JPH03151213A - Molding device - Google Patents
Molding deviceInfo
- Publication number
- JPH03151213A JPH03151213A JP29063089A JP29063089A JPH03151213A JP H03151213 A JPH03151213 A JP H03151213A JP 29063089 A JP29063089 A JP 29063089A JP 29063089 A JP29063089 A JP 29063089A JP H03151213 A JPH03151213 A JP H03151213A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- hot air
- molded product
- molding
- blow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 28
- 238000007664 blowing Methods 0.000 claims description 24
- 230000003068 static effect Effects 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 15
- 230000008030 elimination Effects 0.000 description 10
- 238000003379 elimination reaction Methods 0.000 description 10
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は成形装置、特に、例えば合成V(磨製の光磁
気ディスク基板製品等の成形装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a molding apparatus, and more particularly to a molding apparatus for, for example, synthetic V (polished magneto-optical disk substrate products).
(従来の技術)
1丁のzlpの成形装置ら二おいて、溶融樹IIi材料
を成Jtq用金へり中に射出。Jf−縮17て成形さ第
1る例えばブンバクトディスク(co)’9の光磁気デ
ィスク製“♂lは、樹脂jJ、板に6でみ苧はこり木1
ごは異物等の汚%:物が少しでも存在すると、記2A/
再生十の欠陥原因となる。(Prior Art) Molten wood IIi material is injected into a forming Jtq metal rim using one ZLP molding device. For example, the magneto-optical disk made by Bunbakuto Disk (CO) '9 is molded with Jf-shrink 17.
Percentage of foreign matter contamination: If there is even a small amount of foreign matter,
Causes ten defects in playback.
このため、成形用金4りまわりの成形環境を清浄化して
、成形直接に成形製品ディスク基板表面にごみ等の異物
が付着することを防1卜するよう、は(d′密閉さ、1
1だ空間内の成形金型上部に清浄空気吹出装置を設け、
この装置から清浄空気を金型上部から下方に向けて吹出
するようにしたvi、J提案が例えば特開昭60−40
222号公報に開示されている。Therefore, in order to clean the molding environment around the molding metal 4 and prevent foreign matter such as dust from adhering to the surface of the molded product disk substrate directly during molding,
A clean air blowing device is installed above the mold in the first space.
For example, in JP-A-60-40, proposals VI and J proposed blowing clean air downward from the upper part of the mold.
It is disclosed in Publication No. 222.
〔発明が解決しようとする:[)
しかしながら、この種のディスク製品の、72 録/肖
牛トの欠陥の発生(d、ディスク基板表面のごみ等の異
物の存在のみでなく、基板の変形等による平面積度のず
れによっても生ずるものてあり、成形装置内の温度環境
によって製品基板の両面に温度差が存在すると静的変形
(反り)がその原因となる。[Solution to be Solved by the Invention: [] However, the occurrence of defects in this type of disk product (d) not only due to the presence of foreign matter such as dust on the surface of the disk substrate, but also due to deformation of the substrate, etc. This can also be caused by a difference in flatness due to the temperature environment inside the molding device, and if there is a temperature difference between both sides of the product substrate due to the temperature environment inside the molding device, static deformation (warpage) becomes the cause.
さらに、 njr記ごみ等の異物の発生は、雰囲気環境
のみによるものでなく、例えば金型の慴動、基板内径部
打抜き(パンチング)、成形品の金型からの取出時に金
型とのこすれ等、成形諸工程自体によって異物を発生す
る9f能性があり、また、静′1゛江的に帯電した基板
に付着すると、この除去は極めて困難となる。Furthermore, the occurrence of foreign substances such as NJR dust is not only caused by the atmospheric environment, but also by sliding of the mold, punching of the inner diameter of the board, rubbing against the mold when taking out the molded product from the mold, etc. The molding process itself has the potential to generate foreign matter, and if it adheres to a statically charged substrate, it is extremely difficult to remove it.
