JPH0314060Y2 - - Google Patents
Info
- Publication number
- JPH0314060Y2 JPH0314060Y2 JP1985097971U JP9797185U JPH0314060Y2 JP H0314060 Y2 JPH0314060 Y2 JP H0314060Y2 JP 1985097971 U JP1985097971 U JP 1985097971U JP 9797185 U JP9797185 U JP 9797185U JP H0314060 Y2 JPH0314060 Y2 JP H0314060Y2
- Authority
- JP
- Japan
- Prior art keywords
- tip
- soldering
- heating
- ceramic
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 68
- 238000010438 heat treatment Methods 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 238000005476 soldering Methods 0.000 claims description 39
- 229910052742 iron Inorganic materials 0.000 claims description 34
- 239000000919 ceramic Substances 0.000 claims description 33
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims description 13
- 239000011733 molybdenum Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 9
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 7
- 229910052863 mullite Inorganic materials 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910000833 kovar Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、ICのリード端子等のハンダ付けに
用いられる加熱チツプに関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a heating chip used for soldering IC lead terminals, etc.
（従来の技術）
フラツトパツク形IC等のサーフエイスマウン
ト型電子部品はスルーホールを介さずにプリント
基板上に取り付けられ、そのリード端子はプリン
ト基板の表面にハンダ付けされる。(Prior Art) Surface-mount electronic components such as flat pack ICs are mounted on a printed circuit board without using through holes, and their lead terminals are soldered to the surface of the printed circuit board.
そのような電子部品のハンダ付けを行うための
ツールとして第５図に示すような加熱チツプが知
られている。第５図において、１はモリブデン等
の金属抵抗体からなる加熱チツプであり、ネジ２
ａ，２ｂにより導体に着脱可能に取り付けられ
る。５は加熱チツプ１の発熱温度を測定するため
の熱電対である。 A heating chip as shown in FIG. 5 is known as a tool for soldering such electronic components. In FIG. 5, 1 is a heating chip made of a metal resistor such as molybdenum, and a screw 2
It is detachably attached to the conductor by a and 2b. 5 is a thermocouple for measuring the heat generation temperature of the heating chip 1.
第６図は加熱チツプ１を発熱させる回路の回路
図である。この図において、トランス６は、一次
側に供給される商用周波数またはそれよりも高い
所定周波数の交流電圧E0を降圧して二次側に電
力を供給する。二次側では、導体３，４を介して
加熱チツプ１に電流Ｉが流れると、加熱チツプ１
はジユール発熱または抵抗発熱で発熱する。その
発熱温度は熱電対５の電流ｉとして検出され、こ
の電流ｉはトランス６の一次側に接続された温度
制御装置７に与られる。温度制御装置７は、電流
ｉをモニタすることにより加熱チツプ１の発熱温
度が適正値を維持するように供給電力を制御す
る。 FIG. 6 is a circuit diagram of a circuit that causes the heating chip 1 to generate heat. In this figure, a transformer 6 steps down an AC voltage E 0 of a commercial frequency or a predetermined frequency higher than the commercial frequency supplied to the primary side and supplies power to the secondary side. On the secondary side, when a current I flows through the heating chip 1 via the conductors 3 and 4, the heating chip 1
generates heat due to dure heat or resistance heat. The temperature of the generated heat is detected as a current i of the thermocouple 5, and this current i is applied to a temperature control device 7 connected to the primary side of the transformer 6. The temperature control device 7 monitors the current i and controls the supplied power so that the heat generation temperature of the heating chip 1 is maintained at an appropriate value.
再び第５図において８はフラツトパツク形IC
（FIC）であり、プリント基板９の所定位置に載
置される。図示のようにFIC８の一側部のリード
端子８ａ，８ａ…が加熱チツプ１の下面に対向す
るように位置決めされたなら、加熱チツプ１は導
体３，４に枝持された状態で矢印Ｆ１の方向に降
ろされる。それにより、加熱チツプ１の下面が
FIC８のリード端子８ａ，８ａ…に圧接し、リー
ド端子８ａ，８ａ…の下のプリント配線またはラ
ンドに塗られているハンダが加熱チツプ１により
加熱されて溶解する。しかる後、適当な時間が経
過してハンダが幾らか凝固したなら、加熱チツプ
１は矢印Ｆ２の方向に持ち上げられてリード端子
８ａ，８ａ…から分離し、これによつてプリント
基板へのリード端子８ａ，８ａ…のハンダ付が終
了する。なお第５図において３０は、導体３，４
を分離する絶縁体である。 Again in Figure 5, 8 is a flat pack type IC.
