JPH03122549U - - Google Patents

Info

Publication number
JPH03122549U
JPH03122549U JP1990031396U JP3139690U JPH03122549U JP H03122549 U JPH03122549 U JP H03122549U JP 1990031396 U JP1990031396 U JP 1990031396U JP 3139690 U JP3139690 U JP 3139690U JP H03122549 U JPH03122549 U JP H03122549U
Authority
JP
Japan
Prior art keywords
heat sink
metal
integrated circuit
hybrid integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990031396U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990031396U priority Critical patent/JPH03122549U/ja
Publication of JPH03122549U publication Critical patent/JPH03122549U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例による混成集積回
路装置の断面図、第２図は従来の混成集積回路装
置の断面図である。 図において、１はセラミツク基板、２は半田、
３は放熱板、４は放熱板３とクラツド構造になつ
た緩衝板を示す。なお、図中、同一符号は同一、
又は相当部分を示す。 FIG. 1 is a sectional view of a hybrid integrated circuit device according to an embodiment of this invention, and FIG. 2 is a sectional view of a conventional hybrid integrated circuit device. In the figure, 1 is a ceramic substrate, 2 is solder,
3 is a heat sink, and 4 is a buffer plate having a clad structure with the heat sink 3. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 混成集積回路を形成するセラミツク基板を半田
によりその表面に搭載した金属より成る放熱板に
おいて、その反対側に前記放熱板よりも、硬度が
柔らかい金属をクラツド構造により具備したこと
を特徴とする混成集積回路装置。 A heat sink made of metal, on which a ceramic substrate forming a hybrid integrated circuit is mounted by soldering, and a metal having a softer hardness than the heat sink is provided on the opposite side in a clad structure. circuit device.
JP1990031396U 1990-03-27 1990-03-27 Pending JPH03122549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990031396U JPH03122549U (en) 1990-03-27 1990-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990031396U JPH03122549U (en) 1990-03-27 1990-03-27

Publications (1)

Publication Number Publication Date
JPH03122549U true JPH03122549U (en) 1991-12-13

Family

ID=31534150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990031396U Pending JPH03122549U (en) 1990-03-27 1990-03-27

Country Status (1)

Country Link
JP (1) JPH03122549U (en)

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