JPH0313743U - - Google Patents
Info
- Publication number
- JPH0313743U JPH0313743U JP1989074670U JP7467089U JPH0313743U JP H0313743 U JPH0313743 U JP H0313743U JP 1989074670 U JP1989074670 U JP 1989074670U JP 7467089 U JP7467089 U JP 7467089U JP H0313743 U JPH0313743 U JP H0313743U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- main body
- lid member
- package
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ceramic Products (AREA)
Description
第1図は本考案の一実施例に係る電子部品用パ
ツケージの縦断面図、第2図は蓋部材の縦断面斜
視図、第3A図から第3D図は蓋部材の製造工程
を示す図、第4図は蓋部材を製造するために用い
られる他の治具を示す図、第5図は従来例の第1
図に相当する図である。
10……パツケージ、11……電子部品、12
……絶縁基体、13……蓋部材、16……面取部
、17……メタライズ層、18……メツキ層、2
0……セラミツクグリンーシート。
FIG. 1 is a vertical cross-sectional view of an electronic component package according to an embodiment of the present invention, FIG. 2 is a vertical cross-sectional perspective view of a lid member, and FIGS. 3A to 3D are diagrams showing the manufacturing process of the lid member. Fig. 4 is a diagram showing another jig used for manufacturing the lid member, and Fig. 5 is a diagram showing the first jig of the conventional example.
FIG. 10...Package, 11...Electronic parts, 12
... Insulating base, 13 ... Lid member, 16 ... Chamfered portion, 17 ... Metallized layer, 18 ... Plating layer, 2
0... Ceramic green sheet.
Claims (1)
ージにおいて、 前記蓋部材は、セラミツクグリーンシートを所
定形状に裁断した後焼成することにより得られる
板状の本体部と、該本体部の一方の主面の周縁部
に形成された金属層と、前記セラミツクグリーン
シートを前記金属層側から裁断することにより前
記本体部の周縁に金属層を有する面取部とを備え
ていることを特徴とする電子部品用パツケージ。[Claims for Utility Model Registration] A package for electronic components comprising an insulating base and a lid member, wherein the lid member includes a plate-shaped main body obtained by cutting a ceramic green sheet into a predetermined shape and then firing it; A metal layer formed on a peripheral edge of one main surface of the main body, and a chamfered part having a metal layer on the peripheral edge of the main body by cutting the ceramic green sheet from the metal layer side. A package for electronic components characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989074670U JPH0313743U (en) | 1989-06-26 | 1989-06-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989074670U JPH0313743U (en) | 1989-06-26 | 1989-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0313743U true JPH0313743U (en) | 1991-02-12 |
Family
ID=31614564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989074670U Pending JPH0313743U (en) | 1989-06-26 | 1989-06-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0313743U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50129281U (en) * | 1974-04-06 | 1975-10-23 | ||
JP2017152598A (en) * | 2016-02-26 | 2017-08-31 | 京セラ株式会社 | Sapphire substrate with metal layer and manufacturing method of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02180053A (en) * | 1988-12-30 | 1990-07-12 | Narumi China Corp | Lead substrate for semiconductor package |
-
1989
- 1989-06-26 JP JP1989074670U patent/JPH0313743U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02180053A (en) * | 1988-12-30 | 1990-07-12 | Narumi China Corp | Lead substrate for semiconductor package |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50129281U (en) * | 1974-04-06 | 1975-10-23 | ||
JP2017152598A (en) * | 2016-02-26 | 2017-08-31 | 京セラ株式会社 | Sapphire substrate with metal layer and manufacturing method of the same |
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