(FIC) and is placed at a predetermined position on the printed circuit board 9. If the lead terminals 8a, 8a, . be lowered in the direction. As a result, the bottom surface of the heating chip 1
The solder applied to the printed wiring or lands under the lead terminals 8a, 8a, . . . of the FIC 8 is heated by the heating chip 1 and melted. After that, after a suitable period of time has passed and the solder has solidified to some extent, the heating chip 1 is lifted in the direction of arrow F2 and separated from the lead terminals 8a, 8a..., thereby connecting the lead terminals to the printed circuit board. Soldering of 8a, 8a... is completed. In addition, in FIG. 5, 30 indicates the conductors 3 and 4.
It is an insulator that separates
（考案が解決しようとする問題点）
上述したような従来の加熱チツプ１では、発熱
体であるモリブデン等の金属抵抗体がコテ先をも
兼ねるため、そのコテ先面（上記の例では下面）
が上記FIC８のリード端子８ａ，８ａ…にような
被ハンダ付部に圧接したときそれに熱を与えるだ
けでなく電圧をも印加して該電子部品（FIC８）
の内部回路に損傷を与える危険性がある。すなわ
ち、加熱チツプ１のコテ先面（下面）には、わず
かではあるが導体３，４からの電流Ｉの一部が流
れて電位分布があり、リード端子８ａ，８ａ…間
に電位差が生じて内部回路に望ましくない電圧が
印加することがある。また、加熱チツプ１のコテ
先面（下面）は高温状態で被ハンダ付部に圧接な
いし当接することにより変形、酸化または磨耗し
たりしてガタツキのある不均一な面になりやす
く、そうなるとFIC８のリード端子８ａ，８ａ…
が均一な圧力で押し付けられなくなつて位置ズレ
を起こすことがある。(Problems to be solved by the invention) In the conventional heating chip 1 as described above, the metal resistor such as molybdenum which is the heating element also serves as the tip of the iron, so the surface of the tip of the iron (the bottom surface in the above example)
When the electronic component (FIC 8) is pressed into contact with the soldered parts such as the lead terminals 8a, 8a, etc. of the FIC 8, it not only applies heat but also applies voltage to the electronic component (FIC 8).
There is a risk of damage to the internal circuits of the device. That is, a small portion of the current I from the conductors 3 and 4 flows through the soldering iron tip (lower surface) of the heating chip 1, causing a potential distribution, and a potential difference is generated between the lead terminals 8a, 8a, . . . Undesirable voltages may be applied to internal circuits. In addition, the soldering tip surface (lower surface) of the heating tip 1 is likely to be deformed, oxidized, or worn by pressing or abutting against the part to be soldered in a high temperature state, resulting in an uneven and uneven surface. Lead terminals 8a, 8a...
may not be pressed with uniform pressure, causing misalignment.
このような問題に関して、実開昭56−71368号
公報には、少なくとも加熱部に電気絶縁性および
対熱性を有する無機物質からなる層を被覆したリ
フローチツプが開示されている。このリフローチ
ツプによれば、被ハンダ付け部と接触するコテ先
面が絶縁性であるため、そこに電位差が発生せ
ず、したがつて電子部品を破壊する危険性は解消
される。しかし、加熱部の導電性金属に絶縁層を
被覆したチツプ構造であるから、ハンダ接合に際
しての加圧時に被ハンダ付け部（端子、リード）
よりの反作用がほとんど直接に加熱部の導電性金
属に作用し、該導電性金属が変形してコテ先面に
ガタツキが生じやすかつた。また、このチツプの
製作において、絶縁被覆は、加熱部の導電性金属
に珪酸ソーダ等を塗布して焼成するか、セラミツ
ク粉末をプラズマ溶射することによつてコーテイ
ングされるが、しかし、均一の厚み（平面性）と
導電性金属膜に対する強固な結合力を得るのが難
しかつた。 Regarding this problem, Japanese Utility Model Application Publication No. 71368/1987 discloses a reflow chip in which at least the heating portion is coated with a layer of an inorganic material having electrical insulation and heat resistance. According to this reflow chip, since the tip of the soldering iron that comes into contact with the part to be soldered is insulating, no potential difference is generated there, and the risk of destroying the electronic component is eliminated. However, since the chip structure has an insulating layer coated on the conductive metal of the heating part, the parts to be soldered (terminals, leads) when pressurized during soldering.
