JPH02146842U - - Google Patents
Info
- Publication number
- JPH02146842U JPH02146842U JP5498589U JP5498589U JPH02146842U JP H02146842 U JPH02146842 U JP H02146842U JP 5498589 U JP5498589 U JP 5498589U JP 5498589 U JP5498589 U JP 5498589U JP H02146842 U JPH02146842 U JP H02146842U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- sloped
- heat sink
- utility
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Description
第１図および第２図は本考案の一実施例にかか
り、第１図は電子部品を略示した斜視図、第２図
は第１図中の−線断面図である。また、第３
図は回路基板からの熱の拡がりを説明するための
原理図である。
１……ヒートシンク、２，３……回路基板、７
，８……傾斜面。
1 and 2 show an embodiment of the present invention, in which FIG. 1 is a perspective view schematically showing electronic components, and FIG. 2 is a cross-sectional view taken along the - line in FIG. 1. Also, the third
The figure is a principle diagram for explaining the spread of heat from a circuit board. 1...Heat sink, 2, 3...Circuit board, 7
, 8... Inclined surface.
Claims (1)
が形成され、かつ、この各傾斜面上に回路基板が
それぞれ搭載されていることを特徴とする電子部
品。 An electronic component characterized in that at least two sloped surfaces are formed on one surface of a heat sink, and a circuit board is mounted on each sloped surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5498589U JPH02146842U (en) | 1989-05-12 | 1989-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5498589U JPH02146842U (en) | 1989-05-12 | 1989-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146842U true JPH02146842U (en) | 1990-12-13 |
Family
ID=31577537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5498589U Pending JPH02146842U (en) | 1989-05-12 | 1989-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146842U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015191939A (en) * | 2014-03-27 | 2015-11-02 | 三菱電機株式会社 | Semiconductor device and semiconductor device manufacturing method |
-
1989
- 1989-05-12 JP JP5498589U patent/JPH02146842U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015191939A (en) * | 2014-03-27 | 2015-11-02 | 三菱電機株式会社 | Semiconductor device and semiconductor device manufacturing method |