また、以−Lのような雰囲気環境における異物のJf
/E /付着や製品基板の温度差による静的変形等は、
単なる金型成形部分のみでなく、成形品の金型からの取
出時においても発生する可能性がある。In addition, foreign matter Jf in an atmospheric environment such as
/E/ Static deformation due to adhesion or temperature difference on the product board, etc.
This can occur not only in the molded part of the mold, but also when the molded product is taken out of the mold.
しかるに、前記従来提案例にあっては、単に金型部分の
環境空気を清浄化するのみであり、静電的に付着した前
記異物を除去することは不可能であり、また、その吹出
し空気による冷却効果によって金型温度が変化し、成形
基板の前記静的変形が許容限度を越える怖れを生ずる。However, in the conventional proposed example, the environmental air around the mold section is simply purified, and it is impossible to remove the electrostatically attached foreign matter. The cooling effect causes a change in the mold temperature, which may cause the static deformation of the molded substrate to exceed permissible limits.
この発明は、以トのような局面にかんがみてなされたも
ので、従来例の既述の諸問題を解消しIrlるこの種の
成形装置の提供をU的としている。The present invention has been made in view of the above-mentioned situations, and its main purpose is to provide a molding apparatus of this type that solves the problems described above in the conventional example.
このため、この発明においては、成形装置の成形金型及
びこの金型よりの製品取出装置の少くとt)+iif
8、接渚または両名のL方に清浄熱風吹出装置を設け、
それぞれこの金型温度に実質的に等しい温度の清浄熱風
を吹出すよう構成するとバに、1+rl記γ+’t r
′11熱風吹出装Q9iにはそれぞれ吹j1:空気イオ
ン化r9段を取付Ii丁能に構成することにより、Oi
f記目的を達成しようとするものである。Therefore, in this invention, at least t)+iif
8. Install a clean hot air blower on the L side of the shore or both sides,
If the configuration is such that clean hot air is blown out at a temperature substantially equal to the mold temperature, then 1+rl γ+'t r
'11 Hot air blowing equipment Q9i is equipped with nine stages of blowing j1 and air ionization r, respectively.
This aims to achieve the following objectives.
(台用)
以りのような構成により、成形品の温度変化に起因する
静的変形が防止され、また基板表面に付11する異物が
大幅に減少する。(For tables) With the above configuration, static deformation of the molded product due to temperature changes is prevented, and foreign matter 11 attached to the substrate surface is significantly reduced.
以Fに、この発明を実施例に基づいて説明する。第1図
に、この発明に係る成形装置の一実施例の概略構成側面
図、第2図に、その除電清浄熱風吹出装置の概略垂直断
面を示す。Hereinafter, this invention will be explained based on examples. FIG. 1 is a schematic side view of an embodiment of a molding apparatus according to the present invention, and FIG. 2 is a schematic vertical cross-sectional view of the static elimination clean hot air blowing device.
(構成)
第1図において、1は成形用金型で、固定金型Ia及び
iiJ動金型!bとより成る。2はこの発明により、金
型1の上部に配設された清浄熱風吹出装置、Mは、溶融
樹脂材料を供給するための射出成形機を示す。(Structure) In Fig. 1, 1 is a molding die, a fixed die Ia and a movable die iiJ! Consists of b. 2 is a clean hot air blowing device disposed above the mold 1 according to the present invention, and M is an injection molding machine for supplying molten resin material.
(動作)
第2図における清浄熱風吹出装置は、除電用の吹出空気
イオン化用電極7を備えた国側を示す。(Operation) The clean hot air blowing device in FIG. 2 shows the country side equipped with the blowing air ionization electrode 7 for static elimination.
3.6はそわぞれフィルタ、4はヒータ、5は送風機で
ある。取入れ外気Aoはまずフィルタ3により清浄化さ
れ、ヒータ4により金型1と略等しい温度に昇温する。3.6 is a filter, 4 is a heater, and 5 is a blower. The taken-in outside air Ao is first purified by the filter 3, and then heated to approximately the same temperature as the mold 1 by the heater 4.
