JPH03132090A - Double-sided printed wiring board manufacturing method - Google Patents
Double-sided printed wiring board manufacturing methodInfo
- Publication number
- JPH03132090A JPH03132090A JP27112189A JP27112189A JPH03132090A JP H03132090 A JPH03132090 A JP H03132090A JP 27112189 A JP27112189 A JP 27112189A JP 27112189 A JP27112189 A JP 27112189A JP H03132090 A JPH03132090 A JP H03132090A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- printed wiring
- double
- board
- sided printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 238000007639 printing Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000007650 screen-printing Methods 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、両面プリント配線板の製造方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a double-sided printed wiring board.
（従来の技術）
従来、プリント配線板を製造するには、基板の表面に熱
硬化型ソルダーレジストをスクリーン印刷法によりプリ
ントしてきた。しかし、この方法ではにじみ、ブリード
、エツジ切れが生じ、また解像度（プリント精度）が低
い等の問題が発生していた。(Prior Art) Conventionally, in order to manufacture a printed wiring board, a thermosetting solder resist has been printed on the surface of the board by a screen printing method. However, this method has caused problems such as blurring, bleeding, and edge breakage, as well as low resolution (printing accuracy).
この為、高密度、高精度のプリント配線板の要求に対応
することが困難になり、技術的にも限界に達してきた。For this reason, it has become difficult to meet the demands for high-density, high-precision printed wiring boards, and the technology has reached its limits.
一方、近年液状ソルダーレジストを写真現像法により基
板の表面にプリントし、高密度、高精度のプリント配線
板を得ることができるようになった。On the other hand, in recent years, it has become possible to print a liquid solder resist on the surface of a substrate using a photo-development method to obtain a high-density, high-precision printed wiring board.
熱硬化型ソルダーレジストと液状ソルダーレジストは下
記の表に示すような利点や欠点がある。Thermosetting solder resist and liquid solder resist have advantages and disadvantages as shown in the table below.
（以下余白）
（発明が解決しようとする課題）
ところで、プリント配線板によっては、−面に高密度、
高精度の要求されるプリント配線、他面に高密度、高精
度の要求されないプリント配線を備えた両面プリント配
線板が使用されることがある。(The following is a blank space) (Problem to be solved by the invention) By the way, some printed wiring boards have high density or
A double-sided printed wiring board is sometimes used, which has printed wiring that requires high accuracy and printed wiring that does not require high density and high accuracy on the other side.
このような両面プリント配線板は、現在基板の両面に液
状ソルダーレジストを写真現像法によりプリントしてい
る。しかしこの方法は工程が多（て生産性が悪いので、
量産には不向きである。Currently, such double-sided printed wiring boards are produced by printing liquid solder resist on both sides of the board using a photo-developing method. However, this method involves many steps and is low in productivity.
It is not suitable for mass production.
そこで本発明は、上記のような両面プリント配線板を能
率良く生産できる製造方法を提供しようとするものであ
る。Therefore, the present invention aims to provide a manufacturing method that can efficiently produce the double-sided printed wiring board as described above.
（課題を解決するための手段）
」−記課題を解決するための本発明の両面プリント配線
板の製造方法は、基板の一面に液状ソルダーレジストを
写真現像法によりプリントし、基板の他面に熱硬化型ソ
ルダーレジストをスクリーン印刷法によりプリントする
ことを特徴とするものである。(Means for Solving the Problems) A method for manufacturing a double-sided printed wiring board of the present invention to solve the problems described above is to print a liquid solder resist on one side of the board by a photo-development method, and print it on the other side of the board. It is characterized by printing a thermosetting solder resist using a screen printing method.
（作用）
上述の如く本発明の両面プリント配線板の製造方法は、
片面を生産性の良好な熱硬化型ソルダーレジストのスク
リーン印刷法によりプリントし、高密度、高精度を要す
る他の片面を熟練が不要でレジストの修正が不要な液状
ソルダーレジストの写真現像法によりプリントするので
、大量の両面プリント配線板を能率良く安価に製造でき
る。(Function) As described above, the method for manufacturing a double-sided printed wiring board of the present invention includes:
One side is printed using a thermosetting solder resist screen printing method, which has good productivity, and the other side is printed using a liquid solder resist photo-development method, which requires no skill or resist correction, and prints on the other side, which requires high density and high precision. Therefore, a large amount of double-sided printed wiring boards can be manufactured efficiently and at low cost.