The reaction of twisting almost directly acts on the conductive metal of the heating section, deforming the conductive metal and easily causing wobbling on the tip of the soldering iron. In addition, in manufacturing this chip, the insulating coating is applied by applying sodium silicate or the like to the conductive metal of the heating part and baking it, or by plasma spraying ceramic powder. It was difficult to obtain (flatness) and strong bonding force to the conductive metal film.
なお、実開昭56−89261号公報および実開昭56
−109158号公報には、チツプのコテ先部を板状ま
たは柱状のダイヤモンドで構成することによつて
コテ先部の耐磨耗性、堅牢性を高めた熱圧縮接合
工具および加熱用圧着子がそれぞれ記載されてい
る。しかし、このようなチツプ構造においては、
高温加圧時にダイヤモンド（コテ先部）と金属体
（発熱部）との間に歪が発生し多数回の使用でコ
テ先部が発熱部から剥がれるおそれがあつた。ま
た、ダイヤモンドは天然物はもちろん人工物（合
成多結晶物）でも価格が相当高く、加工も難し
い。 In addition, Utility Model Application Publication No. 56-89261 and Utility Model Application Publication No. 56
Publication No. 109158 discloses a thermocompression welding tool and a heating crimp which have improved abrasion resistance and robustness of the soldering iron tip by configuring the soldering iron tip with plate-like or columnar diamond. Each is listed. However, in such a chip structure,
During high-temperature pressurization, distortion occurred between the diamond (the tip of the iron) and the metal body (the heat generating part), and there was a risk that the tip of the iron would separate from the heat generating part after repeated use. Furthermore, diamonds, both natural and artificial (synthetic polycrystalline), are quite expensive and difficult to process.
本考案は、かかる問題点に鑑みてなされたもの
で、多数回使用されてもコテ先部にガタツキ等の
変形を来さないだけでなく、高温加圧に対してコ
テ先部と発熱部間の結合強度に優れ、加工性・コ
スト性でも有利なハンダ付用加熱チツプを提供す
ることを目的とする。 The present invention was developed in view of these problems, and it not only prevents the iron tip from becoming deformed such as rattling even after being used many times, but also prevents the iron tip and the heat-generating part from being damaged by high-temperature pressurization. The purpose of the present invention is to provide a heating chip for soldering which has excellent bonding strength and is advantageous in terms of workability and cost efficiency.
（問題点を解決するための手段）
上記の目的を達成するため、本考案のハンダ付
用加熱チツプは、金属抵抗体からなる発熱部に熱
伝導率の高い絶縁性部材からなるコテ先部を結合
してなるハンダ付用加熱チツプにおいて、コテ先
部を金属抵抗体の熱膨張率に近似した熱膨張率を
有する板状のセラミツクで形成し、発熱部とコテ
先部との間に金属抵抗体およびセラミツクのそれ
ぞれの熱膨張率に近似した熱膨張率を有する封着
金属体を介在してなる構成とした。(Means for Solving the Problems) In order to achieve the above object, the heating tip for soldering of the present invention has a heating part made of a metal resistor and a soldering iron tip made of an insulating material with high thermal conductivity. In the soldering heating chip formed by bonding, the iron tip is formed of a plate-shaped ceramic having a coefficient of thermal expansion close to that of the metal resistor, and a metal resistor is placed between the heat generating part and the soldering tip. The structure is such that a sealed metal body having a coefficient of thermal expansion approximate to that of the body and the ceramic is interposed.
