JPH031531U - - Google Patents

Info

Publication number
JPH031531U
JPH031531U JP6143789U JP6143789U JPH031531U JP H031531 U JPH031531 U JP H031531U JP 6143789 U JP6143789 U JP 6143789U JP 6143789 U JP6143789 U JP 6143789U JP H031531 U JPH031531 U JP H031531U
Authority
JP
Japan
Prior art keywords
sample
plasma processing
holder
sample holder
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6143789U
Other languages
English (en)
Other versions
JPH0747866Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989061437U priority Critical patent/JPH0747866Y2/ja
Publication of JPH031531U publication Critical patent/JPH031531U/ja
Application granted granted Critical
Publication of JPH0747866Y2 publication Critical patent/JPH0747866Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係るプラズマ処理装置の断面
図、第2図は試料押えを下方から見た斜視図、第
3図は別実施例を示す第2図と同様の図である。 尚、図面中1は装置本体、2は開口、4はチヤ
ンバー、5は試料、6は試料台、12は試料押え
、13は温度センサーである。

Claims (1)

    【実用新案登録請求の範囲】
  1. チヤンバー内に臨む試料台上に試料を載置する
    とともにこの試料を試料押えにて押えつけた状態
    でエツチング等の処理を行うようにしたプラズマ
    処理装置において、前記試料押えには試料表面に
    接触した試料の温度を直接測定する温度センサー
    を埋設していることを特徴とするプラズマ処理装
    置。
JP1989061437U 1989-05-26 1989-05-26 プラズマ処理装置 Expired - Lifetime JPH0747866Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989061437U JPH0747866Y2 (ja) 1989-05-26 1989-05-26 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989061437U JPH0747866Y2 (ja) 1989-05-26 1989-05-26 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPH031531U true JPH031531U (ja) 1991-01-09
JPH0747866Y2 JPH0747866Y2 (ja) 1995-11-01

Family

ID=31589686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989061437U Expired - Lifetime JPH0747866Y2 (ja) 1989-05-26 1989-05-26 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPH0747866Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132510A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd 基板の温度制御機構

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132510A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd 基板の温度制御機構

Also Published As

Publication number Publication date
JPH0747866Y2 (ja) 1995-11-01

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