JPH031432U - - Google Patents

Info

Publication number
JPH031432U
JPH031432U JP5927589U JP5927589U JPH031432U JP H031432 U JPH031432 U JP H031432U JP 5927589 U JP5927589 U JP 5927589U JP 5927589 U JP5927589 U JP 5927589U JP H031432 U JPH031432 U JP H031432U
Authority
JP
Japan
Prior art keywords
adhesive tape
mount
view
lead frame
heater block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5927589U
Other languages
English (en)
Other versions
JPH0810186Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5927589U priority Critical patent/JPH0810186Y2/ja
Publication of JPH031432U publication Critical patent/JPH031432U/ja
Application granted granted Critical
Publication of JPH0810186Y2 publication Critical patent/JPH0810186Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案による第１の実施例を示す概略
断面図、第２図は第１図中の冷却ユニツトの平面
図、第３図は本考案による第２の実施例を示す概
略断面図、第４図は第３図中の冷却ユニツトの平
面図、第５図は従来のマウント部の概略断面図、
第６図は第５図の平面図である。 １……Ｘ−Ｙテーブル、２……リング、３……
粘着テープ、４……チツプ、５……エアジヤケツ
ト、６……断熱材、７……ヒータブロツク、８…
…リードフレーム、９……ヒータ、１０，２０…
…冷却ユニツト、１０ａ，２０ａ……孔、１１…
…突き上げユニツト、１２……スリツト板、１３
……フオトセンサ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 粘着テープ上に搭載された半導体素子をピツク
    アツプしてヒータブロツク上のリードフレームに
    マウントする装置において、粘着テープの下部に
    エアブローを吹きつけて冷却しながらマウントす
    る手段を有することを特徴としたチツプマウント
    装置。
JP5927589U 1989-05-23 1989-05-23 チップマウント装置 Expired - Lifetime JPH0810186Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5927589U JPH0810186Y2 (ja) 1989-05-23 1989-05-23 チップマウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5927589U JPH0810186Y2 (ja) 1989-05-23 1989-05-23 チップマウント装置

Publications (2)

Publication Number Publication Date
JPH031432U true JPH031432U (ja) 1991-01-09
JPH0810186Y2 JPH0810186Y2 (ja) 1996-03-27

Family

ID=31585627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5927589U Expired - Lifetime JPH0810186Y2 (ja) 1989-05-23 1989-05-23 チップマウント装置

Country Status (1)

Country Link
JP (1) JPH0810186Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077098A (ja) * 2009-09-29 2011-04-14 Disco Abrasive Syst Ltd ダイボンダ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077098A (ja) * 2009-09-29 2011-04-14 Disco Abrasive Syst Ltd ダイボンダ装置

Also Published As

Publication number Publication date
JPH0810186Y2 (ja) 1996-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term