JPH0314060Y2 - - Google Patents

Info

Publication number
JPH0314060Y2
JPH0314060Y2 JP1985097971U JP9797185U JPH0314060Y2 JP H0314060 Y2 JPH0314060 Y2 JP H0314060Y2 JP 1985097971 U JP1985097971 U JP 1985097971U JP 9797185 U JP9797185 U JP 9797185U JP H0314060 Y2 JPH0314060 Y2 JP H0314060Y2
Authority
JP
Japan
Prior art keywords
tip
soldering
heating
ceramic
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985097971U
Other languages
English (en)
Japanese (ja)
Other versions
JPS625682U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985097971U priority Critical patent/JPH0314060Y2/ja
Publication of JPS625682U publication Critical patent/JPS625682U/ja
Application granted granted Critical
Publication of JPH0314060Y2 publication Critical patent/JPH0314060Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1985097971U 1985-06-26 1985-06-26 Expired JPH0314060Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985097971U JPH0314060Y2 (OSRAM) 1985-06-26 1985-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985097971U JPH0314060Y2 (OSRAM) 1985-06-26 1985-06-26

Publications (2)

Publication Number Publication Date
JPS625682U JPS625682U (OSRAM) 1987-01-14
JPH0314060Y2 true JPH0314060Y2 (OSRAM) 1991-03-28

Family

ID=30965470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985097971U Expired JPH0314060Y2 (OSRAM) 1985-06-26 1985-06-26

Country Status (1)

Country Link
JP (1) JPH0314060Y2 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190830A (ja) * 2011-03-08 2012-10-04 Hakko Kk はんだ溶融装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6023998Y2 (ja) * 1979-12-13 1985-07-17 オグラ宝石精機工業株式会社 加熱用圧着子
EP0032437A1 (en) * 1980-01-16 1981-07-22 American Coldset Corporation Thermocompression bonding tool
JPS5671368U (OSRAM) * 1980-11-13 1981-06-12

Also Published As

Publication number Publication date
JPS625682U (OSRAM) 1987-01-14

Similar Documents

Publication Publication Date Title
JP2590450B2 (ja) バンプ電極の形成方法
US5465898A (en) Process for producing a metal-ceramic substrate
CN101599365A (zh) 陶瓷电子部件及其制造方法
JP5445344B2 (ja) 電力用半導体装置
US4908696A (en) Connector and semiconductor device packages employing the same
JP7564607B2 (ja) 温度センサアセンブリ及び温度センサアセンブリを製造する方法
JPH04192596A (ja) 電子部品の表面実装構造
JPH11163501A (ja) 電子部品の実装方法、およびその方法によって製造された電子回路装置
JP4988607B2 (ja) ヒータチップ及び接合装置及び接合方法
JPH0314060Y2 (OSRAM)
JP2018012200A (ja) ヒータチップ及び接合装置及び接合方法
JP2006165181A (ja) 金属部材埋設セラミックス基材の給電端子取付け構造
JP2001068808A (ja) セラミック回路基板
JP3710690B2 (ja) ＳｉＣヒータ
JP2002164461A (ja) セラミック回路基板
JP3236836B2 (ja) 電子装置
JP2002246717A (ja) セラミック回路基板
JPH1140918A (ja) セラミックス素子、部品実装基板及び配線基板
JP4683782B2 (ja) 接触加熱装置
JP4605932B2 (ja) 接触加熱装置
JPS5828362Y2 (ja) ハイブリツド集積回路
JPH0722465A (ja) 半導体装置の実装方法
JP2000151034A (ja) セラミック回路基板
JPS61193473A (ja) 積層回路基板のピンリ−ド
JPH0440291Y2 (OSRAM)