（作用）
発熱部に電流が供給されると、金属抵抗体が発
熱し、その熱が封着金属体を通つてコテ先部に伝
わる。本考案のチツプでは、封着金属体の熱膨張
率がコテ先部のセラミツクおよび発熱部の金属抵
抗体のそれぞれの熱膨張率に近似しているので、
高温加熱時にそれら３者間に歪を生じることがな
く、このため、コテ先部が発熱部から剥がれるよ
うなことはない。また、コテ先部を板状のセラミ
ツクで構成するので、被ハンダ付部（リード端子
等）より反作用を受けても変形することがなく、
コテ先面にガタツキは生じない。また、セラミツ
クは天然ダイヤモンドはもちろん人工ダイヤモン
ドと比べても格段に安価であり、製作・加工も容
易である。(Function) When a current is supplied to the heat generating part, the metal resistor generates heat, and the heat is transmitted to the soldering iron tip through the sealed metal body. In the chip of the present invention, the coefficient of thermal expansion of the sealed metal body is close to the coefficient of thermal expansion of the ceramic of the soldering iron tip and the metal resistor of the heat generating part.
There is no distortion between these three parts during high temperature heating, and therefore the soldering iron tip does not separate from the heat generating part. In addition, since the iron tip is made of plate-shaped ceramic, it will not deform even if it receives a reaction from the part to be soldered (lead terminal, etc.).
No wobbling occurs on the tip of the iron. Furthermore, ceramics are much cheaper than natural diamonds as well as artificial diamonds, and are easy to manufacture and process.
（実施例）
第１図ないし第４図を参照して本考案の実施例
を説明する。(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1 to 4.
第１図は本考案の一実施例による加熱チツプ１
０を示す。この加熱チツプ１０は、コ字状に形成
されたモリブデンからなる金属抵抗体１２と、ろ
う付け部１４と、モリブデンからなる封着金属体
１６と、ムライトセラミツクからなるセラミツク
板１８とで構成される。 FIG. 1 shows a heating chip 1 according to an embodiment of the present invention.
Indicates 0. This heating chip 10 is composed of a U-shaped metal resistor 12 made of molybdenum, a brazed portion 14, a sealing metal body 16 made of molybdenum, and a ceramic plate 18 made of mullite ceramic. .
この加熱チツプ１０を作るには、先ずムライト
セラミツク板１８にモリブデンを封着して封着金
属体１６を形成する。このような封着は、例えば
モリブデンの微粉末を有機バインダに混合してペ
イント状にしたものをムライトセラミツク板１８
の表面に塗布し、次いで加湿水素または加湿フオ
ーミングガス（H2／N2）中において1300〜1700
℃の温度でモリブデンをメタライズすることによ
り行われる。そして、このようにしてムライトセ
ラミツク板１８に封着された封着金属体１６の表
面（上面）を金属抵抗体１２の下面に、例えば銀
等のろう材（１４）でろう付けすることによつて
発熱チツプ１０が形成される。 To make this heating chip 10, first, molybdenum is sealed to a mullite ceramic plate 18 to form a sealed metal body 16. Such sealing can be done, for example, by mixing fine powder of molybdenum with an organic binder to form a paint onto the mullite ceramic plate 18.
1300-1700 in humidified hydrogen or humidified forming gas (H2/N2).
It is carried out by metallizing molybdenum at a temperature of °C. The surface (upper surface) of the sealed metal body 16 thus sealed to the mullite ceramic plate 18 is then brazed to the lower surface of the metal resistor 12 with a brazing material (14) such as silver. As a result, a heat generating chip 10 is formed.
金属抵抗体１２の上部には、例えば第５図の導
体３，４に接続するための孔１２ａ，１２ｂが設
けられている。而して、金属抵抗体１２には電力
が供給され、そこに電流が流れると抵抗発熱によ
つて熱が発生する。金属抵抗体１２で発生した熱
は、ろう付け部１４と封着金属体１６を介してセ
ラミツク板１８に伝えられる。このセラミツク板
１８はコテ先部を構成し、後述するように被ハン
ダ付部に圧接ないし当接してそれを加熱する。 In the upper part of the metal resistor 12, holes 12a and 12b are provided for connection to the conductors 3 and 4 shown in FIG. 5, for example. Electric power is supplied to the metal resistor 12, and when a current flows there, heat is generated by resistance heat generation. The heat generated by the metal resistor 12 is transferred to the ceramic plate 18 via the brazed portion 14 and the sealed metal body 16. This ceramic plate 18 constitutes the tip of the soldering iron, and as will be described later, presses or comes into contact with the part to be soldered to heat it.
