JPH03101538U - - Google Patents

Info

Publication number
JPH03101538U
JPH03101538U JP943390U JP943390U JPH03101538U JP H03101538 U JPH03101538 U JP H03101538U JP 943390 U JP943390 U JP 943390U JP 943390 U JP943390 U JP 943390U JP H03101538 U JPH03101538 U JP H03101538U
Authority
JP
Japan
Prior art keywords
holes
ceramic sheet
cavity
chip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP943390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP943390U priority Critical patent/JPH03101538U/ja
Publication of JPH03101538U publication Critical patent/JPH03101538U/ja
Pending legal-status Critical Current

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Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図ないし第3図は本考案の一実施例に係り
、第1図はその分解斜視図、第2図はシート圧着
工程での断面図、第3図は完成品の断面図である
。第4図および第5図は従来例に係り、第4図は
その分解斜視図、第5図は中間シートの平面図で
ある。 1……ベースシート、2……中間シート、3…
…カバーシート、4……ICチツプ、5……導体
パターン、6……透孔。
1 to 3 relate to one embodiment of the present invention, in which FIG. 1 is an exploded perspective view thereof, FIG. 2 is a cross-sectional view during the sheet compression process, and FIG. 3 is a cross-sectional view of the finished product. 4 and 5 relate to a conventional example, with FIG. 4 being an exploded perspective view thereof, and FIG. 5 being a plan view of an intermediate sheet. 1...Base sheet, 2...Intermediate sheet, 3...
...Cover sheet, 4...IC chip, 5...Conductor pattern, 6...Through hole.

Claims (1)

【実用新案登録請求の範囲】 ベースとなるセラミツクシートに、透孔を有す
るセラミツクシートを圧着して両シートを焼成し
、前記透孔により形成されたキヤビテイ内にIC
チツプを設けたICパツケージにおいて、 前記キヤビテイ用の透孔を円形に形成したこと
を特徴とするICパツケージ。
[Claims for Utility Model Registration] A ceramic sheet with through holes is pressed onto a ceramic sheet serving as a base, and both sheets are fired, and an IC is inserted into the cavity formed by the through holes.
An IC package provided with a chip, characterized in that the through hole for the cavity is formed in a circular shape.
JP943390U 1990-02-01 1990-02-01 Pending JPH03101538U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP943390U JPH03101538U (en) 1990-02-01 1990-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP943390U JPH03101538U (en) 1990-02-01 1990-02-01

Publications (1)

Publication Number Publication Date
JPH03101538U true JPH03101538U (en) 1991-10-23

Family

ID=31513034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP943390U Pending JPH03101538U (en) 1990-02-01 1990-02-01

Country Status (1)

Country Link
JP (1) JPH03101538U (en)

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