JPH03159192A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH03159192A JPH03159192A JP1298305A JP29830589A JPH03159192A JP H03159192 A JPH03159192 A JP H03159192A JP 1298305 A JP1298305 A JP 1298305A JP 29830589 A JP29830589 A JP 29830589A JP H03159192 A JPH03159192 A JP H03159192A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- integrated circuit
- hybrid integrated
- substrates
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010396 two-hybrid screening Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は混成集積回路装置に関し、特に二枚の混成集積
回路基板にコネクターを備えた混成集積回路装置の構造
に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a hybrid integrated circuit device, and more particularly to the structure of a hybrid integrated circuit device in which two hybrid integrated circuit boards are provided with a connector.
（ロ）従来の技術
第４図および第５図を参照して従来の混成集積回路を説
明する。(b) Prior Art A conventional hybrid integrated circuit will be explained with reference to FIGS. 4 and 5.
第４図に示す混成集積回路は、セラミックス基板あるい
は絶縁金属基板（５１）の表面に所定形状の導電路（図
示しない）を形成し、その導電路上に複数の回路素子（
５３）を固着すると共に所定の導電路に連続する固着パ
ッド（図示しない）に金属性のリード端子（５６）を固
着して混成集積回路基板を形成し、この混成集積回路基
板を樹脂製のケース（５２）によって回路素子（５３）
が密封きれるよう封止し、さらに樹脂（５９）を充填し
てリード端子（５６）の固着部を補強したものである。The hybrid integrated circuit shown in FIG. 4 has a conductive path (not shown) of a predetermined shape formed on the surface of a ceramic substrate or an insulated metal substrate (51), and a plurality of circuit elements (
53) and a metal lead terminal (56) is fixed to a fixing pad (not shown) that is continuous with a predetermined conductive path to form a hybrid integrated circuit board, and this hybrid integrated circuit board is placed in a resin case. (52) by circuit element (53)
The lead terminal (56) is hermetically sealed and is further filled with resin (59) to reinforce the fixed portion of the lead terminal (56).
混成集積回路の高密度化に伴って、第５図に図示するよ
うな二枚の混成集積回路基板（６１）（６２）から構成
される混成集積回路が提案されている。With the increasing density of hybrid integrated circuits, a hybrid integrated circuit constructed from two hybrid integrated circuit boards (61) and (62) as shown in FIG. 5 has been proposed.
同図において、基板＜６１）（６２）はアルミニウム等
の金属の一面を樹脂被覆した絶縁金属基板であり、夫々
の基板上には所定形状の導電路（図示しない）が形成さ
れ、その導電路上に複数の回路素子（６３）（６４）が
固着されている。また、所定の導電路に連続する固着パ
ッド（図示しない）には外部接続のための金属性のリー
ド端子（６５）（６６）が固着されている。回路素子お
よびリード端子が固着されて混成集積回路が形成された
基板（６１）（６２）は夫々の回路素子（６３）（６４
）が対向するようにケース材（６７）に固着され、一体
止される。なお、リード端子の上下方向のピッチｅを規
格化されたソケットの電極間ピッチに適合させるために
、リード端子は所定部位でり′だけ基板から離間され、
略り字形状を呈する。In the figure, substrates <61) and (62) are insulated metal substrates in which one side of a metal such as aluminum is coated with resin, and a conductive path (not shown) of a predetermined shape is formed on each substrate. A plurality of circuit elements (63) (64) are fixed to. Furthermore, metal lead terminals (65) and (66) for external connection are fixed to fixed pads (not shown) that are continuous with predetermined conductive paths. The circuit elements (61) (62) to which the circuit elements and lead terminals are fixed to form the hybrid integrated circuit are connected to the respective circuit elements (63) (64).
) are fixed and integrally fixed to the case material (67) so as to face each other. Note that in order to match the vertical pitch e of the lead terminals to the standardized pitch between electrodes of the socket, the lead terminals are separated from the board by a predetermined portion.
It has an abbreviated shape.
斯る混成集積回路は主回路基板に取り付けられるか、あ
るいはリード端子（６５）（６６）にソケット（図示し
ない）が挿入されて外部回路との接続がなされる。Such a hybrid integrated circuit is attached to a main circuit board, or a socket (not shown) is inserted into the lead terminals (65) and (66) to connect it to an external circuit.
（ハ）発明が解決しようとする課題
従来の混成集積回路は、リード端子の固着作業に先立っ
て、リード端子の上下、左右の位置合わせおよび傾きの
調節を同時に行って、リード端子の固着部を導電路に正
しく相対させねばならず、組み立て作業に高度の熟練を
要した。(c) Problems to be Solved by the Invention In conventional hybrid integrated circuits, prior to fixing the lead terminals, the vertical and horizontal positioning and tilt adjustment of the lead terminals are simultaneously performed to fix the fixed portion of the lead terminals. The assembly required a high degree of skill as it had to be aligned correctly with the conductive path.
また、リード端子の上下方向の電極間ピッチが設計され
た値とならないことも多かった。Furthermore, the pitch between the electrodes in the vertical direction of the lead terminals often did not reach the designed value.
さらにまた、リード端子の固着部は外力により剥離し易
く、特にリード端子固着直後の混成集積回路基板の取り
扱いには注意を要した。Furthermore, the fixed portions of the lead terminals are likely to peel off due to external force, and special care must be taken when handling the hybrid integrated circuit board immediately after the lead terminals are fixed.
さらにまた、リード端子の固着部をある程度補強したと
しても振動のある例えば車載用に用いた場合などでは、
振動によるリード端子に挿入した外部コネクターの離脱
あるいはリード端子の固着部分の剥離が発生し車載用と
して用いることが困難であった。Furthermore, even if the fixed part of the lead terminal is reinforced to some extent, it may cause vibrations, such as when used in a car.
It has been difficult to use this device in vehicles because the external connector inserted into the lead terminal may come off due to vibration, or the fixed portion of the lead terminal may peel off.
さらに、リード端子が略水平に導出されているために外
部コネクターを挿入する際、挿入するためのスペースが
必要となり取付は基板上に高密度な実装が行えなかった
。Furthermore, since the lead terminals are led out approximately horizontally, a space is required for inserting the external connector, making it impossible to perform high-density mounting on the board.
（ニ）課題を解決するための手段
本発明は上述した課題に鑑みて為されたものであり、所
望形状の導電路が形成きれた二枚の絶縁基板と前記導電
路上の所望位置に接続された複数の回路素子と前記一方
の基板上の前記導電路に接続されたコネクターと前記回
路素子を対向するように前記内基板を一体化するケース
材とを具備し、前記コネクターの開口部を露出きせる孔
を前記他方の基板の格幅−杯に設けて解決する。(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes two insulating substrates on which a conductive path of a desired shape has been formed, and a conductive path connected to a desired position on the conductive path. a case material that integrates the inner board so as to face the plurality of circuit elements, a connector connected to the conductive path on the one board, and the circuit elements, and an opening of the connector is exposed. This problem is solved by providing a hole in the width of the other substrate.
（ネ）作用
この様に本発明に依れば、一方の基板上の導電路にコネ
クターを接続し、コネクターの開口部を外部に露出させ
るための孔を前記他方の基板の略幅一杯に設は且つコネ
クターを樹脂で固定することにより、従来の如き、リー
ド端子が不要になる。(f) Function According to the present invention, the connector is connected to the conductive path on one board, and the hole for exposing the opening of the connector to the outside is provided in substantially the entire width of the other board. Furthermore, by fixing the connector with resin, conventional lead terminals are no longer necessary.
また、コネクターの開口部が上面側に配置される構造と
なるために外部コネクターの挿脱をスムーズに行える。Additionally, since the connector opening is located on the top side, external connectors can be inserted and removed smoothly.
更に、コネクターは樹脂で一方の基板およびケース材と
で強固に固定されているので外力等の振動によりコネク
ターが剥離することがない。Furthermore, since the connector is firmly fixed to one of the substrates and the case material using resin, the connector will not peel off due to vibrations such as external force.
更にコネクターは標準化されたＳＭＤ型のコネクターを
用い専用のコネクターを用いることなくコネクター一体
型の混成集積回路装置を提供することができる。Furthermore, since the connector is a standardized SMD type connector, it is possible to provide a connector-integrated hybrid integrated circuit device without using a dedicated connector.
（へ）実施例
以下に第１図乃至第３図に示した図面に基づいて本発明
の一実施例を説明する。(F) Embodiment An embodiment of the present invention will be described below based on the drawings shown in FIGS. 1 to 3.
第１図は本発明の混成集積回路装置を示す断面図であり
、（ｌａ）（ｌｂ）は絶縁基板、（２ａ）（２ｂ）は両
基板（ｌａ）（ｌｂ）上に形成された導電路、（３）は
一方の基板（１ａ）上に接続されたコネクター、（４）
は両基板（ｌａ）（ｌｂ）を一体止するケース材である
。FIG. 1 is a sectional view showing a hybrid integrated circuit device of the present invention, in which (la) and (lb) are insulating substrates, (2a) and (2b) are conductive paths formed on both substrates (la) and (lb). , (3) is the connector connected on one board (1a), (4)
is a case material that integrally fixes both substrates (la) and (lb).
二枚の絶縁基板（ｌａ）（ｌｂ）としてはガラスエポキ
シ樹脂基板、セラミックス基板、フェノール基板あるい
は絶縁処理が施された金属基板が主として用いられる１
本実施例では放熱性およびシールド性を考慮しアルミニ
ウムの如き、金属基板を用いるものとする。その金属基
板の表面にはアルマイト膜が形成され絶縁処理が行われ
ている。As the two insulating substrates (LA) (LB), glass epoxy resin substrates, ceramic substrates, phenol substrates, or metal substrates treated with insulation are mainly used1.
In this embodiment, a metal substrate such as aluminum is used in consideration of heat dissipation and shielding properties. An alumite film is formed on the surface of the metal substrate to perform insulation treatment.
両基板（ｌａ）（ｌｂ）上にはエポキシ等の絶縁樹脂層
（図示しない）を介して銅箔のエツチングあるいは銅ペ
ースト印刷等の手段により所望形状の導電路（２ａ ）
（２ｂ ）が形成される。一方の基板（１ａ）上に形
成される導電路（２ａ）は略基板（１ａ）の全域に亘っ
て形成され、その相対向する一側辺には他方の基板（１
ｂ）上に形成された導電路（２ｂ〉との接続用の固着パ
ッド（図示しない）が形成される。また、他方の基板（
１ｂ〉上に形成される導電路（２ｂ）は基板（１ａ）と
同様に略全面に形成され、その相対向する（１１辺には
導電路（２ａ）と接続する固着パッド（図示しない）が
形成される。A conductive path (2a) in a desired shape is formed on both substrates (la) and (lb) by etching copper foil or printing copper paste through an insulating resin layer (not shown) such as epoxy.
(2b) is formed. The conductive path (2a) formed on one substrate (1a) is formed over almost the entire area of the substrate (1a), and the conductive path (2a) is formed on the opposite side of the other substrate (1a).
b) A fixing pad (not shown) for connection with the conductive path (2b) formed on the other substrate (2b) is formed.
The conductive path (2b) formed on the conductive path (2b) is formed on almost the entire surface like the substrate (1a), and there are fixed pads (not shown) on the opposite sides (11 sides) to connect with the conductive path (2a). It is formed.
一方の基板（１ａ）上の導電路（２８）にはパワートラ
ンジスタ、パワー用抵抗素子、ＬＳＩチップ等を主とす
るパワー系の複数の回路素子（５ａ）が固着接続されて
いる。また、導電路（２ａ）上にはＳＭＤ型のコネクタ
ー（３）が半田を用いて固着されている。A plurality of power circuit elements (5a), mainly power transistors, power resistance elements, LSI chips, etc., are fixedly connected to the conductive path (28) on one substrate (1a). Further, an SMD type connector (3) is fixed on the conductive path (2a) using solder.
コネクター（３）は第２図に示す如く、−膜面に標準化
されたＳＭＤ型の雌型のコネクターが用いられる。この
コネクターは基板サイズあるいは集積密度によってその
大きさは異なり、本実施例では、略一方の基板（１ａ）
の幅一杯の大きさのものが用いられる。また、コネクタ
ー（３）の開口部（３ａ）内には図示されないが多数本
の外部接続用の端子が配置されていることはいうまでも
ない。As shown in FIG. 2, the connector (3) is an SMD type female connector with a standardized membrane surface. The size of this connector varies depending on the board size or integration density, and in this embodiment, approximately one board (1a)
A size that is the full width of is used. Although not shown in the drawings, it goes without saying that a large number of external connection terminals are arranged within the opening (3a) of the connector (3).
ところで、他方の基板（１ｂ）上の導電路（２ｂ）には
トランジスタ、チップ抵抗、チップコンデンサー等の発
熱を有さない複数の回路素子（５ｂ）が固着接続されて
いる。前述した複数の回路素子（５ｂ）は他方の基板（
１ｂ）の略中央部を除く領域に設けられている。即ち、
他方の基板（１ｂ）の時幅−杯の領域にはコネクター（
３）の開口部（３ａ）を露出させるための孔（１ｃ）が
設けられている。孔（１ｃ）は一方の基板（１ａ）上に
固着したコネクター（３）よりも若干大きく形成されて
おり、他方の基板（１ｂ）を区画する様に配置形成され
ている。By the way, a plurality of circuit elements (5b) that do not generate heat, such as transistors, chip resistors, and chip capacitors, are fixedly connected to the conductive path (2b) on the other substrate (1b). The plurality of circuit elements (5b) described above are mounted on the other substrate (
1b) except for the substantially central portion. That is,
The other board (1b) has a connector (
A hole (1c) is provided to expose the opening (3a) of 3). The hole (1c) is formed to be slightly larger than the connector (3) fixed on one substrate (1a), and is arranged so as to partition the other substrate (1b).
両基板（ｌａ）（ｌｂ）はケース材（４）で夫々の回路
素子（５ａ）（５ｂ）が対向する様に配置され固着一体
止される。Both substrates (la) and (lb) are arranged and fixed together with a case material (4) such that their respective circuit elements (5a) and (5b) face each other.
第３図は両基板（ｌａ）（ｌｂ）と一体止されるケース
材（４）を示す斜視図である。ケース材（４）は絶縁部
材の熱可塑性樹脂から形成され、第３図に示す如く、二
枚の基板（ｌａ）（ｌｂ）を所定間隔離間して封止空間
を形成するために枠状に形成されている。FIG. 3 is a perspective view showing the case material (4) which is integrally fixed to both the substrates (la) and (lb). The case material (4) is made of thermoplastic resin as an insulating member, and as shown in FIG. It is formed.
ケース材（４）には他方の基板（１ｂ）に設けた孔（１
ｃ）の周囲と孔（１ｃ）によって露出された一方の基板
（１ａ）表面の周囲と当接される一定の厚みを有した補
助枠（４ａ）が設けられている。この補助枠（４ａ）は
ケース材（４）と連結バー（４ｂ）によって一体形成さ
れている。The case material (4) has holes (1) provided in the other board (1b).
An auxiliary frame (4a) having a certain thickness is provided which comes into contact with the periphery of the substrate (1a) exposed by the hole (1c) and the periphery of the substrate (1a) exposed through the hole (1c). This auxiliary frame (4a) is integrally formed by a case material (4) and a connecting bar (4b).
ケース材（４〉の補助枠（４ａ）内には一方の基板（１
ａ）上に搭載されたコネクター（３）が収納配置される
様に設計される。夫々の基板（ｌａ八へｂ）の周端辺と
ケース材（３）の周端辺とは実質的に一致する様に形成
され、両基板（ｌａ）（ｌｂ）とケース材（３）は接着
性シートを介して一体化される。この結果、夫々の基板
（ｌａ）（ｌｂ）上に搭載された回路素子（５ａ）（５
ｂ）は両基板（−１ａ）（ｌｂ）とケース材（３）とで
形成される封止空間内に密封封止されることになる。One of the boards (1) is inside the auxiliary frame (4a) of the case material (4).
a) Designed in such a way that the connector (3) mounted thereon is accommodated. The peripheral edges of the respective substrates (la, 8, b) and the case material (3) are formed so as to substantially coincide with each other, and both substrates (la) (lb) and the case material (3) are They are integrated via an adhesive sheet. As a result, the circuit elements (5a) (5) mounted on the respective substrates (la) (lb)
b) is hermetically sealed within a sealed space formed by both substrates (-1a) (lb) and the case material (3).
また、両基板（ｌａ）（ｌｂ）上に形成された夫々の導
電路（２ａ）（２ｂ）は内基板（ｌａ）（ｌｂ）（７）
相対向する周端部で金属製のり一ド（７）によって接続
が行われている。In addition, the conductive paths (2a) (2b) formed on both substrates (la) (lb) are connected to the inner substrate (la) (lb) (7).
The connection is made by metal glue (7) at opposite peripheral ends.