このように加熱チツプ１０が作用するときには
金属抵抗体１２、封着金属体１６、セラミツク板
１８が発熱ないし加熱によつてそれぞれ熱膨張す
るが、それらが剥がれるようなことはない。すな
わち、金属抵抗体１２と封着金属体１６とは共に
モリブデンからなりそれぞれの熱膨張率は等しい
ので両者間に歪みが生じない。また封着金属板１
６のモリブデンの熱膨張率はセラミツク板１８の
ムライトセラミツクの熱膨張率に近いのでセラミ
ツク板１８に無理な歪力がかかることがない。し
たがつて加熱チツプ１０は、高温強度に優れ、急
熱急冷による熱衝撃で容易に剥がれたり割れたり
はしない。 When the heating chip 10 acts in this way, the metal resistor 12, the sealing metal body 16, and the ceramic plate 18 each thermally expand due to heat generation or heating, but they do not peel off. That is, since both the metal resistor 12 and the sealed metal body 16 are made of molybdenum and have the same coefficient of thermal expansion, no distortion occurs between them. Also, the sealed metal plate 1
Since the coefficient of thermal expansion of molybdenum No. 6 is close to that of the mullite ceramic of the ceramic plate 18, no unreasonable strain is applied to the ceramic plate 18. Therefore, the heating chip 10 has excellent high-temperature strength and does not easily peel off or crack due to thermal shock caused by rapid heating and cooling.
第２図は加熱チツプ１０によるFIC８のハンダ
付けを示す。プリント基板９の所定位置に置かれ
たFIC８のリード端子８ａ，８ａ…に対して加熱
チツプ１０が上方の位置から下方すなわち矢印Ｆ
の方向に下降してそのコテ先部１８の下面がリー
ド端子８ａ，８ａ…に圧接してリード端子８ａ，
８ａ…およびそれらの下のプリント配線９ａ，９
ａ…に塗られているクリームハンダ２０，２０…
を加熱し、それによりクリームハンダ２０，２０
…はリード端子８ａ，８ａ…とプリント配線９
ａ，９ａ…とに溶着して両者を結合する。 FIG. 2 shows soldering of the FIC 8 using the heating chip 10. The heating chip 10 is moved downward from the upper position to the lead terminals 8a, 8a, .
The lower surface of the soldering iron tip 18 comes into pressure contact with the lead terminals 8a, 8a, etc., and the lead terminals 8a, 8a...
8a... and printed wiring 9a, 9 below them
Cream solder 20, 20 applied to a...
Heating the cream solder 20,20
...are lead terminals 8a, 8a... and printed wiring 9
a, 9a... to join them together.
このようなハンダ付けにおいて、加熱チツプ１
０の金属抵抗体１２には電流が流れるが、セラミ
ツク板（コテ先部）１８は絶縁体であり、そこに
は電流が流れない。これにより、コテ先部１８の
下面がリード端子８ａに接触してもリード端子８
ａ間に電圧または電位差を生じることがなく、し
たがつてFIC８の内部回路に電気的な障害ないし
影響を与えることがない。また、セラミツク板
（コテ先部１８）は耐熱性が極めて高く、その下
面（コテ先面）が高温度状態でリード端子８ａに
当接してもそれによつて変形したり磨耗すること
がなく、上述のようなハンダ付けを多数回行つて
もガタツキを生ぜず、被ハンダ付部に対して常に
均一な加圧を与える。 In this type of soldering, the heated chip 1
A current flows through the metal resistor 12 of 0, but the ceramic plate (the tip of the soldering iron) 18 is an insulator, and no current flows there. As a result, even if the lower surface of the soldering iron tip 18 comes into contact with the lead terminal 8a, the lead terminal 8a
No voltage or potential difference is generated between the FIC 8 and the internal circuit of the FIC 8. In addition, the ceramic plate (the soldering iron tip 18) has extremely high heat resistance, and even if its lower surface (the soldering iron tip surface) comes into contact with the lead terminal 8a in a high temperature state, it will not be deformed or worn out. Even if such soldering is performed many times, no wobbling occurs, and uniform pressure is always applied to the soldered part.
以上本考案の好適な一実施例を説明したが、本
考案の技術的思想の範囲内で種々の変形、変更が
可能である。例えば、上記実施例では加熱チツプ
１０をコ字状に形成したが、被ハンダ付部の形状
その他の条件に応じて種々の形状が可能であり、
第３図および第４図に他の形状の例を示す。また
上記実施例では金属抵抗体１２としてモリブデン
を用いたが、他の適当な材料、例えばチタンやタ
ングステン等も使用可能である。またセラミツク
板１８、封着金属体１６の材料は、ムライトセラ
ミツクとモリブデンにそれぞれ限定されるもので
はなく、例えばステアタイトセラミツクとコバー
ル、あるいはスピネルセラミツクとニオブ等の他
の適当な封着構体の材料も使用可能である。 Although a preferred embodiment of the present invention has been described above, various modifications and changes can be made within the scope of the technical idea of the present invention. For example, in the above embodiment, the heating chip 10 is formed into a U-shape, but various shapes are possible depending on the shape of the part to be soldered and other conditions.
Examples of other shapes are shown in FIGS. 3 and 4. Further, although molybdenum was used as the metal resistor 12 in the above embodiment, other suitable materials such as titanium, tungsten, etc. can also be used. Further, the materials of the ceramic plate 18 and the sealing metal body 16 are not limited to mullite ceramic and molybdenum, respectively, but other suitable sealing structure materials such as steatite ceramic and Kovar, or spinel ceramic and niobium, etc. is also available.
（考案の効果）
本考案は、上述したような構成を有することに
より、次のような効果を奏する。(Effects of the invention) By having the above-described configuration, the invention has the following effects.
コテ先部の板状のセラミツクで形成するととも
に、金属抵抗体（発熱部）とセラミツク板（コテ
先部）との間に封着金属体を介在させ、それら３
者の熱膨張率を互いに近似した値としたので、高
湿加圧時にコテ先部と発熱部との間に歪が発生す
ることがなく、コテ先部が発熱部から剥がれるお
それはない。また、コテ先部を板状のセラミツク
で構成するので、コテ先面にガタツキ等の変形が
生じることはない。また、セラミツク板は天然ダ
イヤモンドはもちろん人工ダイヤモンドと比べて
も格段で加工性がよいので、経済性および生産性
にもかなつた実用的価値の大なる加圧チツプが得
られる。 The soldering iron tip is made of plate-shaped ceramic, and a sealing metal body is interposed between the metal resistor (heating part) and the ceramic plate (the soldering iron tip).
Since the coefficients of thermal expansion of the iron tip and the heat generating part are set to values similar to each other, there is no distortion between the soldering iron tip and the heat generating part during high humidity and pressurization, and there is no fear that the soldering iron tip will peel off from the heat generating part. Furthermore, since the iron tip is made of plate-shaped ceramic, deformation such as wobbling does not occur on the iron tip surface. Furthermore, since ceramic plates are much easier to work with than natural diamonds or even artificial diamonds, pressurized chips of great practical value that are economical and productive can be obtained.
第１図は、本考案の一実施例による加熱チツプ
の斜視図、第２図は、上記加熱チツプによるフラ
ツトパツク形IC（FIC）のハンダ付けを示す略側
面図、第３図は、上記実施例の変形例を示す斜視
図、第４図は、上記実施例の変形例を示す斜視
図、第５図は、従来の加熱チツプとそれを用いた
フラツトパツク形IC（FIC）のハンダ付けとを示
す斜視図、および第６図は、第５図の加熱チツプ
を発熱させる回路の回路図である。
１０……加熱チツプ、１２……発熱部、１４…
…ろう付け部、１６……封着金属体、１８……セ
ラミツク板。
FIG. 1 is a perspective view of a heating chip according to an embodiment of the present invention, FIG. 2 is a schematic side view showing soldering of a flat pack IC (FIC) using the heating chip, and FIG. 3 is a diagram showing the embodiment of the invention. 4 is a perspective view showing a modification of the above embodiment, and FIG. 5 is a perspective view showing a conventional heating chip and soldering of a flat pack IC (FIC) using the same. The perspective view and FIG. 6 are circuit diagrams of a circuit for generating heat from the heating chip of FIG. 5. 10... Heating chip, 12... Heat generating part, 14...
...Brazing portion, 16...Sealing metal body, 18...Ceramic plate.