つぎに送風機5を通過後、slf度フィルタ6で除塵し
たのち、除電用電極7で吹出空気をイオン化させ、除電
清浄熱風Aを金型!のF方から下方に向けて吹出すよう
構成しである。Next, after passing through the blower 5, dust is removed with an SLF filter 6, and the blown air is ionized with a static elimination electrode 7, and the static elimination clean hot air A is sent to the mold! The structure is such that the air is blown downward from the F direction.
(作用)
イオン化された清浄空気の熱風を成形基板に当てること
により、基板両面の温度は実質的に金型温度と同一に保
たれると共に、帯電物の帯電極性と逆極性のイオンが引
付けられ、帯電物表面に付着して帯電が中和されるよう
作用する。この一連の動作により、基板表面の静電気が
除電されて、付着するごみ等の異物を大幅に減少するこ
とができる。(Function) By applying hot blast of ionized clean air to the molded substrate, the temperature on both sides of the substrate is kept substantially the same as the mold temperature, and ions of opposite polarity to the charged object are attracted. It acts to neutralize the charge by adhering to the surface of the charged object. Through this series of operations, static electricity on the surface of the substrate is eliminated, and the amount of foreign matter such as dust attached can be significantly reduced.
(実験例)
以1−の効果を実証するため厚さ=1.12am、直径
=5″のポリカーボネート製光デイスク用基板を、前記
実施例の試作装置により、成形品取出時の金型温度;吹
出除電清浄熱風温度=100℃の条件において成形し、
それぞれ熱風装置及び除電装置の効果を、それらがない
場合と比較検証した結果、第1.2表に示すように効果
を実証する結果が得られた。(Experimental example) In order to demonstrate the effect of 1- below, a polycarbonate optical disk substrate with a thickness of 1.12 am and a diameter of 5'' was prepared using the prototype device of the above example, and the mold temperature at the time of taking out the molded product; Molding is performed under the condition of blowing clean hot air for static elimination at a temperature of 100℃,
As a result of comparing and verifying the effects of the hot air device and the static eliminator with those without them, results were obtained that demonstrated the effects as shown in Table 1.2.
(他の実h)1例)
第31m(a)、(b)に、1111記第1実施例の金
型1部の除;jf清浄熱風吹出装置2に追加して、金型
からの取出装置上部へ別の除電清浄熱風吹出装置2Aを
配設した第2の実施例のそわぞれ概略構成l−面図と側
面とを示し、成形金型1L部の第1の除電清浄熱風吹出
装置2は図示を省略1.てlドす。(Other Act h) 1 Example) In No. 31m (a) and (b), removal of one part of the mold of the first embodiment of Section 1111; addition to the jf clean hot air blowing device 2, and removal from the mold. The schematic configuration of the second embodiment in which another static elimination clean hot air blowing device 2A is arranged in the upper part of the device is shown. 2 is not shown.1. I'm going to do it.
(構成)
図中、Rは、成形金型1の0■動金ヤ1bを移動/開放
して成形基板な取出1−ための取出装置としての口4(
ツトで、J、f、板をつがむためのハントHを備えてい
る。2Aは6.二の取出装置Rの上部に配設さ4−1に
第2の除電清浄熱風吹出装置で、第4図にその11j
u’i断面図を示す。(Structure) In the figure, R represents the opening 4 (as an ejecting device for removing the molded substrate 1 by moving/opening the movable metal layer 1b of the molding die 1).
It has Tsuto, J, F, and Hunt H for holding onto the board. 2A is 6. A second static elimination clean hot air blowing device is installed at 4-1 on the upper part of the second extraction device R, and its 11j is shown in Fig. 4.
A u'i sectional view is shown.
