JPH0467043U - - Google Patents
Info
- Publication number
- JPH0467043U JPH0467043U JP10884590U JP10884590U JPH0467043U JP H0467043 U JPH0467043 U JP H0467043U JP 10884590 U JP10884590 U JP 10884590U JP 10884590 U JP10884590 U JP 10884590U JP H0467043 U JPH0467043 U JP H0467043U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- wiring board
- main body
- printed wiring
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案によるサーマルヘツドの一実施
例を示す断面図、第２図は本実施例のサーマルヘ
ツドの分解斜視図、第３図は本実施例におけるカ
バーと基台との結合部の構造を示す断面図、第４
図は該実施例におけるサーマルヘツド上の端子と
印刷配線基板の対応端子を示す斜視図、第５図は
第４図の端子どうしを圧接した状態を示す断面図
である。
１……基台、１ａ……凹部、１ｃ……係止受部
、２……カバー、２ａ……溝、２ｂ……係止突起
、３……薄肉部、３ａ……溝、４……サーマルヘ
ツド本体、５……基板、６……発熱体列、７……
ＩＣ、８……端子、９……板材、１０……印刷配
線基板、１０ａ，１０ｂ……突出部、１１，１２
……端子、１３……押圧部材。
FIG. 1 is a sectional view showing an embodiment of the thermal head according to the present invention, FIG. 2 is an exploded perspective view of the thermal head of this embodiment, and FIG. Sectional view showing the structure, No. 4
The figure is a perspective view showing the terminals on the thermal head and the corresponding terminals on the printed wiring board in this embodiment, and FIG. 5 is a sectional view showing the state in which the terminals in FIG. 4 are pressed together. DESCRIPTION OF SYMBOLS 1... Base, 1a... Recessed part, 1c... Locking receiving part, 2... Cover, 2a... Groove, 2b... Locking protrusion, 3... Thin wall part, 3a... Groove, 4... Thermal head main body, 5... board, 6... heating element row, 7...
IC, 8...Terminal, 9...Plate material, 10...Printed wiring board, 10a, 10b...Protrusion, 11, 12
...terminal, 13...pressing member.
Claims (1)
一辺を中心として折り曲げ自在に一体に構成し、
発熱体列を表面に形成したサーマルヘツド本体と
外部接続用印刷配線基板とを、両者の端子が重な
るように一部重ね合わせて前記基台上に配置し、
前記サーマルヘツド本体および印刷配線基板上に
前記カバーを被せ、該カバーと前記基台のいずれ
か一方に設けた係止突起と、他方に設けた係止受
部とを結合することにより、前記カバーに取付け
た押圧部材により前記サーマルヘツド本体と前記
印刷配線基板とを押圧し挟持したことを特徴とす
るサーマルヘツド。 ２ 前記基台のカバー対向面に凹部を設け、その
凹部に前記サーマルヘツド本体と前記印刷配線基
板とを嵌着することにより、サーマルヘツド本体
と、印刷配線基板との端子配設方向の位置を規制
する構造としたことを特徴とする請求項１記載の
サーマルヘツド。[Scope of Claim for Utility Model Registration] 1. A base and a cover are integrally constructed using a synthetic resin molded material so that they can be bent freely around one side,
A thermal head main body having a heating element array formed on its surface and a printed wiring board for external connection are placed on the base in a manner that they are partially overlapped so that their terminals overlap,
The cover is placed over the thermal head main body and the printed wiring board, and the locking protrusion provided on either one of the cover and the base is combined with the locking receiving portion provided on the other. A thermal head characterized in that the thermal head main body and the printed wiring board are pressed and held by a pressing member attached to the thermal head. 2. By providing a recess on the surface of the base facing the cover and fitting the thermal head main body and the printed wiring board into the recess, the positions of the thermal head main body and the printed wiring board in the terminal arrangement direction can be adjusted. The thermal head according to claim 1, characterized in that the thermal head has a regulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10884590U JPH0467043U (en) | 1990-10-17 | 1990-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10884590U JPH0467043U (en) | 1990-10-17 | 1990-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467043U true JPH0467043U (en) | 1992-06-15 |
Family
ID=31855987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10884590U Pending JPH0467043U (en) | 1990-10-17 | 1990-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467043U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |
-
1990
- 1990-10-17 JP JP10884590U patent/JPH0467043U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |