JPH03120058U - - Google Patents
Info
- Publication number
- JPH03120058U JPH03120058U JP3016490U JP3016490U JPH03120058U JP H03120058 U JPH03120058 U JP H03120058U JP 3016490 U JP3016490 U JP 3016490U JP 3016490 U JP3016490 U JP 3016490U JP H03120058 U JPH03120058 U JP H03120058U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- board
- power supply
- current limiting
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は本考案に係るＬＥＤ発光装置の一実施
例の全体を示しており、Ａはその平面図、Ｂはそ
の断面図である。
１０……ＬＥＤ発光装置、２０……発光部、２
１……リードフレーム、２２……ＬＥＤチツプ、
２３……ランプハウス、２３ａ……反射面、２４
……樹脂モールド部、２５……基板、２６……給
電用リード線、２６ａ……保護部材、２７……保
護カバー、２８……電流制限用抵抗器、２９……
樹脂コーテイング部。
FIG. 1 shows an entire embodiment of an LED light emitting device according to the present invention, where A is a plan view thereof and B is a sectional view thereof. 10...LED light emitting device, 20...light emitting section, 2
1...Lead frame, 22...LED chip,
23... Lamp house, 23a... Reflective surface, 24
... Resin mold part, 25 ... Board, 26 ... Power supply lead wire, 26a ... Protective member, 27 ... Protective cover, 28 ... Current limiting resistor, 29 ...
Resin coating part.
Claims (1)
られたＬＥＤチツプと、該ＬＥＤチツプをランプ
ハウス内に収容した樹脂モールドすることにより
形成される発光部とを備えたＬＥＤ発光装置にお
いて、 上記基板には給電用のリード線と電流制限用の
抵抗とが接続されており、上記リードフレーム、
給電用リード線及び電流制限用抵抗と該基板との
それぞれの接続部が耐熱樹脂でコーテイングされ
ていて、且つ上記ランプハウスの下端部と上記基
板との取付け部を含む装置下部を防水用保護カバ
ーにより被覆したことを特徴とする、ＬＥＤ発光
装置。[Claims for Utility Model Registration] An LED light emitting device comprising an LED chip mounted on a lead frame connected to a substrate, and a light emitting part formed by resin molding the LED chip housed in a lamp house. In the device, a power supply lead wire and a current limiting resistor are connected to the board, and the lead frame,
The connection parts between the power supply lead wire, the current limiting resistor, and the board are coated with heat-resistant resin, and the lower part of the device, including the lower end of the lamp house and the mounting part with the board, is covered with a waterproof protective cover. An LED light emitting device characterized by being coated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3016490U JPH03120058U (en) | 1990-03-22 | 1990-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3016490U JPH03120058U (en) | 1990-03-22 | 1990-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120058U true JPH03120058U (en) | 1991-12-10 |
Family
ID=31532895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3016490U Pending JPH03120058U (en) | 1990-03-22 | 1990-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120058U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS582079A (en) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Light emitting diode lamp and manufacture thereof |
| JPS59197178A (en) * | 1983-04-23 | 1984-11-08 | Idec Izumi Corp | Light-emitting diode lamp |
| JPS6128604A (en) * | 1984-07-18 | 1986-02-08 | 株式会社日立ホームテック | Light emitting display apparatus |
-
1990
- 1990-03-22 JP JP3016490U patent/JPH03120058U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS582079A (en) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Light emitting diode lamp and manufacture thereof |
| JPS59197178A (en) * | 1983-04-23 | 1984-11-08 | Idec Izumi Corp | Light-emitting diode lamp |
| JPS6128604A (en) * | 1984-07-18 | 1986-02-08 | 株式会社日立ホームテック | Light emitting display apparatus |