected to the substrate (1
) and the case material (5).
基板（１）とケース材（５）を一体止すると、ケース材
（５）の延在板（５ｂ）と基板（１）の周端部分で形成
された空間部（６）にはフレキシブル材（３〉が折り曲
げ配置されてコネクター（４）が収納配置される。When the board (1) and the case material (5) are fixed together, a flexible material ( 3> is bent and placed, and the connector (4) is stored.
空間部（６）の高さとコネクター（４）の厚みとは実質
的に同一で形成されているためにコネクター（４）に設
けられた突出部（４Ｃ）と基板（１）およびケース材（
５）の周端表面に設けられた凸部（ｌａ’）（ｌｂ’）
とが当接され空間部（６）内でコネクター（４）が仮固
定される。Since the height of the space (6) and the thickness of the connector (4) are substantially the same, the protrusion (4C) provided on the connector (4), the substrate (1) and the case material (
5) Convex portions (la') (lb') provided on the peripheral end surface of
are brought into contact with each other, and the connector (4) is temporarily fixed within the space (6).
本発明の第２の特徴とするところは基板（１）とコネク
ター（４）とを樹脂（７）で固定するところにある。即
ち、空間部（６）内に充填するエポキシ系樹脂（７）で
コネクター（４）を固定する。空間部（６）内に樹脂（
７）を充填する注入口はコネクター（４）の突出部（４
ｃ）と基板（１）の凸部（１ａ゛ン（ｌｂ’）とで形成
されたすき間（矢印）あるいは図示されないがコネクタ
ー（４）の長手方向の両端のすさ間から注入される。樹
脂（７）注入の際にコネクター（４）は突出部（４ｃ）
、凸部（ｌａ’ ）（ｌｂ’ ）で位置規制されるため
に位置ズレを起こすことはない。The second feature of the present invention is that the substrate (1) and the connector (4) are fixed with a resin (7). That is, the connector (4) is fixed with the epoxy resin (7) filled in the space (6). Resin (
The inlet for filling 7) is located at the protrusion (4) of the connector (4).
The resin is injected from the gap (arrow) formed between c) and the convex portion (lb') of the substrate (1) or from the gap (not shown) at both longitudinal ends of the connector (4). 7) When injecting, the connector (4) is connected to the protrusion (4c)
, the position is restricted by the convex portions (la') and (lb'), so no misalignment occurs.
第５図は他の実施例を示す断面図であり、フレキシブル
材（３）をあらかじめ基板（１）と一体止したときのも
のである。この様なとき空間部＜６）内にコネクター（
４）を収納するのにはフレキシブル材（３）にある程度
のあそび部分を持たせる必要性がある。そのあそび部を
蛇腹状に折り曲げ配置することで空間部（６）内にコネ
クター（４）を容易に収納することができる。FIG. 5 is a sectional view showing another embodiment, in which the flexible material (3) is integrally fixed to the substrate (1) in advance. In such a case, the connector (
4), it is necessary for the flexible material (3) to have a certain amount of play. The connector (4) can be easily accommodated in the space (6) by bending and arranging the play part in a bellows shape.
更に第６図は他の実施例を示す断面図であり、コネクタ
ー（４）にＬ型状の標準化されたものを用いた場合の構
造を示す、この構造によればコネクター（４）の開口部
（４ａ）が上面に配置されるので外部コネクターの挿脱
が容易に行える。Furthermore, FIG. 6 is a sectional view showing another embodiment, and shows a structure in which a standardized L-shaped connector (4) is used. According to this structure, the opening of the connector (4) Since (4a) is placed on the top surface, external connectors can be easily inserted and removed.
斯る本発明に依れば、ケース材（５）の周端部と基板（
１）の周端部間で形成された空間部（６）にフレキシブ
ル材（３）に接続されたコネクター（４）を配置し充填
樹脂（７）によってコネクター〈４）を固定することに
より、空間部（６）内金てが樹脂（７）によって充填さ
れるのでフレキシブル材（３）と導電路（２）との接続
部およびフレキシブル材（３）とコネクター（４）のリ
ード端子（４ｂ）との接続部での振動による剥離の発生
を完全に防止することができる。更に上述した様にコネ
クター（４）自体が強固に固定されるので安定した外部
コネクターの挿脱が行える。According to the present invention, the peripheral end of the case material (5) and the substrate (
By arranging the connector (4) connected to the flexible material (3) in the space (6) formed between the peripheral ends of the parts 1) and fixing the connector (4) with the filled resin (7), Since the inner metal part (6) is filled with the resin (7), the connecting part between the flexible material (3) and the conductive path (2) and the lead terminal (4b) of the flexible material (3) and the connector (4) The occurrence of peeling due to vibration at the connection part can be completely prevented. Furthermore, as described above, since the connector (4) itself is firmly fixed, stable insertion and removal of the external connector can be performed.