(動イ1/イ1川)
第41Aにおいて、3A、6Aは各フィルタ、4Aはヒ
ータ、5Aは送風機、7Aは除′屈用電極て、1111
記第21mにおける芥構成要素3〜・7にそれぞれ相゛
にし7取人空気A。から吹出除電清浄熱風へに1)る動
作は、前記第1実施例第2図における第1の除、4清浄
熱風吹出装置2で説明した動作ど令〈同様の動作で、熱
風Aを下方の取出装置(ロボット)Rに送るようにした
ものであり、取出装置R及び取出ざわた成形基板に対す
る作用も全く同様である。(Movement A1/I1 River) In No. 41A, 3A and 6A are each filter, 4A is a heater, 5A is a blower, 7A is an electrode for deflection, 1111
Each of the waste components 3 to 7 in No. 21m is combined with 7 torito air A. The operation from 1) to blowing out static-eliminating clean hot air is the same as the operation described in the first removing and clean hot air blowing device 2 in FIG. 2 of the first embodiment. It is designed to be sent to the take-out device (robot) R, and the actions on the take-out device R and the take-out zawata molded substrate are exactly the same.
(実験例)
以I−の構成による金型及び取出装置[一部に干れぞわ
除電清浄熱風吹出装置を備えた装置を試作し、第且実施
例と同様の条件で比較検証実験を行ったところ、第3.
4表に示す結果が得られl、:。(Experiment example) A mold and ejecting device with the configuration of I- below [a device partially equipped with a dry sludge neutralizing cleansing hot air blowing device was prototyped, and a comparative verification experiment was conducted under the same conditions as in the first example. However, the third.
The results shown in Table 4 were obtained:
第4人 成形直接、基板表面にイ・1着している3μm
φ以1−のごみの数・・・・・・111記第1実施例の
第2表に同し。4th person Molding directly, 3 μm attached to the substrate surface
Number of debris with φ or less 1-...Same as Table 2 of 111 First Example.
なお、取出装置RL部における金型1への1μmφ以上
の微小ごみの焼付数は30であり、そわぞれの効果が実
証された。In addition, the number of minute dusts of 1 μmφ or more attached to the mold 1 in the RL portion of the take-out device was 30, demonstrating the effectiveness of each method.
なお、上記各実施例における芥除電清浄熱風吹出装置2
.2Aにおける各フィルタ3,6:3A、6A等の配設
枚数やヒータ4,4A、送風機5,5A:除電用電棒7
,7A等の87構成要素の相対配、没位置関係等は種々
の変形であっても差支えないことはもちろんである。In addition, the dust removal static cleaning hot air blowing device 2 in each of the above embodiments
.. Each filter 3, 6 in 2A: Number of installed filters such as 3A, 6A, heater 4, 4A, blower 5, 5A: Static elimination electric rod 7
, 7A, etc., the relative arrangement, positional relationship, etc. of the 87 components may, of course, be modified in various ways.
以ト、説明したように、清浄熱風吹出装置を少</:も
tへす[一部位r71.1に出装置」一部の双方に配設
することにより、成形品のぬl「変化に起因する静的変
J)ニが防止され、′、した成形品表面に(=1着する
異物を大幅U数少さ1!ることができた。As explained above, by installing clean hot air blowing devices on both sides of the molded product, it is possible to prevent changes in the molded product. The static deformation caused by the molding was prevented, and the number of foreign substances that landed on the surface of the molded product was greatly reduced.
【図面の簡単な説明】
第i1Aは、この発明による成形装置の一実施例の概略
構成側面図、7A2図は、その除電清浄熱風吹出装置の
概略構l−面図、第3図及び第4図は、千わぞわ他の実
施例の第1図及び第2図相当図である。
1・・・・・・成形金型
2.2A・・・・・・(除電)清浄熱風吹出装置7.7
A・・・・・・除電用電棒
(吹出空気イオン化1段)
A・・・・・・(除電)清浄熱風
R・・・・・・取出装置(ロボット)[BRIEF DESCRIPTION OF THE DRAWINGS] No. i1A is a side view of the schematic structure of an embodiment of the molding apparatus according to the present invention, FIG. The figures are equivalent to FIGS. 1 and 2 of Chiwazowa's other embodiments. 1...Molding mold 2.2A...(Static elimination) Cleaning hot air blowing device 7.7
A: Static elimination electric rod (one-stage ionization of blown air) A: (Static neutralization) clean hot air R: Extraction device (robot)
Claims (4)
設けたことを特徴とする成形装置。(1) A molding device characterized in that a clean hot air blowing device is provided above the molding die of the molding device.