（実施例）
本発明の両面プリント配線板の製造方法の実施例を説明
する。基板の一面にチップが表面実装され、他面にラフ
なパターンが形成されるか部分めっきが施される場合、
先ず基板の両面に銅張り積層した後スルホール穴明けを
行い、次に立付無電解銅めっきを施した後電気銅めっき
を施し、次いで写真法により回路を形成した後端子めっ
きを施した。次にこの基板の一面に液状ソルダーレジス
トの写真現像法によりプリントし、他面に熱硬化型ソル
ダーレジストのスクリーン印刷法によりプリントした。(Example) An example of the method for manufacturing a double-sided printed wiring board of the present invention will be described. When a chip is surface mounted on one side of the board and a rough pattern or partial plating is applied on the other side,
First, copper cladding was laminated on both sides of the board, then through-holes were drilled, then vertical electroless copper plating was applied, followed by electrolytic copper plating, and then a circuit was formed using a photographic method, followed by terminal plating. Next, one side of this substrate was printed with a liquid solder resist using a photo development method, and the other side was printed with a thermosetting solder resist using a screen printing method.
その詳細を液状ソルダーレジストの写真現像法によるプ
リントから説明すると、基板の一面を前処理した後、ス
クリーン印刷（又はカーテンコート）によりコーティン
グした。次にセミキュアを行い、冷却する。次いでフィ
ルム位置合わせを行い、露光、現像、コーティングした
。The details will be explained by printing a liquid solder resist using a photo-development method. After one side of the substrate was pretreated, it was coated by screen printing (or curtain coating). Next, semi-cure and cool. The film was then aligned, exposed, developed, and coated.
次にセミキュアを行い冷却した。次いでフィルム位置合
わせを行い、露光、現像、マーキング印刷し、ボストキ
ュアを行った。こうして液状ソルダーレジストの写真現
像法によるプリントを終えた後、文字印刷し、ソルダー
コートを施した。Next, it was semi-cured and cooled. Next, the film was aligned, exposed, developed, printed with markings, and post cured. After completing printing of the liquid solder resist using a photo-development method, letters were printed and a solder coat was applied.
一方熱硬化型ソルダーレジストのスクリーン印刷法によ
るプリントの詳細を説明すると、基板の他面を前処理し
た後、スクリーン印刷を行う。次にセミキュアを行い、
前処理をし、印刷した。次いでセミキュアを行い、マー
キング印刷し、ポストキュアを行った。こうして熱硬化
型ソルダーレジストのスクリーン印刷法によるプリント
を終えた後、文字印刷し、ソルダーコートを施し、外形
を整形した。On the other hand, to explain the details of printing a thermosetting solder resist using a screen printing method, screen printing is performed after the other surface of the substrate is pretreated. Next, do semi-cure,
Preprocessed and printed. Next, semi-curing was performed, markings were printed, and post-curing was performed. After printing the thermosetting solder resist using the screen printing method, letters were printed, a solder coat was applied, and the outer shape was shaped.
かくして両面プリント配線板は、能率良く安価に量産で
きた。In this way, double-sided printed wiring boards could be mass-produced efficiently and inexpensively.
（発明の効果）
以上の説明で判るように本発明の両面プリント配線板の
製造方法は、片面を熱硬化型ソルダーレジストのスクリ
ーン印刷法によりプリントし、他の片面を液状ソルダー
レジストの写真現像法によりプリントするので、高密度
、高精度を要するチップの表面実装に対応でき、また能
率良く安価に製造するのにも対応できる両面プリント配
線板を量産することができるという効果がある。(Effects of the Invention) As can be seen from the above explanation, the method for manufacturing a double-sided printed wiring board of the present invention involves printing on one side using a screen printing method using a thermosetting solder resist, and printing on the other side using a photo-developing method using a liquid solder resist. Since printing is carried out using the method, it is possible to mass-produce double-sided printed wiring boards that can be used for surface mounting of chips that require high density and high precision, and can also be manufactured efficiently and at low cost.
Claims (1)
よりプリントし、基板の他面に熱硬化型ソルダーレジス
トをスクリーン印刷法によりプリントすることを特徴と
する両面プリント配線板の製造方法。1) A method for manufacturing a double-sided printed wiring board, which comprises printing a liquid solder resist on one side of the substrate using a photo-development method, and printing a thermosetting solder resist on the other side of the substrate using a screen printing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27112189A JP2685934B2 (en) | 1989-10-18 | 1989-10-18 | Method for manufacturing double-sided printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27112189A JP2685934B2 (en) | 1989-10-18 | 1989-10-18 | Method for manufacturing double-sided printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03132090A true JPH03132090A (en) | 1991-06-05 |
| JP2685934B2 JP2685934B2 (en) | 1997-12-08 |
Family
ID=17495625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27112189A Expired - Lifetime JP2685934B2 (en) | 1989-10-18 | 1989-10-18 | Method for manufacturing double-sided printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2685934B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999067978A1 (en) * | 1998-06-24 | 1999-12-29 | Vantico Ag | Method for coating printed circuit boards or similar substrates |
-
1989
- 1989-10-18 JP JP27112189A patent/JP2685934B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999067978A1 (en) * | 1998-06-24 | 1999-12-29 | Vantico Ag | Method for coating printed circuit boards or similar substrates |
| US6517895B1 (en) | 1998-06-24 | 2003-02-11 | Vantico Inc. | Method of coating both sides of printed circuit boards having holes |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2685934B2 (en) | 1997-12-08 |
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