（ト）発明の効果
以上に詳述した如ぐ、本発明に依れば、ケース材（５）
の周端部と基板（１）の周端部間で形成された空間部〈
６〉にフレキシブル材（３）に接続されたコネクター（
４）を配置し充填樹脂（７）によってコネクター（４）
を固定することにより、コネクター（４）を基板（１）
とケース材（５）とで強固に固定することができ、振動
等の外部応力に対して非常に強度の優れたコネクター一
体型の混成集積回路装置を提供することができる。(G) Effects of the Invention As detailed above, according to the present invention, the case material (5)
The space formed between the peripheral edge of the substrate (1) and the peripheral edge of the substrate (1)
Connector (6) connected to flexible material (3)
4) Place the connector (4) by filling the resin (7)
By fixing the connector (4) to the board (1)
It is possible to provide a connector-integrated hybrid integrated circuit device that can be firmly fixed with the case material (5) and has excellent strength against external stress such as vibration.
また、本発明で用いられるコネクター（４）は標準化さ
れたものを使用できるのでコスト高となることはない。Furthermore, since a standardized connector (4) can be used in the present invention, the cost will not be high.
更に、本発明ではフレキシブル材上に形成される導電路
に銅箔を用いているために大電流を流すことが可能であ
る。Furthermore, in the present invention, since copper foil is used for the conductive path formed on the flexible material, it is possible to flow a large current.
更に本発明ではコネクター（４）が標準化されたものを
用いるために基板サイズの変更あるいはコネクター（４
）自体の変更があったとしても容易に設計変更が行える
メリットを有する。Furthermore, in the present invention, in order to use a standardized connector (4), it is possible to change the board size or to use a standardized connector (4).
) has the advantage that the design can be easily changed even if there is a change in itself.
更に本発明では標準化されたＬ型状のコネクターを用い
るためにその開口部が上面側に配置されるので外部コネ
クターの挿脱が容易に行えるメリットを有する。Furthermore, since the present invention uses a standardized L-shaped connector, the opening thereof is disposed on the top side, which has the advantage that external connectors can be easily inserted and removed.
第１図は本発明を示す断面図、第２図は本実施例で用い
られるケース材を示す斜視図、第３図Ａ、Ｂは本実施例
で用いられるフレキシブル材を示す断面図、平面図、第
４図はコネクターを示す斜視図、第５図および第６図は
他の実施例を示す断面図、第７図は従来例を示す断面図
である。
（１）・・・基板、 （２）・・・導電路、 （３）・
・・フレキシブル材、 （４）・・・コネクター （
６）・・・空間部、（７）・・・樹脂。Fig. 1 is a sectional view showing the present invention, Fig. 2 is a perspective view showing the case material used in this embodiment, and Figs. 3 A and B are sectional views and plan views showing the flexible material used in this embodiment. , FIG. 4 is a perspective view showing the connector, FIGS. 5 and 6 are sectional views showing other embodiments, and FIG. 7 is a sectional view showing a conventional example. (1)...Substrate, (2)...Conducting path, (3)...
...Flexible material, (4)...Connector (
6)...Space part, (7)...Resin.
Claims (12)
電路上の所望位置に接続された複数の回路素子と 前記基板と連結され且つその主面に所望形状の導電路が
形成されたフレキシブル材と 前記フレキシブル材上に形成した前記導電路と接続され
たコネクターと 前記基板と固着され前記回路素子を密封するケース材と
を具備し、 前記基板周端部分と前記ケース材周端部分で形成される
空間部で前記フレキシブル材の所定部分を折り曲げ配置
させ、前記空間部に前記コネクターを収納し、前記空間
部に注入される接着性樹脂剤で前記コネクターを固定し
たことを特徴とする混成集積回路装置。(1) An insulated substrate on which a conductive path of a desired shape is formed, a plurality of circuit elements connected to desired positions on the conductive path, and a flexible substrate that is connected to the substrate and has a conductive path of a desired shape formed on its main surface. a connector connected to the conductive path formed on the flexible material, and a case material that is fixed to the board and seals the circuit element; A predetermined portion of the flexible material is bent and arranged in a space where the flexible material is placed, the connector is housed in the space, and the connector is fixed with an adhesive resin injected into the space. circuit device.