を取付けたことを特徴とする請求項1記載の成形装置。(2) The molding apparatus according to claim 1, wherein the clean hot air blowing device is equipped with blowing air ionization means.
らの成形品取出装置の上方にそれぞれ清浄熱風吹出装置
を設けたことを特徴とする成形装置。(3) A molding device characterized in that a clean hot air blowing device is provided above a molding die of the molding device and/or above a device for taking out a molded product from the mold.
オン化手段を取付けたことを特徴とする請求項3記載の
成形装置。(4) The molding apparatus according to claim 3, wherein each of the clean hot air blowing devices is provided with blowing air ionization means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29063089A JPH03151213A (en) | 1989-11-08 | 1989-11-08 | Molding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29063089A JPH03151213A (en) | 1989-11-08 | 1989-11-08 | Molding device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03151213A true JPH03151213A (en) | 1991-06-27 |
Family
ID=17758470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29063089A Pending JPH03151213A (en) | 1989-11-08 | 1989-11-08 | Molding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03151213A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109092558A (en) * | 2017-06-20 | 2018-12-28 | 阿克韦尔股份公司 | For manufacture electrofilter manufacturing method and relevant electrofilter |
-
1989
- 1989-11-08 JP JP29063089A patent/JPH03151213A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109092558A (en) * | 2017-06-20 | 2018-12-28 | 阿克韦尔股份公司 | For manufacture electrofilter manufacturing method and relevant electrofilter |
CN109092558B (en) * | 2017-06-20 | 2022-07-26 | 阿克韦尔公司 | Method for manufacturing an electric filter and associated electric filter |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3501343B2 (en) | Dust removal device | |
US5634230A (en) | Apparatus and method for cleaning photomasks | |
JP5865340B2 (en) | Imprint apparatus and article manufacturing method | |
US6118511A (en) | Manufacturing method of liquid crystal display panel and cleaning apparatus for use therein | |
JP2016031412A (en) | Apparatus and method for washing off adhesive of pellicle of photomask | |
US20090261504A1 (en) | Imprinting method and apparatus therefor | |
US4960141A (en) | Device for cleaning in particular of disc-shaped oxide substrates | |
JPH03151213A (en) | Molding device | |
Cooper et al. | Surface cleaning by electrostatic removal of particles | |
KR100618905B1 (en) | System for removing static electricity and system for taping process by using the same | |
US5421901A (en) | Method and apparatus for cleaning a web | |
JPH11319741A (en) | Method and apparatus for removing dust | |
US5063413A (en) | Removal of excess liquid from an image receptor | |
JP6351438B2 (en) | Plate workpiece cleaning device | |
JPS6226175B2 (en) | ||
JP4418325B2 (en) | XY stage and semiconductor device manufacturing equipment | |
KR200205842Y1 (en) | Sputtering system | |
JP3283847B2 (en) | Rubbing cleaning apparatus and rubbing cleaning method | |
KR0146272B1 (en) | Method for cleaning board using megasonic | |
JP2001002452A (en) | Production of glass substrate | |
KR20010038334A (en) | Dust cleaning process and dust cleaning apparatus | |
JPS61151854A (en) | Optical disk producing device | |
JPH06143140A (en) | Exfoliation of coating | |
TWI420616B (en) | Substrate cleaning apparatus and method for cleaning substrate | |
JPH04177819A (en) | Manufacture of semiconductor device |