JPS612384A - Method of producing ceramic multilayer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a ceramic multilayer wiring board! ! This is a method that improves positioning, especially during screen printing.

[Technical background of the invention and its problems]

Methods for producing metallized ceramic multilayer wiring boards include a sheet lamination method and a printing lamination method. The present invention relates to printed laminations.

Green sheet printed multilayer substrates are used because the green sheet itself shrinks in size by several percent due to sintering (-), so it is not possible to sinter the printed pattern layer by layer like with thick film printed substrates.

After repeating printing and drying of the insulator layer, integral sintering is performed.

Here, alignment during printing of each layer becomes a problem.

Conventionally, the mark for position 16 alignment was placed at a specific location on the board.
For example, they were provided at the four corners, and the screen mask was positioned using these as a reference.

However, this alignment mark is provided in all patterns (2) and printed in multiple layers in all processes (-).As a result, the unsintered board is completed with these four mark parts protruding higher than the top conductor layer. 9. For example, when conducting a continuity test based on capacitance (2. It is too small for alignment.Especially when aligning guia foil patterns, the work is difficult, inaccurate, and inefficient.However, enlarging this mark within a given pattern is Downsizing of the board (-It is uneconomical as it goes backwards.

[Purpose of the invention]

The present invention has been made in consideration of the above points, and an object of the present invention is to provide a method for manufacturing a ceramic multilayer wiring board that can improve alignment accuracy and efficiency during screen printing.

[Summary of the invention]

The present invention provides a method for manufacturing a ceramic multilayer wiring board in which an unsintered board is obtained by printing a second conductor layer and an insulator layer on a ceramic green sheet and cutting out an outer frame portion. This is a method of manufacturing a ceramic multi-wiring board, characterized in that alignment marks are formed and printed.

As shown in (2) Final (- indicates the part that will not remain on the unsintered board (2) Forming alignment marks (2) There will be no protruding parts on the unsintered board on which multilayer wiring is formed. For example, when determining whether a board is good or bad using a C tester that measures capacitance and determines whether the wiring is open or shorted (no problems arise). (=If there is a protrusion, the adhesion will be poor and accurate measurement will be difficult.In addition, if there is a protrusion in the conventional toothpick, it will be difficult to focus the microscope or the like in two steps during wire bonding, resulting in poor efficiency and precision.) However, according to the present invention, there is no risk of this happening.Furthermore, the presence of two protrusions will not encourage the occurrence of warpage after firing, and also supports five warp measurements.
cause trouble.

Also, if it is on the outer frame, even if the mark is made a little larger, the actual density (-) will not have any effect.

Therefore, alignment is improved and its speed is also increased.

〔Effect of the invention〕

As described above, according to the present invention, a method for manufacturing a ceramic multilayer wiring board that can achieve high precision and high speed can be obtained.

[Embodiments of the invention]

Two embodiments of the present invention will be described below.

FIG. 1 is a schematic perspective view showing the printing process.

First, create a master base. This master substrate is for positioning the screen printing mask. A metal plate, green sheet, or resin sheet (for example, 6 Teflon'
Prepare a substrate (1) such as a "sheet" (Fig. 1 (a))
. This substrate (1) is fixed on the printing plate (2) (first
Figure (b)). Fixation is done through the notch (3a) (3
b) (3c) (3d) are supported on the guides (3'a) (3'b) (3'c) (3'd) on the printing plate (2), and Let's do it. Next, screen printing is performed using a reference mask having marks (4) for positioning the screen mask, and the substrate (
1) Print a reference pattern on top. The surface of the base (fl) may be pasted with a pattern or a surface such as blank paper (-).
4) alone, or one of the actual masks used (printed on the green sheet as the printing material). There are two areas (A) corresponding to the outer frame area to be used.

Normally, printing is performed on both sides of the green sheet, so the notches and marks are set in an equal positional relationship (= set) on the X-Y axis (2 pairs) with the origin at the center of the base (1). ) is shown as a (+) mark in the figure, but any symmetrical shape such as a 0) mark may be used.

Next, a second protective layer is provided to cover the printed pattern on the substrate (1). This protective layer is made of xylene, perchlorethylene, trichlorethylene, acetone, etc. For example, vinyl tape, cellophane tape, etc., cannot be damaged even when immersed in an organic solvent such as alcohol.

In this way, a master substrate having a reference pattern, that is, a mark for alignment, is obtained.

Next, the ζ2 printing process will be explained. Figure 2 is a flow diagram of this process.

First, fix the master substrate on the printing plate (2) and align the screen mask. Next, print on this master substrate (2) and check that there is no actual deviation. As mentioned above, the pattern on the master substrate Since it is covered with a protective layer, it can be erased by washing with an organic solvent after printing. Therefore, if a misalignment occurs, after washing, print again and perform alignment.

In this way, by using a master board (=), when printing a large number of sheets, the alignment for the same screen is completed with one setting, making it possible to print very efficiently. .Also, since the position can be checked by actually printing, the accuracy is also good.

After completing the alignment of the screen mask, the master substrate is removed, the green sheet (5) to be printed is fixed on the printing plate, and printing is performed.At this time, the alignment mask (4) is Since it is located in the outer frame area (5a) to be cut out, there is no particular (=protruding) part on the unsintered multi-J-board (5b) that ultimately remains. This situation is shown in Figure 3 f.
It is shown as a perspective view at. Thereafter, after printing on the back side in the same manner, the outer frame area C31) is cut out by a general method such as punching to obtain an unsintered substrate I34 (FIG. 3(b)).

If such a method is used, it is possible to increase the size of the alignment mark without reducing the packaging density, and it is possible to achieve high-speed and high-precision positioning of the screen mask.

In addition, if the mark is formed in a position that remains on the unsintered substrate as in the past, in order to avoid partial protrusion as described above, seal the machining part after aligning the mask. However, there is a time loss due to the peeling of the seal during the printing process and the presence of the overlay process, and the effect of the present invention is that it does not have such problems. .

Further, when printing the conductor layer which is the uppermost layer, an orientation mark such as wire bonding may be provided on the unsintered substrate.

Furthermore, since there are no public protrusions within the substrate, warping during sintering is not promoted. Therefore, the yield of the substrate after sintering is also improved.

[Brief explanation of drawings]

1 and 3 are perspective views for explaining the steps of the method of the present invention, and FIG. 2 is a flow chart. 4... Alignment mark Fig. 1 (b> Fig. 2)

Claims (1)

[Claims] In a method for manufacturing a ceramic multilayer wiring board in which a conductor layer and an insulator layer are printed on a ceramic green sheet and an outer frame portion is cut out to obtain an unsintered board, printing alignment marks are formed on the outer frame portion. A method of manufacturing a ceramic multilayer wiring board, characterized by performing printing.