Claims (1)
絶縁性部材からなるコテ先部を結合してなるハ
ンダ付用加熱チツプにおいて、 前記コテ先部を前記金属抵抗体の熱膨張率に
近似した熱膨張率を有する板状のセラミツクで
形成し、前記発熱部と前記コテ先部との間に前
記金属抵抗体および前記セラミツクのそれぞれ
の熱膨張率に近似した熱膨張率を有する封着金
属体を介在してなることを特徴とするハンダ付
用加熱チツプ。 (2) 前記金属抵抗体および前記封着金属体はそれ
ぞれモリブデンからなり、前記セラミツク板は
ムライトセラミツクからなる実用新案登録請求
の範囲第１項に記載のハンダ付用加熱チツプ。 (3) 前記発熱部の金属抵抗体はモリブデンからな
り、前記封着金属体はコバールからなり、前記
コテ先部のセラミツク板はステアライトからな
る実用新案登録請求の範囲第１項に記載のハン
ダ付用加熱チツプ。[Claims for Utility Model Registration] (1) A heating chip for soldering comprising a heat generating part made of a metal resistor and a tip made of an insulating material with high thermal conductivity, wherein the tip of the soldering iron is It is formed of a plate-shaped ceramic having a coefficient of thermal expansion that approximates that of the metal resistor, and has a coefficient of thermal expansion that approximates the coefficient of thermal expansion of each of the metal resistor and the ceramic between the heat generating part and the tip of the soldering iron. 1. A heating chip for soldering, characterized in that it is formed by interposing a sealed metal body having a coefficient of thermal expansion. (2) The heating chip for soldering according to claim 1, wherein the metal resistor and the sealing metal body are each made of molybdenum, and the ceramic plate is made of mullite ceramic. (3) The solder according to claim 1, wherein the metal resistor of the heating part is made of molybdenum, the sealing metal body is made of Kovar, and the ceramic plate of the soldering iron tip is made of stearite. Heating tip for attachment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985097971U JPH0314060Y2 (en) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985097971U JPH0314060Y2 (en) | 1985-06-26 | 1985-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625682U JPS625682U (en) | 1987-01-14 |
| JPH0314060Y2 true JPH0314060Y2 (en) | 1991-03-28 |
Family
ID=30965470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985097971U Expired JPH0314060Y2 (en) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314060Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012190830A (en) * | 2011-03-08 | 2012-10-04 | Hakko Kk | Solder melting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56109158A (en) * | 1980-01-16 | 1981-08-29 | American Coldset Corp | Thermoocompression connecting tool |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6023998Y2 (en) * | 1979-12-13 | 1985-07-17 | オグラ宝石精機工業株式会社 | Heating crimp |
| JPS5671368U (en) * | 1980-11-13 | 1981-06-12 |
-
1985
- 1985-06-26 JP JP1985097971U patent/JPH0314060Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56109158A (en) * | 1980-01-16 | 1981-08-29 | American Coldset Corp | Thermoocompression connecting tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS625682U (en) | 1987-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101599365B (en) | Ceramic electronic component and method for manufacturing the same | |
| JP2590450B2 (en) | Method of forming bump electrode | |
| US5465898A (en) | Process for producing a metal-ceramic substrate | |
| JP5445344B2 (en) | Power semiconductor device | |
| US4908696A (en) | Connector and semiconductor device packages employing the same | |
| JPH11163501A (en) | Method for mounting electronic part, and electronic circuit device manufactured there by | |
| JP2009164400A (en) | Heater chip, joining device and joining method | |
| JPH0314060Y2 (en) | ||
| JPH0613726A (en) | Ceramic circuit substrate | |
| JP2018012200A (en) | Heater chip, joint device and joint method | |
| JP2023519499A (en) | Temperature sensor assembly and method of manufacturing temperature sensor assembly | |
| JP2002164461A (en) | Ceramic circuit board | |
| JP2001068808A (en) | Ceramic circuit board | |
| JP2002246717A (en) | Ceramic circuit board | |
| JP3710690B2 (en) | SiC heater | |
| JPH04212277A (en) | Method of connecting terminal to printed wiring board | |
| JP4683782B2 (en) | Contact heating device | |
| JP4325926B2 (en) | Ceramic heater | |
| JP4605932B2 (en) | Contact heating device | |
| JP2576531B2 (en) | Hybrid IC | |
| WO2021229733A1 (en) | Semiconductor device, and manufacturing method for same | |
| JPH02305402A (en) | Resistor and manufacture thereof | |
| JPS5828362Y2 (en) | hybrid integrated circuit | |
| JPH1140918A (en) | Ceramics element, component-mounting board and wiring board | |
| JPH11186689A (en) | Connection structure for wiring boards |