JPH03122542U - - Google Patents

Info

Publication number
JPH03122542U
JPH03122542U JP3122190U JP3122190U JPH03122542U JP H03122542 U JPH03122542 U JP H03122542U JP 3122190 U JP3122190 U JP 3122190U JP 3122190 U JP3122190 U JP 3122190U JP H03122542 U JPH03122542 U JP H03122542U
Authority
JP
Japan
Prior art keywords
chip
wiring board
package
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3122190U
Other languages
English (en)
Other versions
JPH0810201Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990031221U priority Critical patent/JPH0810201Y2/ja
Publication of JPH03122542U publication Critical patent/JPH03122542U/ja
Application granted granted Critical
Publication of JPH0810201Y2 publication Critical patent/JPH0810201Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の上面図、第２図は
第１図のＡ−Ａ線断面図、第３図は従来例の上面
図、第４図は第３図のＢ−Ｂ線断面図である。 １…Ａｕめつき部、２…Ｎｉめつき部、３…Ｃ
ｕ配線、４…ソルダーレジスト、５…プリント配
線基板、６…外部リード端子、７…ＩＣ搭載部、
８…配線回路。

Claims (1)

    【実用新案登録請求の範囲】
  1. プリント配線基板上にＩＣチツプを載せ導電性
    ワイヤによりＩＣチツプと配線基板との電気的接
    続を行ない、ＩＣチツプ上面を樹脂で覆う半導体
    装置用パツケージにおいて、少なくとも樹脂で覆
    われる部分のプリント配線基板上の配線にＮｉめ
    つきおよびＡｕめつきを施すことを特徴とする半
    導体装置用パツケージ。
JP1990031221U 1990-03-27 1990-03-27 半導体装置用パッケージ Expired - Lifetime JPH0810201Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990031221U JPH0810201Y2 (ja) 1990-03-27 1990-03-27 半導体装置用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990031221U JPH0810201Y2 (ja) 1990-03-27 1990-03-27 半導体装置用パッケージ

Publications (2)

Publication Number Publication Date
JPH03122542U true JPH03122542U (ja) 1991-12-13
JPH0810201Y2 JPH0810201Y2 (ja) 1996-03-27

Family

ID=31533963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990031221U Expired - Lifetime JPH0810201Y2 (ja) 1990-03-27 1990-03-27 半導体装置用パッケージ

Country Status (1)

Country Link
JP (1) JPH0810201Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01194428A (ja) * 1988-01-29 1989-08-04 Ibiden Co Ltd チップオンボード

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01194428A (ja) * 1988-01-29 1989-08-04 Ibiden Co Ltd チップオンボード

Also Published As

Publication number Publication date
JPH0810201Y2 (ja) 1996-03-27

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