置したことを特徴とする請求項１記載の混成集積回路装
置。(2) The hybrid integrated circuit device according to claim 1, wherein the opening of the connector is arranged substantially parallel to the substrate.
複数の突出部を設けたことを特徴とする請求項１記載の
混成集積回路装置。(3) The hybrid integrated circuit device according to claim 1, wherein a plurality of protrusions are provided on the surface of the connector disposed in the space.
的に同一としたことを特徴とする請求項３記載の混成集
積回路装置。(4) The hybrid integrated circuit device according to claim 3, wherein the height of the space and the thickness of the connector are substantially the same.
一致させたことを特徴とする請求項１記載の混成集積回
路装置。(5) The hybrid integrated circuit device according to claim 1, wherein the peripheral edge of the case material and the peripheral edge of the substrate are substantially aligned.
いたことを特徴とする請求項１記載の混成集積回路装置
。(6) The hybrid integrated circuit device according to claim 1, wherein an insulated metal substrate is used as the insulating substrate.
請求項１記載の混成集積回路装置。(7) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path.
用いたことを特徴とする請求項１記載の混成集積回路装
置。(8) The hybrid integrated circuit device according to claim 1, wherein a polyimide film is used as the flexible material.
され、前記基板上に形成された導電路と接続されたこと
を特徴とする請求項８記載の混成集積回路装置。(9) The hybrid integrated circuit device according to claim 8, wherein a connecting terminal is led out from one side of the flexible material and connected to a conductive path formed on the substrate.
材の接続領域は他の領域よりも厚みを有したことを特徴
とする請求項８記載の混成集積回路装置。(10) The hybrid integrated circuit device according to claim 8, wherein a connection area of the flexible material to which the connector is connected is thicker than other areas.
る請求項１記載の混成集積回路装置。(11) The hybrid integrated circuit device according to claim 1, wherein the connector is L-shaped.
せて前記コネクターを前記空間部に収納することを特徴
とする請求項１項記載の混成集積回路装置。(12) The hybrid integrated circuit device according to claim 1, wherein the connector is housed in the space by bending the flexible material into a bellows shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1298304A JP2810453B2 (en) | 1989-11-16 | 1989-11-16 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1298304A JP2810453B2 (en) | 1989-11-16 | 1989-11-16 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03159186A true JPH03159186A (en) | 1991-07-09 |
| JP2810453B2 JP2810453B2 (en) | 1998-10-15 |
Family
ID=17857914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1298304A Expired - Fee Related JP2810453B2 (en) | 1989-11-16 | 1989-11-16 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2810453B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156831A (en) * | 2015-10-14 | 2018-06-12 | 大陆泰密克微电子有限责任公司 | For electric reversing motor go interference module, for manufacture go the method for interference module and with this vehicle for going interference module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237587A (en) * | 1975-09-19 | 1977-03-23 | Matsushita Electric Ind Co Ltd | Catalyst |
| JPS63114038U (en) * | 1987-01-16 | 1988-07-22 | ||
| JPS64787A (en) * | 1987-02-24 | 1989-01-05 | Matsushita Electric Ind Co Ltd | Electronic circuit device |
-
1989
- 1989-11-16 JP JP1298304A patent/JP2810453B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237587A (en) * | 1975-09-19 | 1977-03-23 | Matsushita Electric Ind Co Ltd | Catalyst |
| JPS63114038U (en) * | 1987-01-16 | 1988-07-22 | ||
| JPS64787A (en) * | 1987-02-24 | 1989-01-05 | Matsushita Electric Ind Co Ltd | Electronic circuit device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156831A (en) * | 2015-10-14 | 2018-06-12 | 大陆泰密克微电子有限责任公司 | For electric reversing motor go interference module, for manufacture go the method for interference module and with this vehicle for going interference module |
| JP2019500831A (en) * | 2015-10-14 | 2019-01-10 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ | Interference suppression module for electric rectifying electric motor, method of manufacturing interference suppression module, and vehicle equipped with this type of interference suppression module |
| CN108156831B (en) * | 2015-10-14 | 2021-11-02 | 大陆泰密克微电子有限责任公司 | Interference suppression module for an electrically commutated electric motor, method for producing an interference suppression module, and vehicle having such an interference suppression module |
| US11695311B2 (en) | 2015-10-14 | 2023-07-04 | Vitesco Tehcnologies Germany GmbH | Interference suppression module for an electrically commutated electric motor, method for producing an interference suppression module, and vehicle comprising such an interference suppression module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2810453B2 (en) | 1998-10-15 |
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