内基板（ｌａ）（ｌｂ）とケース材（３）を固着一体止
したとき、コネクター（３）の開口部（３ａ）の先端部
と他方の基板（１ｂ）の表面とを略同−面となる様に設
計する。When the inner board (la) (lb) and the case material (3) are fixed and integrally connected, the tip of the opening (3a) of the connector (3) and the surface of the other board (1b) should be on the same plane. Design it so that it becomes.
ところで、ケース材（４）の補助枠（４ａ）内′にはエ
ポキシ樹脂等の樹脂（８）が充填きれる。即ち、補助枠
（４ａ）とコネクター（３）の周囲に形成されるスペー
スに樹脂〈８）を充填する。そのスペースに樹脂（８）
を充填することにより、コネクター（３）は−方の基板
（１ａ）と補助枠（４ａ）とで完全に固定される。By the way, the inside of the auxiliary frame (4a) of the case material (4) is completely filled with resin (8) such as epoxy resin. That is, the space formed around the auxiliary frame (4a) and the connector (3) is filled with resin (8). Resin (8) in that space
By filling the connector (3) with the - side board (1a) and the auxiliary frame (4a), the connector (3) is completely fixed.
断る本発明に依れば、一方の基板（１ｇ）上に搭載され
たコネクター（３）の開口８８（３ａ）を外部に露出さ
せるための孔（１ｃ）を他方の基板（ｌｂ）の格幅−杯
に設けることにより、コネクター（３）の開口部（３ａ
）、即ち、外部コネクターの挿脱口を上面側に配置する
ことができる。According to the present invention, the hole (1c) for exposing the opening 88 (3a) of the connector (3) mounted on one substrate (1g) to the outside is formed with a large width of the other substrate (lb). - by providing an opening (3a) in the connector (3) in the cup;
), that is, the insertion/removal port for the external connector can be placed on the top side.
また、ケース材（４）の補助枠（４ａ）内に樹脂（８）
が充填されるためにコネクター（３）が樹脂（８）によ
って強固に固定される。In addition, a resin (8) is placed inside the auxiliary frame (4a) of the case material (4).
The connector (3) is firmly fixed by the resin (8).
（ト）発明の効果
以上に詳述した如く、本発明に依れば、一方の基板（１
ａ）上に搭載されたコネクター（３）の開口部（３ａ）
を外部に露出きせるための孔（１ｃ）を他方の基板（１
ｂ）の格幅−杯に設けることにより、コネクター（３）
の開口部（３ａ）、即ち、外部コネクターの挿脱口を上
面側に配置することができる。その結果、外部接続用の
接続部分が上面となるために外部コネクターの挿脱が容
易に行える。(G) Effects of the Invention As detailed above, according to the present invention, one substrate (1
a) Opening (3a) of connector (3) mounted on
A hole (1c) for exposing the
b) Width - by providing the connector (3) on the cup
The opening (3a), that is, the insertion/removal port for the external connector can be arranged on the upper surface side. As a result, since the connection portion for external connection is on the top surface, the external connector can be easily inserted and removed.
また、ケース材（４）の補助枠（４ａ）内に樹脂（８）
が充填されるためにコネクター（３）が樹脂（８）によ
って強固に固定きれることにより、外部応力あるいは振
動によりコネクター（３）が剥離することがない。In addition, a resin (8) is placed inside the auxiliary frame (4a) of the case material (4).
Since the connector (3) is filled with the resin (8), the connector (3) can be firmly fixed by the resin (8), so that the connector (3) will not be peeled off due to external stress or vibration.
また、コネクター（３）は標準化されたものを使用でき
るためコスト高になる恐れはない。Further, since a standardized connector (3) can be used, there is no risk of high cost.
更に、本発明ではフレキシブル材上に形成される導電路
に銅箔を用いているために大電流を流すことが可能であ
る。Furthermore, in the present invention, since copper foil is used for the conductive path formed on the flexible material, it is possible to flow a large current.
更に、本発明ではコネクター（４）が標準化されたもの
を用いるために基板サイズの変更あるいはコネクター（
４）自体の変更があったとしても容易に設計変更が行え
るメリットを有する。Furthermore, in the present invention, in order to use a standardized connector (4), the board size may be changed or the connector (4) may be changed.
4) It has the advantage that even if there is a change in itself, the design can be easily changed.
第１図は本発明を示す断面図、第２図は本実施例で用い
られるコネクターを示す斜視図、第３図は本実施例で用
いられるケース材を示す斜視図、第４図および第５図は
従来例を示す断面図である。
（ｌａ）（ｌｂ）・・”基板、 （２ａ）（２ｂ）・・
・導電路、 （３）・・・コネクター （４）・・・
ケース材、 （４ａ）・・・補助枠。
第１図Fig. 1 is a sectional view showing the present invention, Fig. 2 is a perspective view showing a connector used in this embodiment, Fig. 3 is a perspective view showing a case material used in this embodiment, Figs. The figure is a sectional view showing a conventional example. (la) (lb)..."board, (2a) (2b)...
・Conductive path, (3)...connector (4)...
Case material, (4a)...Auxiliary frame. Figure 1
Claims (8)
と 前記回路素子を対向するように前記両基板を一体化する
ケース材とを具備し、 前記コネクターの開口部を露出させる孔が前記他方の基
板の略幅一杯に設けられたことを特徴とする混成集積回
路装置。(1) Two insulating substrates on which a conductive path of a desired shape is formed, a plurality of circuit elements connected to desired positions on the conductive path, a connector connected to the conductive path on one of the substrates, and the circuit. A hybrid integrated circuit comprising: a case material that integrates the two substrates so that the elements face each other, and a hole for exposing the opening of the connector is provided substantially across the entire width of the other substrate. Device.
的に同一面としたことを特徴とする請求項１記載の混成
集積回路装置。(2) The hybrid integrated circuit device according to claim 1, wherein the other substrate surface and the tip end surface of the opening are substantially the same plane.
せた一定の厚みを有する枠体を用いたことを特徴とする
請求項１記載の混成集積回路装置。(3) The hybrid integrated circuit device according to claim 1, wherein the case material is a frame having a constant thickness that substantially coincides with the peripheral edges of both the substrates.
囲の前記両基板間に配置され且つ前記枠体の一部として
設けられた補助枠を有することを特徴とする請求項３記
載の混成集積回路装置。(4) The case material has an auxiliary frame arranged between the two substrates around the hole provided in the other substrate and provided as a part of the frame body. hybrid integrated circuit device.
助枠内に充填される樹脂で前記コネクターを固定するこ
とを特徴とする請求項４記載の混成集積回路装置。(5) The hybrid integrated circuit device according to claim 4, wherein the connector is arranged within the auxiliary frame, and the connector is fixed with resin filled in the auxiliary frame.
いたことを特徴とする請求項１記載の混成集積回路装置
。(6) The hybrid integrated circuit device according to claim 1, wherein an insulated metal substrate is used as the insulating substrate.
請求項１記載の混成集積回路装置。(7) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path.
より接続されていることを特徴とする請求項１記載の混
成集積回路装置。(8) The hybrid integrated circuit device according to claim 1, wherein the two substrates are connected by a connecting body at at least one side peripheral edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1298305A JPH03159192A (en) | 1989-11-16 | 1989-11-16 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1298305A JPH03159192A (en) | 1989-11-16 | 1989-11-16 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03159192A true JPH03159192A (en) | 1991-07-09 |
Family
ID=17857928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1298305A Pending JPH03159192A (en) | 1989-11-16 | 1989-11-16 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03159192A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066311A (en) * | 2013-03-21 | 2014-09-24 | 株式会社丰田自动织机 | Substrate Spacing Member And Inverter Device |
| CN109121292A (en) * | 2018-09-29 | 2019-01-01 | 维沃移动通信有限公司 | A kind of board structure of circuit, production method and electronic equipment |
-
1989
- 1989-11-16 JP JP1298305A patent/JPH03159192A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066311A (en) * | 2013-03-21 | 2014-09-24 | 株式会社丰田自动织机 | Substrate Spacing Member And Inverter Device |
| JP2014183719A (en) * | 2013-03-21 | 2014-09-29 | Toyota Industries Corp | Member for holding distance between substrates, and inverter device |
| US9485865B2 (en) | 2013-03-21 | 2016-11-01 | Kabushiki Kaisha Toyota Jidoshokki | Substrate spacing member and inverter device |
| CN104066311B (en) * | 2013-03-21 | 2019-08-16 | 株式会社丰田自动织机 | Substrate gap retaining member and DC-to-AC converter |
| CN109121292A (en) * | 2018-09-29 | 2019-01-01 | 维沃移动通信有限公司 | A kind of board structure of circuit, production method and electronic equipment |
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