JPS648761U - - Google Patents

Info

Publication number
JPS648761U
JPS648761U JP1987102920U JP10292087U JPS648761U JP S648761 U JPS648761 U JP S648761U JP 1987102920 U JP1987102920 U JP 1987102920U JP 10292087 U JP10292087 U JP 10292087U JP S648761 U JPS648761 U JP S648761U
Authority
JP
Japan
Prior art keywords
housing
emitting element
conductive member
surface emitting
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987102920U
Other languages
Japanese (ja)
Other versions
JPH0717161Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102920U priority Critical patent/JPH0717161Y2/en
Publication of JPS648761U publication Critical patent/JPS648761U/ja
Application granted granted Critical
Publication of JPH0717161Y2 publication Critical patent/JPH0717161Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の斜視外観構造を示す図
、第２図は本考案実施例の断面構造を示す図、第
３図は従来例の斜視外観構造を示す図、第４図は
従来例の断面構造を示す図である。 １……基板、２……ＬＥＤチツプ、３……ハウ
ジング、３ｃ……格子状部材、４……樹脂モール
ド層。 Fig. 1 is a diagram showing a perspective external structure of an embodiment of the present invention, Fig. 2 is a diagram showing a cross-sectional structure of an embodiment of the invention, Fig. 3 is a diagram showing a perspective external structure of a conventional example, and Fig. 4 is a diagram of a conventional example. It is a figure showing the cross-sectional structure of an example. DESCRIPTION OF SYMBOLS 1... Board, 2... LED chip, 3... Housing, 3c... Grid-like member, 4... Resin mold layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ハウジングに支持された基板上の複数個のＬＥ
Ｄチツプを樹脂モールドしてなる面発光素子にお
いて、上記ハウジングと一体であり且つ上記基板
上でＬＥＤチツプとともに樹脂モールドされた熱
伝導性部材を備え、ＬＥＤチツプの発生する熱が
樹脂モールドを経て熱伝動性部材へ伝導するよう
構成された面発光素子。 Multiple LEs on a board supported by a housing
A surface emitting element formed by resin molding a D chip, which is integrated with the housing and includes a thermally conductive member resin molded together with the LED chip on the substrate, so that the heat generated by the LED chip passes through the resin mold. A surface emitting element configured to conduct electricity to a conductive member.
JP1987102920U 1987-07-03 1987-07-03 Surface emitting element Expired - Lifetime JPH0717161Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102920U JPH0717161Y2 (en) 1987-07-03 1987-07-03 Surface emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102920U JPH0717161Y2 (en) 1987-07-03 1987-07-03 Surface emitting element

Publications (2)

Publication Number Publication Date
JPS648761U true JPS648761U (en) 1989-01-18
JPH0717161Y2 JPH0717161Y2 (en) 1995-04-19

Family

ID=31333272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102920U Expired - Lifetime JPH0717161Y2 (en) 1987-07-03 1987-07-03 Surface emitting element

Country Status (1)

Country Link
JP (1) JPH0717161Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281473A (en) * 2006-04-03 2007-10-25 Ivoclar Vivadent Ag Semiconductor radiation source
JP2007281471A (en) * 2006-04-03 2007-10-25 Ivoclar Vivadent Ag Semiconductor optical radiation source and photocuring device
JP2007281472A (en) * 2006-04-03 2007-10-25 Ivoclar Vivadent Ag Semiconductor radiation source and photocuring device
JP2013045968A (en) * 2011-08-25 2013-03-04 Sumitomo Bakelite Co Ltd Heat generation device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275127A (en) * 1975-12-18 1977-06-23 Matsushita Electric Ind Co Ltd Light source for information reading unit
JPS58185888U (en) * 1982-06-02 1983-12-10 株式会社ケンウッド Panel display using LED elements
JPS61158606A (en) * 1984-12-28 1986-07-18 株式会社小糸製作所 Lighting apparatus
JPS61123555U (en) * 1985-01-19 1986-08-04
JPS6212183U (en) * 1985-07-05 1987-01-24
JPS6292505U (en) * 1985-11-30 1987-06-13
JPS6292504U (en) * 1985-11-30 1987-06-13

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275127A (en) * 1975-12-18 1977-06-23 Matsushita Electric Ind Co Ltd Light source for information reading unit
JPS58185888U (en) * 1982-06-02 1983-12-10 株式会社ケンウッド Panel display using LED elements
JPS61158606A (en) * 1984-12-28 1986-07-18 株式会社小糸製作所 Lighting apparatus
JPS61123555U (en) * 1985-01-19 1986-08-04
JPS6212183U (en) * 1985-07-05 1987-01-24
JPS6292505U (en) * 1985-11-30 1987-06-13
JPS6292504U (en) * 1985-11-30 1987-06-13

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281473A (en) * 2006-04-03 2007-10-25 Ivoclar Vivadent Ag Semiconductor radiation source
JP2007281471A (en) * 2006-04-03 2007-10-25 Ivoclar Vivadent Ag Semiconductor optical radiation source and photocuring device
JP2007281472A (en) * 2006-04-03 2007-10-25 Ivoclar Vivadent Ag Semiconductor radiation source and photocuring device
JP2013045968A (en) * 2011-08-25 2013-03-04 Sumitomo Bakelite Co Ltd Heat generation device

Also Published As

Publication number Publication date
JPH0717161Y2 (en) 1995-04-19

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